MTFC8GAMALBH-AIT
| Part Description |
IC FLASH 64GBIT MMC 153TFBGA |
|---|---|
| Quantity | 384 Available (as of May 6, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Micron Technology Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 153-TFBGA (11.5x13) | Memory Format | FLASH | Technology | FLASH - NAND | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 64 Gbit | Access Time | N/A | Grade | Automotive | ||
| Clock Frequency | N/A | Voltage | N/A | Memory Type | Non-Volatile | ||
| Operating Temperature | -40°C ~ 85°C (TA) | Write Cycle Time Word Page | N/A | Packaging | 153-TFBGA | ||
| Mounting Method | Non-Volatile | Memory Interface | MMC | Memory Organization | 8G x 8 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Qualification | N/A | ECCN | 3A991B1A | HTS Code | 8542.32.0071 |
Overview of MTFC8GAMALBH-AIT – IC FLASH 64GBIT MMC 153TFBGA
The MTFC8GAMALBH-AIT is a non-volatile NAND flash memory device in Micron's e•MMC™ series providing 64 Gbit of embedded storage in an MMC interface. It implements an 8G × 8 memory organization and is supplied in a compact 153-TFBGA (11.5 × 13 mm) package.
This device is intended for designs that require high-density flash storage in a compact BGA package and that operate across a wide ambient temperature range (−40°C to 85°C).
Key Features
- Memory Type Non-volatile FLASH - NAND technology providing persistent data storage.
- Capacity & Organization 64 Gbit total capacity arranged as 8G × 8."
- Interface MMC memory interface compatible with e•MMC™ series implementations.
- Package 153-TFBGA package, supplier device package specified as 153-TFBGA (11.5 × 13 mm) for compact board-level integration.
- Operating Temperature Specified for operation from −40°C to 85°C (TA), supporting deployment in environments requiring extended temperature range.
- Grade Listed as Automotive grade.
Typical Applications
- Embedded Storage Modules High-density 64 Gbit NAND flash for embedded storage where a compact e•MMC™ package is required.
- Industrial Systems Systems that require non-volatile storage across a wide ambient temperature range (−40°C to 85°C).
- Compact Consumer Devices Consumer designs needing MMC-interface flash in a small 153-TFBGA footprint.
Unique Advantages
- High-density Flash Capacity: 64 Gbit of NAND FLASH enables storage of large datasets or firmware images in a single device.
- Integrated MMC Interface: e•MMC™ MMC interface simplifies host connectivity for embedded storage applications.
- Compact BGA Package: 153-TFBGA (11.5 × 13 mm) supplier package reduces PCB footprint while supporting surface-mount assembly.
- Wide Operating Temperature: −40°C to 85°C rating supports deployment in temperature-challenging environments.
- Byte-Wide Memory Organization: 8G × 8 organization provides a byte-wide data path for straightforward memory access patterns.
Why Choose IC FLASH 64GBIT MMC 153TFBGA?
The MTFC8GAMALBH-AIT offers a compact, high-density e•MMC™ NAND flash solution that addresses embedded storage needs where board space and operating temperature range are important considerations. With a 64 Gbit capacity and 8G × 8 organization, it delivers substantial non-volatile storage in a single 153-TFBGA package.
This device is suited to designs that require MMC-interface flash in compact form factors and across extended temperature ranges. Its combination of capacity, package density, and specified operating temperature makes it a practical option for engineers specifying embedded flash for constrained layouts and environmental requirements.
Request a quote or contact sales to discuss pricing, availability and lead times for the MTFC8GAMALBH-AIT.
