MTFC8GAMALBH-AIT TR

IC FLASH 64GBIT MMC 153TFBGA
Part Description

IC FLASH 64GBIT MMC 153TFBGA

Quantity 1,583 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerMicron Technology Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package153-TFBGA (11.5x13)Memory FormatFLASHTechnologyFLASH - NAND
Memory Size64 GbitAccess TimeN/AGradeAutomotive
Clock FrequencyN/AVoltageN/AMemory TypeNon-Volatile
Operating Temperature-40°C ~ 85°C (TA)Write Cycle Time Word PageN/APackaging153-TFBGA
Mounting MethodNon-VolatileMemory InterfaceMMCMemory Organization8G x 8
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
QualificationN/AECCN3A991B1AHTS Code8542.32.0071

Overview of MTFC8GAMALBH-AIT TR – IC FLASH 64GBIT MMC 153TFBGA

The MTFC8GAMALBH-AIT TR is a non-volatile FLASH memory device in Micron's e•MMC™ series. It implements NAND FLASH technology in an 8G × 8 organization to provide 64 Gbit of MMC-accessible storage.

Supplied in a 153‑TFBGA (11.5 × 13 mm) package and specified for an ambient operating range of -40°C to 85°C, the device targets designs that require compact, high-density NAND FLASH storage with an MMC interface.

Key Features

  • Memory Type & Technology — Non-volatile FLASH using NAND technology; MemorySize: 64 Gbit.
  • Memory Organization — 8G × 8 organization to define internal data layout and addressing.
  • Interface — MMC memory interface; part of the e•MMC™ series.
  • Package — 153‑TFBGA package case (11.5 × 13 mm) for compact, high-density mounting.
  • Operating Temperature — Specified operating range of -40°C to 85°C (TA).
  • Grade — Automotive (grade designation as specified in product data).

Typical Applications

  • Embedded storage — Provides 64 Gbit non‑volatile storage accessed via MMC for embedded systems requiring solid-state memory.
  • System boot and firmware storage — Stores firmware, boot images and persistent system data in a compact FLASH device.
  • Space-constrained designs — 153‑TFBGA package delivers high capacity in a small board footprint where board area is limited.

Unique Advantages

  • High capacity in a single device — 64 Gbit of NAND FLASH reduces the need for multiple memory components.
  • MMC interface integration — Native MMC interface simplifies integration with MMC-capable controllers and firmware stacks.
  • Compact BGA package — 153‑TFBGA (11.5 × 13 mm) package supports high-density board layouts.
  • Broad operating temperature — Rated from -40°C to 85°C (TA) for deployments across varied thermal conditions.
  • e•MMC™ series designation — Aligns with the e•MMC™ product family for consistent interface and form-factor expectations.

Why Choose IC FLASH 64GBIT MMC 153TFBGA?

The MTFC8GAMALBH-AIT TR combines 64 Gbit NAND FLASH capacity with an MMC interface in a compact 153‑TFBGA package, making it suitable for designs that require dense, non‑volatile storage with a standardized MMC connection. Its specified operating range and e•MMC™ series designation provide clear, verifiable attributes for system designers evaluating MMC FLASH options.

Request a quote or submit a pricing inquiry to obtain current availability and pricing information for the MTFC8GAMALBH-AIT TR.

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