MTFC8GAMALBH-AIT ES

IC FLASH 64GBIT MMC 153TFBGA
Part Description

IC FLASH 64GBIT MMC 153TFBGA

Quantity 314 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerMicron Technology Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package153-TFBGA (11.5x13)Memory FormatFLASHTechnologyFLASH - NAND
Memory Size64 GbitAccess TimeN/AGradeAutomotive
Clock FrequencyN/AVoltageN/AMemory TypeNon-Volatile
Operating Temperature-40°C ~ 85°C (TA)Write Cycle Time Word PageN/APackaging153-TFBGA
Mounting MethodNon-VolatileMemory InterfaceMMCMemory Organization8G x 8
Moisture Sensitivity Level1 (Unlimited)RoHS ComplianceUnknownREACH ComplianceREACH Unknown
QualificationN/AECCN3A991B1AHTS Code8542.32.0071

Overview of MTFC8GAMALBH-AIT ES – IC FLASH 64GBIT MMC 153TFBGA

The MTFC8GAMALBH-AIT ES is a non-volatile NAND FLASH memory device configured as e•MMC with a 64 Gbit capacity. It implements a memory organization of 8G × 8 and provides onboard storage via an MMC interface in a compact 153-TFBGA package.

This device is intended for designs that require high-density flash storage in a small footprint and support for extended ambient temperatures, offering integration benefits through an MMC interface and a standardized BGA package footprint.

Key Features

  • Memory Type & Technology Non-volatile FLASH - NAND memory format suitable for persistent data and code storage.
  • Capacity & Organization 64 Gbit total capacity, organized as 8G × 8 to clarify density and addressing layout.
  • Interface MMC memory interface for host connectivity and integration with MMC-capable controllers.
  • Package & Footprint 153-TFBGA package; supplier device package specified as 153-TFBGA (11.5 × 13 mm) for compact board integration.
  • Operating Temperature Specified ambient range of −40°C to 85°C (TA) for operation across a broad set of environmental conditions.
  • Grade & Qualification Grade listed as Automotive; qualification status is not specified in the provided product data.

Typical Applications

  • Embedded storage — Onboard non-volatile memory via MMC interface for firmware, file systems, or application data in embedded systems.
  • Industrial equipment — High-density flash storage for systems that require operation across an ambient range down to −40°C and up to 85°C.
  • Space-constrained designs — Compact 153-TFBGA package enables high-capacity storage where PCB real estate is limited.

Unique Advantages

  • High density 64 Gbit capacity: Provides substantial onboard storage in a single device to consolidate flash requirements.
  • Defined memory organization (8G × 8): Clear organization simplifies capacity planning and addressing considerations.
  • MMC interface integration: Standard MMC interface reduces interface complexity for systems using MMC-compatible controllers.
  • Compact BGA footprint (153-TFBGA, 11.5 × 13 mm): Enables integration into compact assemblies while maintaining high capacity.
  • Extended ambient temperature range: Specified −40°C to 85°C supports operation across a wide set of environmental conditions.
  • Manufacturer identification: Supplied by Micron Technology Inc., as listed in the product data.

Why Choose IC FLASH 64GBIT MMC 153TFBGA?

This e•MMC-format NAND flash device balances high capacity and a compact BGA package for applications that need significant onboard non-volatile storage without a large PCB footprint. The MMC interface and explicit memory organization simplify integration into systems designed for MMC memory.

Design teams seeking a 64 Gbit NAND FLASH solution with a defined operating temperature range and a small 153-TFBGA package will find the MTFC8GAMALBH-AIT ES aligns with space- and capacity-sensitive designs. Qualification details are not specified in the provided data, so validation per project requirements is recommended.

To request a quote or submit a pricing and availability inquiry for the MTFC8GAMALBH-AIT ES, please contact sales or request a formal quote through your usual procurement channel.

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