MT48LC16M8A2FB-75 IT:G TR

The MT48LC16M8A2FB-75 IT:G TR is a 128Mbit synchronous DRAM device organized as 16M × 8 with a parallel memory interface and a 60-ball FBGA package. It implements SDR SDRAM architecture and is PC100- and PC133-compliant for systems requiring standard SDRAM timing and operation.

This device targets systems requiring a compact, industrial-temperature memory solution operating from a single 3.3V supply, offering pipelined, fully synchronous operation and programmable burst lengths for flexible data transfer patterns.

Key Features

• SDR SDRAM core Fully synchronous single-data-rate SDRAM architecture with registered signals on the positive edge of the system clock.
• Memory organization & capacity 128 Mbit capacity arranged as 16M × 8 with internal four-bank architecture for row access hiding and concurrent operations.
• Performance PC100- and PC133-compliant timing; specified clock frequency up to 133 MHz for the -75 speed grade and access time listed as 5.4 ns.
• Programmable burst and pipelined operation Internal pipelined operation with programmable burst lengths (1, 2, 4, 8, or full page) and column-address change every clock cycle.
• Refresh and power modes Auto refresh and self refresh modes supported; 4096-cycle refresh (64 ms for commercial/industrial), with standard and low-power self-refresh options noted in the datasheet.
• I/O and voltage LVTTL-compatible inputs/outputs and single 3.3 V ±0.3 V power supply (3.0 V–3.6 V specified).
• Timing options Speed-grade -75 corresponds to 133 MHz with target timing of 3-3-3 (RCD-RP-CL), CL and RCD/RP timing reflected in the datasheet timing table.
• Package and temperature 60-ball FBGA (60-FBGA, 8 mm × 16 mm) package; industrial operating temperature range –40°C to +85°C (TA).

Typical Applications

• Legacy PC and embedded memory subsystems Suitable for systems designed to PC100/PC133 SDRAM timing where a 128Mbit parallel SDRAM device is required.
• Industrial control systems Industrial temperature rating (–40°C to +85°C) supports memory needs in industrial electronics and embedded controllers.
• Memory expansion for legacy platforms Parallel SDRAM organization (16M × 8) and FBGA packaging fit designs that use standard SDRAM modules and compact BGA footprints.

Unique Advantages

• Standards-aligned timing: PC100 and PC133 compliance simplifies integration into systems designed around those SDRAM specifications.
• Flexible data transfer: Programmable burst lengths and pipelined internal operation enable adaptable throughput patterns to match system bandwidth needs.
• Industrial temperature support: –40°C to +85°C operating range addresses harsher environments without additional thermal qualification notes.
• Compact BGA footprint: 60-ball FBGA (8 mm × 16 mm) package provides a space-efficient physical solution for high-density board designs.
• Single-supply operation: 3.3 V ±0.3 V supply simplifies power-rail design in systems using standard 3.3 V rails.

Why Choose IC DRAM 128MBIT PAR 60FBGA?

IC DRAM 128MBIT PAR 60FBGA (MT48LC16M8A2FB-75 IT:G TR) delivers a standard SDR SDRAM solution with a 16M × 8 organization and PC100/PC133-compatible timing, making it suitable for designs that require a compact, parallel SDRAM device with industrial temperature capability. The combination of pipelined operation, programmable burst lengths, and a single 3.3 V supply supports a wide range of legacy and embedded memory architectures.

This part is appropriate for engineers specifying parallel SDRAM where verified timing, refresh behavior, and an FBGA package are required. The device’s documented timing options and industrial temperature rating provide clear, verifiable parameters for system integration and long-term deployment.

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