MTFC4GLGDM-AIT A
| Part Description |
IC FLASH 32GBIT MMC 153TFBGA |
|---|---|
| Quantity | 831 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Micron Technology Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 153-TFBGA (11.5x13) | Memory Format | FLASH | Technology | FLASH - NAND | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 32 Gbit | Access Time | N/A | Grade | Industrial | ||
| Clock Frequency | N/A | Voltage | 2.7V ~ 3.6V | Memory Type | Non-Volatile | ||
| Operating Temperature | -40°C ~ 85°C (TA) | Write Cycle Time Word Page | N/A | Packaging | 153-TFBGA | ||
| Mounting Method | Non-Volatile | Memory Interface | MMC | Memory Organization | 4G x 8 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Qualification | N/A | ECCN | OBSOLETE | HTS Code | 8542.32.0071 |
Overview of MTFC4GLGDM-AIT A – 32Gbit MMC NAND Flash, 153-TFBGA
The MTFC4GLGDM-AIT A is a 32 Gbit non-volatile FLASH NAND memory device with an MMC interface, supplied by Micron Technology Inc. It delivers high-density embedded storage in a compact 153-TFBGA package for designs that require solid-state data and firmware storage.
Key value comes from its 32 Gbit capacity, MMC interface for host connectivity, wide operating voltage range, and extended ambient temperature capability, enabling integration into systems with constrained board space and varied environmental conditions.
Key Features
- Memory Type: Non-volatile FLASH NAND memory providing persistent data storage without power.
- Capacity & Organization: 32 Gbit capacity organized as 4G × 8, suitable for high-density embedded storage needs.
- Interface: MMC memory interface for host connectivity and system integration.
- Power: Operates from a 2.7 V to 3.6 V supply range, accommodating common embedded power domains.
- Package: 153-TFBGA package with 11.5 × 13 mm body dimensions for compact board-level integration.
- Temperature Range: Rated for operation from −40 °C to 85 °C (TA), supporting applications across a wide ambient temperature span.
Typical Applications
- Embedded Storage: Compact onboard flash storage for systems requiring 32 Gbit of non-volatile memory via MMC interface.
- Firmware and Boot: Persistent storage for firmware, boot images, and system code in host-controlled MMC configurations.
- Multimedia Data Storage: Storage of media and user data where high-density NAND flash is needed in a small package.
- Industrial Devices: Use in equipment operating across −40 °C to 85 °C where robust temperature tolerance is required.
Unique Advantages
- High-density 32 Gbit capacity: Enables substantial data and firmware storage without larger or multiple devices.
- MMC interface: Simplifies integration with hosts that support MMC, reducing interface complexity.
- Wide supply voltage window: 2.7 V to 3.6 V operation increases compatibility with common embedded power rails.
- Compact TFBGA package: 153-TFBGA (11.5 × 13 mm) minimizes board footprint while delivering high capacity.
- Extended operating temperature: −40 °C to 85 °C rating supports deployment in varied ambient conditions.
Why Choose IC FLASH 32GBIT MMC 153TFBGA?
IC FLASH 32GBIT MMC 153TFBGA (MTFC4GLGDM-AIT A) is positioned for designs that need a high-capacity MMC NAND flash solution in a small footprint with a broad operating voltage and temperature range. Its specification set makes it suitable for embedded systems requiring persistent storage, firmware retention, and media storage where board space and environmental tolerance are important.
Backed by Micron Technology Inc., this 32 Gbit FLASH device offers a straightforward integration path for engineers and procurement teams seeking a robust, high-density memory component with defined electrical and mechanical attributes.
Request a quote or submit an inquiry to discuss availability, pricing, and lead times for MTFC4GLGDM-AIT A.
