MT48LC16M8A2BB-7E:G TR
| Part Description |
IC DRAM 128MBIT PAR 60FBGA |
|---|---|
| Quantity | 264 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Micron Technology Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 60-FBGA (8x16) | Memory Format | DRAM | Technology | SDRAM | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 128 Mbit | Access Time | 5.4 ns | Grade | Commercial | ||
| Clock Frequency | 133 MHz | Voltage | 3V ~ 3.6V | Memory Type | Volatile | ||
| Operating Temperature | 0°C ~ 70°C (TA) | Write Cycle Time Word Page | 14 ns | Packaging | 60-FBGA | ||
| Mounting Method | Volatile | Memory Interface | Parallel | Memory Organization | 16M x 8 | ||
| Moisture Sensitivity Level | 2 (1 Year) | RoHS Compliance | ROHS Compliant | REACH Compliance | REACH Unaffected | ||
| Qualification | N/A | ECCN | EAR99 | HTS Code | 8542.32.0002 |
Overview of MT48LC16M8A2BB-7E:G TR – IC DRAM 128MBIT PAR 60FBGA
The MT48LC16M8A2BB-7E:G TR is a 128 Mbit synchronous DRAM (SDRAM) device organized as 16M × 8 with a parallel memory interface. It implements fully synchronous, pipelined SDRAM architecture and is offered in a 60-ball FBGA (8 mm × 16 mm) package.
This device targets systems that require PC100/PC133‑compliant SDRAM operation at a 133 MHz clock frequency and support for standard SDRAM features such as internal banks, programmable burst lengths, and auto refresh. Key value propositions include a compact FBGA package, single 3.3 V supply operation, and timing characteristics suited to PC100/PC133 memory subsystems.
Key Features
- Core / Architecture Fully synchronous SDRAM with internal, pipelined operation and internal banks for row access/precharge management.
- Memory Organization & Capacity 128 Mbit capacity organized as 16M × 8 with 4 internal banks.
- Performance / Timing PC100- and PC133-compliant operation with a specified clock frequency of 133 MHz, access time listed as 5.4 ns, and a write cycle time (word page) of 14 ns.
- Programmable Burst & Modes Programmable burst lengths (1, 2, 4, 8, or full page), auto precharge and auto refresh functionality, and both standard and low power self‑refresh modes (low power not available on AT devices per datasheet).
- Refresh Auto Refresh support including 64 ms / 4096-cycle refresh (commercial) per datasheet specifications.
- Interface & I/O Parallel memory interface with LVTTL-compatible inputs and outputs as described in the datasheet.
- Power Single supply operation at 3.3 V ±0.3 V (nominal 3.0 V to 3.6 V supply range).
- Package & Temperature 60-ball FBGA (8 mm × 16 mm) package; operating temperature range 0°C to +70°C (TA).
Typical Applications
- PC100/PC133 memory subsystems — Use where PC100- or PC133‑compliant SDRAM devices are required for synchronous parallel memory operations.
- Embedded systems with parallel SDRAM — Suitable for designs requiring a 128 Mbit, 16M×8 SDRAM in a compact 60‑FBGA package.
- Systems requiring standard SDRAM features — Systems that rely on programmable burst lengths, auto precharge/refresh, and self‑refresh modes for memory management.
Unique Advantages
- PC100/PC133 compatibility: Ensures timing compatibility with PC100 and PC133 SDRAM systems as documented in the datasheet.
- Compact FBGA package: 60-ball FBGA (8×16 mm) provides a small-footprint option for space-constrained board designs.
- Synchronous, pipelined operation: Fully synchronous design with registered inputs on the positive clock edge and pipelined internal operation for predictable timing behavior.
- Standard refresh and self-refresh support: Auto refresh (64 ms / 4096 cycles) and self‑refresh modes help maintain data integrity during varying operating conditions.
- Single 3.3 V supply: Operates from a standard 3.3 V ±0.3 V supply, simplifying power-rail requirements.
Why Choose IC DRAM 128MBIT PAR 60FBGA
The MT48LC16M8A2BB-7E:G TR delivers a documented 128 Mbit SDRAM solution with PC100/PC133 timing compatibility, programmable burst operation, and standard SDRAM refresh/self‑refresh capabilities in a compact 60‑FBGA package. Its 16M × 8 organization, 133 MHz clock rating, and 3.0–3.6 V supply range make it suitable for designs that require synchronous parallel DRAM with predictable timing behavior.
This device is appropriate for engineers specifying SDRAM for commercial-temperature systems (0°C to +70°C) that require the standard SDRAM feature set and a small-board footprint. The datasheet-provided timings and mode options support integration into existing SDRAM subsystems that expect PC100/PC133-compliant parts.
Request a quote or submit an inquiry for pricing and availability of the MT48LC16M8A2BB-7E:G TR to receive lead-time and purchasing information tailored to your project needs.