MTFC8GAMALBH-AAT TR

IC FLASH 64GBIT MMC 153TFBGA
Part Description

IC FLASH 64GBIT MMC 153TFBGA

Quantity 233 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerMicron Technology Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package153-TFBGA (11.5x13)Memory FormatFLASHTechnologyFLASH - NAND
Memory Size64 GbitAccess TimeN/AGradeAutomotive
Clock FrequencyN/AVoltageN/AMemory TypeNon-Volatile
Operating Temperature-40°C ~ 105°C (TA)Write Cycle Time Word PageN/APackaging153-TFBGA
Mounting MethodNon-VolatileMemory InterfaceeMMC_5.1Memory Organization8G x 8
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
QualificationN/AECCN3A991B1AHTS Code8542.32.0071

Overview of MTFC8GAMALBH-AAT TR – IC FLASH 64GBIT MMC 153TFBGA

The MTFC8GAMALBH-AAT TR is a managed e•MMC™ storage device from Micron, delivering 64 Gbit of NAND flash in a compact 153-TFBGA package. It integrates non-volatile NAND flash memory with an eMMC_5.1 interface to provide board-level embedded storage.

This device targets systems that require packaged, managed flash memory with a defined memory organization and extended operating temperature range for use in environments that demand wider thermal tolerance.

Key Features

  • Memory Technology  Flash - NAND non-volatile memory providing persistent data storage without external management.
  • Capacity & Organization  64 Gbit total capacity with a memory organization of 8G × 8 for logical mapping and allocation.
  • Interface  eMMC_5.1 interface for managed NAND operation and standardized board-level connectivity.
  • Package  153-TFBGA package (11.5 × 13 mm) designed for high-density surface-mount integration.
  • Operating Temperature  Rated for operation from −40°C to 105°C (TA), allowing use across extended temperature environments.
  • Series & Manufacturer  Part of Micron’s e•MMC™ series, supplied by Micron Technology Inc.
  • Memory Format  Delivered as FLASH memory suitable for embedded storage applications.
  • Grade  Listed as Automotive in the product data.

Typical Applications

  • Embedded Storage  Managed eMMC interface and NAND flash capacity provide board-level persistent storage for embedded systems.
  • Compact Board-Level Integration  153-TFBGA (11.5 × 13 mm) package supports designs where space-efficient, soldered storage is required.
  • Extended-Temperature Systems  The −40°C to 105°C operating range supports deployment in environments with wide temperature variation.

Unique Advantages

  • Managed eMMC Interface:  eMMC_5.1 simplifies host integration by providing a standardized managed-NAND interface.
  • High Density in Small Package:  64 Gbit capacity in a 153-TFBGA (11.5 × 13 mm) footprint reduces board area devoted to storage.
  • Clear Memory Organization:  8G × 8 organization offers predictable addressing and capacity planning for firmware and data storage.
  • Wide Operating Temperature:  Rated −40°C to 105°C to support designs that must operate across extended temperature ranges.
  • Manufacturer Backing:  Produced by Micron Technology Inc., listed in the e•MMC™ series for consistent product lineage.

Why Choose IC FLASH 64GBIT MMC 153TFBGA?

The MTFC8GAMALBH-AAT TR combines Micron NAND flash technology with an eMMC_5.1 managed interface to provide a compact, board-mounted storage solution delivering 64 Gbit capacity and defined memory organization. Its 153-TFBGA package and extended temperature rating make it suitable for system designs that require soldered flash with predictable form factor and thermal tolerance.

This device is appropriate for designs prioritizing integrated, managed flash storage and compact packaging. The product data specifies its memory type, capacity, interface, package dimensions, and operating temperature, enabling engineering and procurement teams to assess fit for embedded storage requirements.

If you need pricing, availability, or a formal quote for MTFC8GAMALBH-AAT TR, request a quote or contact sales to discuss your requirements and lead times.

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