MTFC8GAMALBH-AAT
| Part Description |
IC FLASH 64GBIT MMC 153TFBGA |
|---|---|
| Quantity | 263 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Micron Technology Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 153-TFBGA (11.5x13) | Memory Format | FLASH | Technology | FLASH - NAND | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 64 Gbit | Access Time | N/A | Grade | Automotive | ||
| Clock Frequency | N/A | Voltage | N/A | Memory Type | Non-Volatile | ||
| Operating Temperature | -40°C ~ 105°C (TA) | Write Cycle Time Word Page | N/A | Packaging | 153-TFBGA | ||
| Mounting Method | Non-Volatile | Memory Interface | eMMC_5.1 | Memory Organization | 8G x 8 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Qualification | N/A | ECCN | 3A991B1A | HTS Code | 8542.32.0071 |
Overview of MTFC8GAMALBH-AAT – IC FLASH 64GBIT MMC 153TFBGA
The MTFC8GAMALBH-AAT is a 64 Gbit non-volatile NAND flash memory device in an e•MMC™ form factor. It implements NAND FLASH technology with an eMMC_5.1 memory interface and a 8G × 8 memory organization.
This device targets embedded storage applications that require onboard flash capacity in a compact BGA package and operation across a broad temperature range. Key technical attributes include a 153-TFBGA (11.5 × 13 mm) package and an operating temperature range of −40°C to 105°C.
Key Features
- Memory Capacity 64 Gbit total capacity organized as 8G × 8 to support substantial onboard storage requirements.
- Memory Technology NAND FLASH non-volatile memory format suitable for persistent data storage.
- Interface eMMC_5.1 memory interface for standard embedded MMC host integration.
- Package 153-TFBGA package (11.5 × 13 mm) that provides a compact, board-mountable footprint.
- Operating Temperature Rated for −40°C to 105°C (TA), enabling use in environments with wide temperature variation.
- Mounting and Form Factor Surface-mount TFBGA package designed for integration into PCB-based embedded systems.
Typical Applications
- Embedded Systems Onboard non-volatile storage for firmware, application code, and local data in embedded designs.
- Industrial Equipment Local flash storage in industrial controllers and monitoring devices where wide operating temperature is required.
- Consumer Electronics Compact onboard memory for devices requiring integrated eMMC storage in a small BGA footprint.
Unique Advantages
- High-density onboard storage: 64 Gbit capacity provides substantial non-volatile memory for code and data consolidation on a single component.
- Standardized interface: eMMC_5.1 facilitates host integration using a defined MMC interface, simplifying board-level design.
- Compact BGA package: 153-TFBGA (11.5 × 13 mm) minimizes board area while supporting surface-mount assembly.
- Wide temperature rating: −40°C to 105°C operating range supports use in thermally demanding environments.
- NAND Flash technology: Non-volatile FLASH format delivers persistent storage without external battery backup.
Why Choose MTFC8GAMALBH-AAT?
The MTFC8GAMALBH-AAT combines a high-capacity 64 Gbit NAND FLASH array with an eMMC_5.1 interface in a compact 153-TFBGA package, offering a straightforward embedded storage option where board space and persistent capacity matter. Its operating range of −40°C to 105°C and surface-mount TFBGA form factor make it appropriate for designs that require robust temperature tolerance and a small footprint.
Backed by Micron Technology Inc., this device is suitable for engineers and procurement teams specifying onboard flash memory for embedded, industrial, and consumer applications that need a standardized eMMC interface and a high-density non-volatile memory solution.
To request a quote or submit a procurement inquiry for MTFC8GAMALBH-AAT, please contact sales to obtain pricing, lead time, and ordering information.
