MTFC4GLGDM-AIT Z TR

IC FLASH 32GBIT MMC 153TFBGA
Part Description

IC FLASH 32GBIT MMC 153TFBGA

Quantity 892 Available (as of May 4, 2026)
Product CategoryMemory
ManufacturerMicron Technology Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package153-TFBGA (11.5x13)Memory FormatFLASHTechnologyFLASH - NAND
Memory Size32 GbitAccess TimeN/AGradeIndustrial
Clock FrequencyN/AVoltage2.7V ~ 3.6VMemory TypeNon-Volatile
Operating Temperature-40°C ~ 85°C (TA)Write Cycle Time Word PageN/APackaging153-TFBGA
Mounting MethodNon-VolatileMemory InterfaceMMCMemory Organization4G x 8
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
QualificationN/AECCN3A991B1AHTS Code8542.32.0071

Overview of MTFC4GLGDM-AIT Z TR – IC FLASH 32GBIT MMC 153TFBGA

The MTFC4GLGDM-AIT Z TR is a 32 Gbit non-volatile FLASH memory device using NAND technology with an MMC memory interface. It provides 4G × 8 memory organization in a compact 153‑TFBGA package (11.5×13 mm).

This device targets designs that require board-level embedded storage with a standard MMC interface, a wide operating temperature range, and a 2.7 V to 3.6 V supply window.

Key Features

  • Memory Technology NAND FLASH non-volatile memory formatted as FLASH with a total capacity of 32 Gbit.
  • Memory Organization 4G × 8 organization suitable for MMC-formatted storage.
  • Interface MMC memory interface for integration into systems that support MMC connectivity.
  • Voltage Supply Operates from 2.7 V to 3.6 V, enabling compatibility with common 3.3 V systems.
  • Package 153‑TFBGA package, footprint 11.5×13 mm, suitable for compact board-level placement.
  • Operating Temperature Specified for –40°C to 85°C (TA), supporting a broad ambient temperature range.

Typical Applications

  • Embedded Storage Use as board-mounted non-volatile storage where a 32 Gbit MMC-formatted NAND is required.
  • Compact Systems Designs with limited PCB area that benefit from the 153‑TFBGA (11.5×13 mm) package.
  • Temperature-Scoped Equipment Electronic systems that operate within –40°C to 85°C and need reliable NAND flash memory.

Unique Advantages

  • Substantial Storage Capacity: 32 Gbit of NAND FLASH provides significant on-board non-volatile storage for MMC applications.
  • Standard MMC Interface: MMC compatibility simplifies integration into systems that support the MMC protocol.
  • Wide Supply Range: 2.7 V to 3.6 V operation allows use in a variety of 3.3 V-system designs.
  • Compact BGA Footprint: 153‑TFBGA (11.5×13 mm) package supports dense, space-constrained PCB layouts.
  • Extended Ambient Range: Rated for –40°C to 85°C (TA) to accommodate a broad range of environmental conditions.

Why Choose MTFC4GLGDM-AIT Z TR?

The MTFC4GLGDM-AIT Z TR combines 32 Gbit NAND FLASH memory with an MMC interface in a compact 153‑TFBGA package, delivering a board-level storage option for systems that require non-volatile memory, a standard MMC interface, and a wide operating temperature range. Its 2.7 V to 3.6 V supply range and 4G × 8 organization make it suitable for designs built around MMC-formatted NAND storage.

This device is well suited to engineers and procurement teams specifying embedded storage where package density, operating temperature range, and MMC interface compatibility are key selection criteria.

Request a quote or contact sales to obtain pricing, lead-time, and availability information for MTFC4GLGDM-AIT Z TR.

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