MTFC8GLGDM-AIT Z TR

IC FLASH 64GBIT MMC 153TFBGA
Part Description

IC FLASH 64GBIT MMC 153TFBGA

Quantity 273 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerMicron Technology Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package153-TFBGA (11.5x13)Memory FormatFLASHTechnologyFLASH - NAND
Memory Size64 GbitAccess TimeN/AGradeAutomotive
Clock FrequencyN/AVoltage1.65V ~ 3.6VMemory TypeNon-Volatile
Operating Temperature-40°C ~ 85°C (TA)Write Cycle Time Word PageN/APackaging153-TFBGA
Mounting MethodNon-VolatileMemory InterfaceMMCMemory Organization8G x 8
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
QualificationN/AECCN3A991B1AHTS Code8542.32.0071

Overview of MTFC8GLGDM-AIT Z TR – IC FLASH 64GBIT MMC 153TFBGA

The MTFC8GLGDM-AIT Z TR is a 64 Gbit non-volatile Flash memory device using NAND technology with an MMC memory interface. It provides an 8G x 8 memory organization in a 153-TFBGA (11.5 × 13 mm) package with a wide supply voltage range and extended operating temperature.

This device is designed for applications requiring high-density NAND flash storage with a compact package, a broad voltage supply window (1.65 V to 3.6 V), and an operating range from −40°C to 85°C.

Key Features

  • Memory Type & Technology  Non-volatile FLASH memory using NAND technology, organized as 8G × 8 for a total capacity of 64 Gbit.
  • Memory Interface  MMC memory interface for integration into systems that support MMC connectivity.
  • Voltage Supply  Operates across a wide supply range from 1.65 V to 3.6 V to accommodate diverse system power rails.
  • Operating Temperature  Specified for an ambient temperature range of −40°C to 85°C (TA).
  • Package  153-TFBGA package (11.5 × 13 mm) for compact board-level footprint.
  • Memory Size & Format  64 Gbit capacity provided in FLASH memory format suitable for embedded storage needs.
  • Grade  Grade listed as Automotive.

Typical Applications

  • Embedded storage modules  Provides 64 Gbit NAND FLASH via an MMC interface for integrated storage solutions in embedded systems.
  • Industrial controllers  Offers non-volatile NAND storage with a wide voltage range and −40°C to 85°C operating range for temperature-varied environments.
  • Compact system designs  153-TFBGA package allows high-density memory integration where board space is limited.

Unique Advantages

  • High-density capacity: 64 Gbit total memory enables substantial on-board storage in a single device.
  • MMC interface compatibility: Standard MMC interface simplifies integration into systems that use MMC-based storage.
  • Wide supply voltage: 1.65 V to 3.6 V operation supports flexible power-rail designs and multi-voltage systems.
  • Extended temperature range: Rated for −40°C to 85°C (TA) to support designs exposed to a broad range of ambient temperatures.
  • Compact BGA package: 153-TFBGA (11.5 × 13 mm) provides high-density placement for space-constrained PCBs.
  • Automotive grade listing: Grade field is listed as Automotive.

Why Choose MTFC8GLGDM-AIT Z TR?

The MTFC8GLGDM-AIT Z TR delivers a high-capacity NAND FLASH solution with an MMC interface, a compact 153-TFBGA package, and a wide operating voltage and temperature range. These characteristics make it suitable for designs that require dense non-volatile storage, flexible power compatibility, and a small board footprint.

This device is appropriate for engineers and procurement teams specifying embedded storage where capacity, package size, and operating environment are key selection criteria. Its combination of memory organization, interface, and physical packaging supports long-term integration into space- and power-constrained systems.

Request a quote or submit an inquiry to receive pricing and availability information for the MTFC8GLGDM-AIT Z TR.

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