MT48LC16M8A2BB-6A:L TR

IC DRAM 128MBIT PAR 60FBGA
Part Description

IC DRAM 128MBIT PAR 60FBGA

Quantity 614 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerMicron Technology Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package60-FBGA (8x16)Memory FormatDRAMTechnologySDRAM
Memory Size128 MbitAccess Time5.4 nsGradeCommercial
Clock Frequency167 MHzVoltage3V ~ 3.6VMemory TypeVolatile
Operating Temperature0°C ~ 70°C (TA)Write Cycle Time Word Page12 nsPackaging60-FBGA
Mounting MethodVolatileMemory InterfaceParallelMemory Organization16M x 8
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
QualificationN/AECCNEAR99HTS Code8542.32.0002

Overview of MT48LC16M8A2BB-6A:L TR – IC DRAM 128MBIT PAR 60FBGA

The MT48LC16M8A2BB-6A:L TR is a 128 Mbit synchronous DRAM (SDRAM) organized as 16M × 8 with a parallel memory interface in a 60‑FBGA (8 × 16) package. It targets systems requiring synchronous, pipelined DRAM with programmable burst operation and standard SDRAM control.

Key use cases include legacy PC100/PC133-compatible systems and embedded designs that require a single‑supply 3.3 V ±0.3 V SDRAM with predictable timing (167 MHz speed grade available). The device provides standard SDRAM features such as auto refresh, programmable burst lengths and internal bank architecture to support continuous data throughput.

Key Features

  • Memory Core 128 Mbit SDRAM organized as 16M × 8 with internal, pipelined operation and multiple internal banks to hide row access/precharge latency.
  • Synchronous Operation & Timing Fully synchronous SDRAM: signals registered on the positive edge of the system clock. Speed grade -6A supports 167 MHz operation with target 3‑3‑3 timing (RCD/RP/CL = 18 ns).
  • Access & Cycle Times Specified access time of 5.4 ns and a write cycle time (word/page) of 12 ns for predictable read/write performance.
  • Programmable Burst & Refresh Supports programmable burst lengths (1, 2, 4, 8, or full page) plus auto precharge, auto refresh, and self‑refresh modes for managed memory timing and power behavior.
  • Voltage & I/O Single 3.0 V to 3.6 V supply range with LVTTL‑compatible inputs and outputs, suitable for designs using a 3.3 V SDRAM supply.
  • Package & Temperature 60‑ball FBGA (8 × 16) package; commercial operating temperature range 0°C to +70°C (TA).
  • Standards Compatibility PC100- and PC133-compliant options are specified in the device family documentation.

Typical Applications

  • Legacy PC/Platform Memory Use in systems designed for PC100/PC133 SDRAM compliance where a 128 Mbit parallel SDRAM is required.
  • Embedded Systems Memory expansion for embedded controllers and modules that require a 3.3 V synchronous parallel DRAM with burst and refresh control.
  • Consumer and Industrial Electronics Devices operating within the commercial temperature range (0°C to +70°C) that need standard SDRAM features such as auto refresh and programmable bursts.

Unique Advantages

  • Standard SDRAM Architecture: Provides fully synchronous, pipelined operation and internal bank structure to simplify timing management and improve access efficiency.
  • Flexible Burst Support: Programmable burst lengths (1, 2, 4, 8, full page) enable designers to optimize transfers for system bandwidth and latency requirements.
  • Predictable Timing: -6A speed grade rated at 167 MHz with documented RCD/RP/CL timing (3‑3‑3) and an access time specification for reliable system timing margining.
  • Single Supply Simplicity: Operates from a single 3.0 V–3.6 V supply with LVTTL‑compatible I/O for straightforward power and I/O integration.
  • Compact FBGA Package: 60‑ball FBGA (8 × 16) package provides a small footprint option for space‑constrained board designs.

Why Choose IC DRAM 128MBIT PAR 60FBGA?

The MT48LC16M8A2BB-6A:L TR is positioned for applications that need a standard, reliable 128 Mbit SDRAM in a compact FBGA package. Its synchronous pipelined architecture, programmable burst modes and documented timing make it suitable for systems requiring consistent parallel SDRAM performance at 3.3 V supply levels.

This device is appropriate for designers and procurement teams building or maintaining systems that rely on PC100/PC133-class SDRAM timing and require a commercial temperature range. The family documentation provides detailed timing and configuration options to support integration and validation efforts.

If you would like pricing or lead‑time information, request a quote or submit a product inquiry to start the procurement or evaluation process.

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