MTFC4GLGDM-AIT Z

IC FLASH 32GBIT MMC 153TFBGA
Part Description

IC FLASH 32GBIT MMC 153TFBGA

Quantity 1,765 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerMicron Technology Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package153-TFBGA (11.5x13)Memory FormatFLASHTechnologyFLASH - NAND
Memory Size32 GbitAccess TimeN/AGradeIndustrial
Clock FrequencyN/AVoltage2.7V ~ 3.6VMemory TypeNon-Volatile
Operating Temperature-40°C ~ 85°C (TA)Write Cycle Time Word PageN/APackaging153-TFBGA
Mounting MethodNon-VolatileMemory InterfaceMMCMemory Organization4G x 8
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
QualificationN/AECCN3A991B1AHTS Code8542.32.0071

Overview of MTFC4GLGDM-AIT Z – IC FLASH 32GBIT MMC 153TFBGA

The MTFC4GLGDM-AIT Z is a 32 Gbit non-volatile FLASH memory device from Micron Technology Inc.'s e•MMC™ series. It implements NAND flash organized as 4G × 8 with an MMC memory interface for onboard storage integration.

Designed for systems that require compact, high-capacity removable-style storage, this device combines a 153-TFBGA (11.5 × 13 mm) package with a wide operating voltage range and industrial-temperature capability to simplify board-level integration.

Key Features

  • Memory: 32 Gbit capacity organized as 4G × 8, providing substantial non-volatile storage in a single device.
  • Technology: FLASH – NAND technology for persistent data retention without power.
  • Interface: MMC memory interface for standardized on-board storage connectivity.
  • Power: Supply voltage range of 2.7 V to 3.6 V to accommodate common system power rails.
  • Package: 153-TFBGA package with supplier device package dimensions 11.5 × 13 mm for compact PCB footprint.
  • Temperature Range: Operating ambient temperature from −40°C to 85°C (TA) for extended environmental use.

Typical Applications

  • Embedded storage systems — Provides 32 Gbit non-volatile storage over an MMC interface for firmware, file systems or content storage in embedded designs.
  • Consumer electronics — Compact TFBGA package and standard MMC interface enable integration into space-constrained consumer devices requiring onboard flash capacity.
  • Industrial equipment — Operating temperature range of −40°C to 85°C supports deployment in industrial environments that require NAND-based non-volatile memory.

Unique Advantages

  • High capacity in a single device: 32 Gbit memory reduces the need for multiple components to achieve similar storage size.
  • Standard MMC interface: Simplifies integration with host controllers that support MMC connectivity.
  • Wide supply voltage range: 2.7 V to 3.6 V compatibility eases power-rail design and integration.
  • Compact package footprint: 153-TFBGA (11.5 × 13 mm) helps minimize PCB area for space-constrained designs.
  • Extended operating temperature: −40°C to 85°C rating supports deployment across a broad range of environmental conditions.

Why Choose IC FLASH 32GBIT MMC 153TFBGA?

The MTFC4GLGDM-AIT Z offers a straightforward building block for designs that need 32 Gbit of NAND flash accessible via an MMC interface. Its combination of capacity, standard interface, compact 153-TFBGA packaging, and support for a 2.7 V–3.6 V supply and −40°C to 85°C operation makes it suitable for engineers seeking integrated, board-level non-volatile storage.

This device is appropriate for designs where a single-component flash solution simplifies bill of materials and layout while providing a known set of electrical and environmental parameters for system-level planning.

Request a quote or contact sales for pricing, availability and technical assistance with integrating the MTFC4GLGDM-AIT Z into your design.

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