MTFC8GLDEA-1M WT

IC FLASH 64GBIT MMC 153WFBGA
Part Description

IC FLASH 64GBIT MMC 153WFBGA

Quantity 1,420 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerMicron Technology Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package153-WFBGA (11.5x13)Memory FormatFLASHTechnologyFLASH - NAND
Memory Size64 GbitAccess TimeN/AGradeIndustrial
Clock FrequencyN/AVoltage1.65V ~ 3.6VMemory TypeNon-Volatile
Operating Temperature-25°C ~ 85°C (TA)Write Cycle Time Word PageN/APackaging153-WFBGA
Mounting MethodNon-VolatileMemory InterfaceMMCMemory Organization8G x 8
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS CompliantREACH ComplianceREACH Unaffected
QualificationN/AECCN3A991B1AHTS Code8523.51.0000

Overview of MTFC8GLDEA-1M WT – IC FLASH 64GBIT MMC 153WFBGA

The MTFC8GLDEA-1M WT is a 64 Gbit non-volatile NAND Flash memory device with an integrated MMC controller, delivered in a 153-ball WFBGA package. It implements e•MMC architecture with an MMC interface and an 8G × 8 memory organization for embedded storage applications.

Designed for systems requiring onboard managed flash, the device supports a wide supply range (1.65 V to 3.6 V) and an operating temperature range of –25°C to +85°C, providing a compact, controller-integrated storage solution for consumer and embedded markets.

Key Features

  • Integrated e•MMC Solution  Combines a MultiMediaCard (MMC) controller and NAND Flash in a single package for simplified host integration and managed storage behavior.
  • Memory  64 Gbit FLASH NAND memory with an 8G × 8 organization, providing block-based storage in an e•MMC format.
  • MMC Interface  JEDEC/MMC standard version 4.41-compliant with an advanced 11-signal interface; supports x1, x4, and x8 I/Os selectable by the host.
  • Performance (MLC partition)  Typical sequential read up to 44 MB/s and sequential write up to 13.5 MB/s; random read ~1080 IOPS and random write ~90 IOPS (measured in x8 I/O mode with stated test conditions).
  • Power and Current  Typical standby current approximately 120 µA and active current (RMS) approximately 80 mA for the 8G configuration (typical values from product datasheet).
  • Voltage and Temperature  Supports a wide supply voltage range of 1.65 V to 3.6 V and operating temperature range of –25°C to +85°C.
  • Package  153-ball WFBGA package (11.5 × 13.0 mm), optimized for compact board-level integration.
  • MMC-Specific Functionality  Features include 52 MHz clock support (max), double data rate (DDR) function, boot operation (high-speed boot), sleep mode, hardware reset, and high-priority interrupt (HPI).
  • Data Management and Security  Built-in ECC and block management, replay-protected memory block (RPMB), secure erase, trim, temporary/permanent write protection, and multiple partitions with enhanced attributes.

Typical Applications

  • Embedded Consumer Devices  Managed onboard storage for firmware, media, and user data where a compact, integrated e•MMC solution is required.
  • Mobile and Portable Electronics  Local non-volatile storage for boot images, application code, and file systems using MMC interface and boot features.
  • Industrial Embedded Systems  System storage in constrained footprints that benefit from an integrated controller, ECC, and configurable reliability settings within the specified temperature range.
  • System Boot and OS Storage  High-speed boot operation and partitioning support for storing boot loaders and operating system images.

Unique Advantages

  • Controller-Integrated Flash:  MMC controller and NAND Flash in one device reduce host-side controller overhead and simplify BOM and firmware integration.
  • Flexible Interface Modes:  Selectable x1/x4/x8 I/O modes and support for DDR enable host-configurable throughput and compatibility with a range of designs.
  • Managed Reliability Features:  On-device ECC, block management, RPMB, and write protection options help protect data integrity and enable secure storage workflows.
  • Compact WFBGA Package:  153-ball WFBGA (11.5 × 13 mm) provides a small footprint for space-constrained PCBs while maintaining required signal density.
  • Wide Voltage and Temperature Range:  Operation from 1.65 V to 3.6 V and –25°C to +85°C supports a variety of embedded environments and power-rail configurations.
  • Boot and Background Operations:  High-speed boot support, background operation, and configurable reliability settings enable robust system start-up and maintenance.

Why Choose IC FLASH 64GBIT MMC 153WFBGA?

The MTFC8GLDEA-1M WT positions itself as an integrated e•MMC storage option combining NAND Flash and a compliant MMC controller in a compact WFBGA package. Its measurable performance characteristics, on-device data management (ECC and block management), and MMC-standard feature set make it suitable for embedded systems that require managed non-volatile storage with partitioning, boot capability, and security features.

This device is appropriate for designers targeting consumer, mobile, and embedded applications that need a space-efficient, controller-integrated memory solution with a broad supply voltage range and defined operating temperature window. The included MMC-specific features and configurable reliability options support longer-term maintainability and system integration.

Request a quote or submit an inquiry to our sales team for pricing, availability, and lead-time information for MTFC8GLDEA-1M WT.

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