MTFC8GLGDM-AIT Z
| Part Description |
IC FLASH 64GBIT MMC 153TFBGA |
|---|---|
| Quantity | 169 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Micron Technology Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 153-TFBGA (11.5x13) | Memory Format | FLASH | Technology | FLASH - NAND | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 64 Gbit | Access Time | N/A | Grade | Automotive | ||
| Clock Frequency | N/A | Voltage | 1.65V ~ 3.6V | Memory Type | Non-Volatile | ||
| Operating Temperature | -40°C ~ 85°C (TA) | Write Cycle Time Word Page | N/A | Packaging | 153-TFBGA | ||
| Mounting Method | Non-Volatile | Memory Interface | MMC | Memory Organization | 8G x 8 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Qualification | N/A | ECCN | 3A991B1A | HTS Code | 8542.32.0071 |
Overview of MTFC8GLGDM-AIT Z – IC FLASH 64Gbit MMC 153-TFBGA
The MTFC8GLGDM-AIT Z is a 64 Gbit non-volatile NAND flash memory device with an MMC memory interface. It is organized as 8G × 8 and packaged in a 153-TFBGA (11.5 × 13 mm) form factor, operating over a supply range of 1.65 V to 3.6 V and an ambient temperature range of −40 °C to 85 °C.
This device provides compact, high-density flash storage in a ball-grid array package suitable for applications requiring MMC interface connectivity and broad voltage compatibility.
Key Features
- Memory Type & Technology Non-volatile FLASH memory based on NAND technology, providing persistent storage without external power.
- Density & Organization 64 Gbit capacity arranged as 8G × 8, delivering high storage density in a single device.
- Memory Interface MMC memory interface for use in systems that support MMC connectivity.
- Voltage Supply Wide operating supply range from 1.65 V to 3.6 V to accommodate multiple power domain designs.
- Package 153-TFBGA package (11.5 × 13 mm) for compact board-level integration and BGA assembly.
- Operating Temperature Specified ambient operating range of −40 °C to 85 °C.
Typical Applications
- Embedded storage — Provides 64 Gbit non-volatile storage via MMC interface for embedded systems requiring compact flash memory.
- Firmware storage — Store firmware images and system code in NAND FLASH organized as 8G × 8.
- Boot and system storage — Serve as MMC-based boot or system storage where the device-level voltage range and temperature range match system requirements.
Unique Advantages
- High-density storage: 64 Gbit capacity in a single device simplifies BOM compared with multiple lower-capacity parts.
- Compact BGA package: 153-TFBGA (11.5 × 13 mm) enables space-constrained PCB layouts while supporting BGA assembly processes.
- Wide supply compatibility: 1.65 V to 3.6 V operation allows integration with diverse power architectures.
- Extended temperature range: −40 °C to 85 °C operation supports designs with moderate temperature variation requirements.
- MMC interface: Standard MMC connectivity for designs that require MMC-based flash storage.
Why Choose IC FLASH 64GBIT MMC 153TFBGA?
The MTFC8GLGDM-AIT Z positions itself as a compact, high-density NAND FLASH memory option with MMC interface connectivity, broad supply voltage support, and an extended ambient temperature range. Its 153-TFBGA packaging and 8G × 8 organization provide a concise integration path for designs needing persistent MMC storage.
This device is suited for designers and procurement teams seeking a single-package 64 Gbit NAND solution that aligns with specified voltage and temperature constraints while minimizing board footprint and part count.
Request a quote or submit an inquiry for pricing and availability to receive further ordering information and lead-time details.
