MTFC4GLDEA-0M WT TR

The MTFC4GLDEA-0M WT TR is a Micron e•MMC™ embedded flash memory device that combines a MultiMediaCard (MMC) controller with NAND flash in a single 153-ball WFBGA package (11.5 × 13 mm). It provides 32 Gbit of non-volatile NAND storage organized as 4G × 8 and supports MMC mode operation.

Designed for systems that require an integrated MMC interface and managed NAND features, this device delivers MMC protocol capabilities, partitioning and security features, and an operating range suitable for applications with ambient temperatures between −25°C and +85°C.

Key Features

• Memory Type  Non-volatile NAND flash (FLASH - NAND) with 32 Gbit capacity and a 4G × 8 memory organization.
• e•MMC Integration  MultiMediaCard controller integrated with NAND flash, supporting MMC mode operation and JEDEC/MMC standard version 4.41 compliance.
• NAND Technology  MLC NAND (1 × 32Gb, 25 nm) as specified for this part number in the product ordering information.
• Interface Options  Advanced 11-signal MMC interface with selectable x1, x4 and x8 I/Os, MMCplus™ and MMCmobile™ protocol support, and a maximum clock of 52 MHz.
• Performance (MLC partition)  Sequential read up to 30 MB/s and sequential write up to 6.6 MB/s (1 MB sequential chunks, x8 I/O mode indicated in datasheet grouping); random read up to 1080 IOPS and random write up to 90 IOPS (4 KB chunks).
• Power  Supports VCCQ dual-voltage operation (1.65–1.95 V and 2.7–3.6 V) and VCC 2.7–3.6 V; device-level supply range listed as 1.65 V to 3.6 V. Typical standby current for the 32G part is 140 μA and active RMS current is 80 mA.
• Security and Reliability  Replay-protected memory block (RPMB), secure erase and trim, temporary and permanent write protection, configurable reliability settings, ECC and block management implemented.
• Boot and System Features  High-speed boot capability, double data rate (DDR) function, hardware reset signal, high-priority interrupt (HPI), and multiple partitions with enhanced attributes.
• Package and Temperature  153‑ball WFBGA package (11.5 × 13 mm × 0.8 mm) with an operating temperature range of −25°C to +85°C; family is listed as RoHS 6/6‑compliant in the datasheet.

Typical Applications

• Embedded storage and boot media  Used as on-board e•MMC storage where integrated MMC controller and boot operation are required.
• Mobile and handheld devices  Supports MMCmobile and MMCplus protocols and provides partitioning and RPMB for device-level data management.
• Secure data storage  Replay-protected memory block (RPMB), secure erase, and write-protection features support applications requiring controlled access to stored data.
• Industrial systems  Operation across −25°C to +85°C makes the device suitable for industrial embedded systems operating within that ambient range.

Unique Advantages

• Integrated MMC controller and NAND  Reduces host-side management by combining controller functionality with NAND in a single package.
• Flexible I/O modes  Selectable x1/x4/x8 I/O allows designers to match interface width to system requirements and host capability.
• Documented performance characteristics  Datasheet-provided sequential and random performance numbers (read/write MB/s and IOPS) enable predictable system-level performance planning.
• Security and partitioning features  RPMB, secure erase/trim, and multiple partitions with enhanced attributes help implement secure and manageable storage partitions.
• Wide supply and temperature ranges  Support for 1.65 V–3.6 V operation and −25°C to +85°C ambient operation increases compatibility with a broad set of host platforms and environments.
• Compact, industry-standard package  153-ball WFBGA (11.5 × 13 mm) provides a compact solution for space-constrained designs while remaining compatible with standard BGA assembly.

Why Choose IC FLASH 32GBIT MMC 153WFBGA?

The MTFC4GLDEA-0M WT TR delivers a compact, integrated e•MMC solution that combines Micron NAND with an MMC controller and a set of managed-flash features—enabling partitioning, security, and predictable performance for embedded designs. Its documented power and performance figures, selectable I/O modes, and support for MMC protocols make it suitable for systems that require an on-board managed storage device within the specified voltage and temperature ranges.

This device is appropriate for design teams seeking a single-package e•MMC memory with built-in reliability and security mechanisms, and where footprint, partitioning, and JEDEC MMC compliance are important selection criteria.

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