MTFC8GAMALBH-AAT ES
| Part Description |
IC FLASH 64GBIT MMC 153TFBGA |
|---|---|
| Quantity | 1,059 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Micron Technology Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 153-TFBGA (11.5x13) | Memory Format | FLASH | Technology | FLASH - NAND | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 64 Gbit | Access Time | N/A | Grade | Automotive | ||
| Clock Frequency | N/A | Voltage | N/A | Memory Type | Non-Volatile | ||
| Operating Temperature | -40°C ~ 105°C (TA) | Write Cycle Time Word Page | N/A | Packaging | 153-TFBGA | ||
| Mounting Method | Non-Volatile | Memory Interface | MMC | Memory Organization | 8G x 8 | ||
| Moisture Sensitivity Level | 1 (Unlimited) | RoHS Compliance | Unknown | REACH Compliance | REACH Unknown | ||
| Qualification | N/A | ECCN | 3A991B1A | HTS Code | 8542.32.0071 |
Overview of MTFC8GAMALBH-AAT ES – IC FLASH 64GBIT MMC 153TFBGA
The MTFC8GAMALBH-AAT ES is a 64 Gbit non-volatile NAND flash memory device from Micron Technology Inc., offered in the e•MMC™ series. It implements a MMC memory interface and is organized as 8G × 8, providing high-density flash storage in a compact package.
This device is supplied in a 153-TFBGA (11.5 × 13 mm) package and is specified with an ambient operating temperature range of −40°C to 105°C, addressing designs that require wide temperature operation and board-level flash integration.
Key Features
- Memory Type & Technology Non-volatile FLASH using NAND technology; memory format listed as FLASH with a total size of 64 Gbit.
- Memory Organization Organized as 8G × 8 to define the device addressing and data width.
- Interface MMC memory interface for host storage connectivity.
- Package 153-TFBGA package (11.5 × 13 mm) offering a compact surface-mount form factor.
- Operating Temperature Specified ambient temperature range: −40°C to 105°C (TA).
- Manufacturer & Series Micron Technology Inc., e•MMC™ series.
Typical Applications
- Embedded Storage MMC-interface non-volatile storage for embedded systems where board-level flash is required.
- Compact Devices High-density flash in a 153-TFBGA package for space-constrained designs requiring on-board memory.
- Extended-Temperature Systems Designs operating across −40°C to 105°C that need NAND flash storage with specified temperature range.
Unique Advantages
- High capacity: 64 Gbit NAND flash enables larger data and file storage within a single device footprint.
- MMC interface: Provides a standardized host interface for integration with MMC-compatible controllers.
- Compact TFBGA packaging: 153-ball 11.5 × 13 mm package minimizes PCB area for high-density board designs.
- Wide operating temperature: Rated from −40°C to 105°C (TA) to address a broad range of ambient conditions.
- Defined memory organization: 8G × 8 organization supports predictable design and addressing schemes.
Why Choose MTFC8GAMALBH-AAT ES?
The MTFC8GAMALBH-AAT ES combines Micron's e•MMC series architecture with 64 Gbit NAND flash density in a compact 153-TFBGA package, providing a straightforward MMC-based memory option for designs that require board-mounted non-volatile storage and defined operating temperature limits. Its memory organization and interface make it appropriate for systems that require high-density flash and standard MMC connectivity.
This device is suited to engineers and purchasers specifying flash storage solutions where package size, storage capacity, and ambient temperature range are primary selection criteria.
Request a quote or contact sales to discuss availability, lead times, and pricing for the MTFC8GAMALBH-AAT ES.
