MTFC4GLDEA-0M WT
| Part Description |
IC FLASH 32GBIT MMC 153WFBGA |
|---|---|
| Quantity | 1,108 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Micron Technology Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 153-WFBGA (11.5x13) | Memory Format | FLASH | Technology | FLASH - NAND | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 32 Gbit | Access Time | N/A | Grade | Industrial | ||
| Clock Frequency | N/A | Voltage | 1.65V ~ 3.6V | Memory Type | Non-Volatile | ||
| Operating Temperature | -25°C ~ 85°C (TA) | Write Cycle Time Word Page | N/A | Packaging | 153-WFBGA | ||
| Mounting Method | Non-Volatile | Memory Interface | MMC | Memory Organization | 4G x 8 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Qualification | N/A | ECCN | 3A991B1A | HTS Code | 8542.32.0071 |
Overview of MTFC4GLDEA-0M WT – IC FLASH 32GBIT MMC 153WFBGA
The MTFC4GLDEA-0M WT is a 32 Gbit e•MMC™ embedded flash memory device from Micron Technology Inc., integrating an MMC controller with NAND Flash in a single package. It uses NAND Flash technology with a 4G × 8 memory organization and provides an MMC interface for host connectivity.
Designed for embedded storage applications that require on-board MMC-compatible memory, the device offers boot support, secure partitions and configurable reliability features while operating across a wide voltage and temperature range.
Key Features
- Core Memory – 32 Gbit NAND Flash organized as 4G × 8; e•MMC architecture combines MMC controller and NAND in one device.
- MMC Interface & Protocol – JEDEC/MMC standard version 4.41-compliant; supports MMC mode, MMCplus™ and MMCmobile™ protocols, with x1, x4 and x8 I/O selectable by the host and a 52 MHz maximum clock.
- Performance (MLC partition) – Typical sequential read up to 30 MB/s and sequential write up to 6.6 MB/s for this part series; random read/write performance listed in datasheet (random read ~1080 IOPS, random write ~90 IOPS for the listed group).
- Power and Voltage – Voltage supply range: 1.65 V to 3.6 V. Datasheet notes VCC: 2.7–3.6 V and VCCQ (dual voltage) options of 1.65–1.95 V or 2.7–3.6 V. Typical standby current (4 GB device): ~120 µA; active current (RMS): ~80 mA.
- Security & Boot – Boot operation (high-speed boot) and Replay-Protected Memory Block (RPMB) support; secure erase, temporary and permanent write protection, and multiple partition support with enhanced attributes.
- Reliability & Management – On-device ECC and block management, enhanced reliable write, configurable reliability settings and background operation for sustained data integrity.
- Advanced Features – DDR function support, high-priority interrupt (HPI), hardware reset signal, trim, and erase/write protection command classes per MMC standard.
- Package & Mechanical – 153-ball WFBGA package (11.5 mm × 13.0 mm × 0.8 mm) for compact board-level integration.
- Environmental Range – Operating temperature range: –25 °C to +85 °C; storage temperature: –40 °C to +85 °C.
Typical Applications
- Embedded Systems – On-board MMC storage for system firmware, file systems and general-purpose non-volatile storage where an integrated MMC solution simplifies design.
- Boot Media – High-speed boot operation support makes the device suitable as primary boot storage for embedded platforms.
- Secure Data Storage – RPMB and partitioning features enable secure credential or sensitive-data storage within embedded products.
- Mobile and Portable Devices – Support for MMCmobile™ protocols and selectable I/O widths (x1/x4/x8) adapts to host interface requirements in portable designs.
Unique Advantages
- Integrated MMC Controller and NAND – Reduces host-side controller requirements by delivering a combined MMC controller and NAND Flash in one device.
- Flexible Voltage Support – Broad VCC/VCCQ voltage options (1.65–3.6 V range; VCCQ dual-voltage modes) accommodate diverse platform power domains.
- Compact, High-Density Package – 153-ball WFBGA (11.5 × 13.0 mm) provides 32 Gbit capacity in a small footprint for space-constrained boards.
- Configurable Reliability – On-device ECC, block management and configurable reliability settings support long-term data integrity and maintenance operations.
- Boot and Security Capabilities – Built-in high-speed boot, secure erase and RPMB features simplify secure platform initialization and protected storage use cases.
- Low Standby Power – Typical standby current (~120 µA for the 4 GB device) helps minimize idle power draw in battery-powered or always-on applications.
Why Choose IC FLASH 32GBIT MMC 153WFBGA?
The MTFC4GLDEA-0M WT delivers an integrated e•MMC solution combining NAND Flash and an MMC controller to provide compact, managed non-volatile storage with security and boot capabilities. With a broad voltage range, selectable I/O widths, and on-device reliability features, it is suited for designs that need embedded MMC-compatible storage with configurable protection and performance characteristics.
This device is appropriate for engineers building embedded platforms, portable devices or systems that require on-board boot and secure storage while maintaining a small PCB footprint and controlled power consumption. Its package and operating temperature range support deployment across a variety of board-level applications.
Please request a quote or submit a pricing inquiry to obtain availability and volume pricing for the MTFC4GLDEA-0M WT.