MTFC8GAMALBH-AAT ES TR
| Part Description |
IC FLASH 64GBIT MMC 153TFBGA |
|---|---|
| Quantity | 44 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Micron Technology Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 153-TFBGA (11.5x13) | Memory Format | FLASH | Technology | FLASH - NAND | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 64 Gbit | Access Time | N/A | Grade | Automotive | ||
| Clock Frequency | N/A | Voltage | N/A | Memory Type | Non-Volatile | ||
| Operating Temperature | -40°C ~ 105°C (TA) | Write Cycle Time Word Page | N/A | Packaging | 153-TFBGA | ||
| Mounting Method | Non-Volatile | Memory Interface | MMC | Memory Organization | 8G x 8 | ||
| Moisture Sensitivity Level | 1 (Unlimited) | RoHS Compliance | Unknown | REACH Compliance | REACH Unknown | ||
| Qualification | N/A | ECCN | 3A991B1A | HTS Code | 8542.32.0071 |
Overview of MTFC8GAMALBH-AAT ES TR – IC FLASH 64GBIT MMC 153TFBGA
The MTFC8GAMALBH-AAT ES TR is a 64 Gbit non-volatile FLASH memory device using NAND technology with an MMC memory interface. It is organized as 8G × 8 and provided in a 153-TFBGA package (11.5 × 13 mm).
This device targets MMC-based embedded storage implementations that require high-density NAND flash in a compact BGA footprint and supports operation across a wide ambient temperature range.
Key Features
- Memory Technology FLASH - NAND non-volatile memory format, providing persistent data storage.
- Capacity & Organization 64 Gbit total capacity arranged as 8G × 8 to simplify memory mapping and partitioning.
- Interface MMC memory interface for integration with MMC-compatible hosts and controllers.
- Package 153-TFBGA package (11.5 × 13 mm) for compact board-level integration; Supplier device package listed as 153-TFBGA (11.5x13).
- Operating Temperature Rated for operation from −40°C to 105°C (TA), supporting deployments across an extended ambient range.
- Mounting & Format Memory format: FLASH; mounting type indicated as Non-Volatile.
Typical Applications
- Embedded storage modules — Use as MMC-based non-volatile storage where a 64 Gbit NAND solution is required.
- Compact board-level systems — Integration in designs that benefit from a 153-TFBGA (11.5 × 13 mm) package to save PCB area.
- Temperature-challenged environments — Systems requiring components rated from −40°C to 105°C for broader operating conditions.
Unique Advantages
- High-density storage: 64 Gbit capacity enables substantial on-board data storage without additional external memory devices.
- MMC interface compatibility: Direct MMC interface reduces integration complexity for MMC-capable hosts.
- Compact BGA footprint: 153-TFBGA (11.5 × 13 mm) package minimizes board area while supporting high-density memory.
- Wide operating temperature: −40°C to 105°C rating expands deployment options across varied ambient conditions.
- Defined memory organization: 8G × 8 architecture provides clear memory mapping for firmware and system design.
Why Choose IC FLASH 64GBIT MMC 153TFBGA?
The MTFC8GAMALBH-AAT ES TR combines a 64 Gbit NAND FLASH architecture with an MMC interface and a compact 153-TFBGA package, offering a straightforward high-capacity memory option for MMC-based embedded designs. Its 8G × 8 organization and FLASH memory format present a clear, high-density storage building block for product developers.
This device is suitable for engineers and procurement teams specifying high-capacity MMC flash in space-constrained assemblies or systems operating across an extended temperature range. The combination of capacity, package size, and operating temperature helps simplify design choices where those attributes are primary selection criteria.
Request a quote or submit an inquiry for MTFC8GAMALBH-AAT ES TR to obtain pricing and availability information for your project.
