MTFC8GLDEA-1M WT TR
| Part Description |
IC FLASH 64GBIT MMC 153WFBGA |
|---|---|
| Quantity | 801 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Micron Technology Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 153-WFBGA (11.5x13) | Memory Format | FLASH | Technology | FLASH - NAND | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 64 Gbit | Access Time | N/A | Grade | Industrial | ||
| Clock Frequency | N/A | Voltage | 1.65V ~ 3.6V | Memory Type | Non-Volatile | ||
| Operating Temperature | -25°C ~ 85°C (TA) | Write Cycle Time Word Page | N/A | Packaging | 153-WFBGA | ||
| Mounting Method | Non-Volatile | Memory Interface | MMC | Memory Organization | 8G x 8 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Qualification | N/A | ECCN | 3A991B1A | HTS Code | 8542.32.0071 |
Overview of MTFC8GLDEA-1M WT TR – IC FLASH 64GBIT MMC 153WFBGA
The MTFC8GLDEA-1M WT TR is a 64 Gbit e•MMC™ NAND flash memory device combining an MMC controller and NAND flash in a single 153-ball WFBGA package. It provides non-volatile embedded storage with an MMC interface and is designed for systems that require integrated MMC-mode flash memory with boot and secure storage capabilities.
Core strengths include integrated MMC controller architecture, multi-IO support, and temperature and voltage ranges suited for a broad set of embedded applications where compact package size and managed flash features are required.
Key Features
- Memory Type & Organization 64 Gbit NAND Flash organized as 8G × 8, providing managed non-volatile storage in a compact e-MMC form.
- Interface & Protocol MMC interface compliant with JEDEC/MMC standard version 4.41; supports MMC mode operation and advanced 11-signal interface with selectable x1, x4 and x8 I/Os.
- Performance Device-level performance (MLC partition): up to 44 MB/s sequential read and 13.5 MB/s sequential write in x8 I/O mode; random read ~1080 IOPS and random write ~90 IOPS (4 KB random access).
- Power & Voltage Voltage supply range documented as 1.65 V to 3.6 V. Datasheet notes VCC = 2.7–3.6 V and VCCQ dual-voltage support (1.65–1.95 V or 2.7–3.6 V). Typical active current ~80 mA; standby current for the 64 GB device ~160 μA.
- Package & Mechanical 153-ball WFBGA package, 11.5 mm × 13.0 mm footprint and 0.8 mm thickness, optimized for board-level embedded integration.
- Temperature Range Operating temperature: –25 °C to +85 °C; storage temperature: –40 °C to +85 °C.
- Security & Reliability Includes features such as replay-protected memory block (RPMB), secure erase and trim, temporary and permanent write protection, multiple partitions with enhanced attributes, ECC and block management.
- Boot & System Features Supports boot operation (high-speed boot), double data rate (DDR) function, hardware reset signal, high-priority interrupt (HPI), configurable reliability and enhanced reliable write.
Typical Applications
- Embedded systems Managed e-MMC storage for embedded controllers and single-board computers that require MMC-mode flash with boot capability and partitioning.
- Portable/mobile devices MMC-interface storage for designs using MMCmobile/MMCplus protocols where compact, integrated non-volatile memory is required.
- Secure storage Applications needing replay-protected memory (RPMB), secure erase and write-protection features for protected key or credential storage.
Unique Advantages
- Integrated MMC controller and NAND Reduces system-level integration burden by combining controller and NAND in one package, simplifying board design.
- Flexible I/O modes Selectable x1, x4 and x8 I/Os let hosts balance throughput and pin usage according to system requirements.
- Managed reliability features On-device ECC, block management, configurable reliability settings, and enhanced reliable write reduce host flash-management complexity.
- Security-oriented features RPMB, secure erase, and write-protection options support secure storage use cases without additional external components.
- Compact package 153-ball WFBGA (11.5 × 13.0 mm) enables high-density board integration where PCB area is constrained.
- Broad operating conditions Voltage support from 1.65 V to 3.6 V and an operating temperature range of –25 °C to +85 °C accommodate a variety of embedded environments.
Why Choose IC FLASH 64GBIT MMC 153WFBGA?
The MTFC8GLDEA-1M WT TR positions itself as a compact, integrated e-MMC solution for embedded designs that need managed NAND storage with boot, security and partitioning capabilities. Its combination of MMC-standard compliance, selectable I/O widths, and on-device reliability and security features make it suitable for developers seeking to minimize host-side flash management and PCB complexity.
This device is appropriate for designers of embedded and mobile-class systems requiring a 64 Gbit non-volatile storage option in a small WFBGA footprint, offering defined performance and power characteristics and a set of system-level features documented in the product datasheet.
Request a quote or contact sales to discuss pricing, availability, and to submit a formal quotation request for the MTFC8GLDEA-1M WT TR.
