MTFC8GLWDM-3L AAT Z TR

IC FLASH 64GBIT MMC 153TFBGA
Part Description

IC FLASH 64GBIT MMC 153TFBGA

Quantity 652 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerMicron Technology Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package153-TFBGA (11.5x13)Memory FormatFLASHTechnologyFLASH - NAND
Memory Size64 GbitAccess TimeN/AGradeAutomotive
Clock FrequencyN/AVoltage2.7V ~ 3.6VMemory TypeNon-Volatile
Operating Temperature-40°C ~ 105°C (TA)Write Cycle Time Word PageN/APackaging153-TFBGA
Mounting MethodNon-VolatileMemory InterfaceMMCMemory Organization8G x 8
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
QualificationN/AECCN3A991B1AHTS Code8542.32.0071

Overview of MTFC8GLWDM-3L AAT Z TR – IC FLASH 64Gbit e•MMC™ 153-TFBGA

The MTFC8GLWDM-3L AAT Z TR is a 64 Gbit non-volatile NAND flash memory device in an e•MMC™ form factor. It integrates NAND FLASH memory organized as 8G × 8 with an MMC interface for onboard storage in system designs.

Designed for compact, board-level integration, the device offers a wide supply voltage range and an extended operating temperature window that support deployment in systems requiring robust flash storage and compact packaging.

Key Features

  • Memory Core  NAND FLASH non-volatile memory, 64 Gbit capacity organized as 8G × 8.
  • Interface  MMC memory interface for direct integration with MMC-compatible host controllers.
  • Voltage  Wide supply range of 2.7 V to 3.6 V to accommodate common 3.3 V system rails.
  • Package  153-TFBGA package (11.5 × 13 mm) for compact board-level footprint.
  • Temperature Range  Operating ambient range of −40°C to 105°C (TA), suitable for designs requiring extended temperature performance.
  • Memory Format & Organization  FLASH memory format with 8G × 8 organization for high-density storage.
  • Manufacturer  Micron Technology Inc.; series listed as e•MMC™.
  • Grade  Product data lists grade as Automotive.

Typical Applications

  • Embedded storage systems  Onboard non-volatile storage where MMC interface compatibility and up to 64 Gbit capacity are required.
  • Space-constrained designs  Compact 153-TFBGA package enables high-density flash in limited PCB area.
  • Extended-temperature equipment  Applications that require operation across −40°C to 105°C can use this device for reliable flash storage across temperature extremes.

Unique Advantages

  • High-density storage: 64 Gbit capacity organized as 8G × 8 provides substantial onboard flash for large datasets or application code.
  • Standard MMC interface: MMC connectivity simplifies integration with MMC-capable hosts and standard storage stacks.
  • Wide supply voltage: 2.7 V to 3.6 V tolerance supports common system power rails without additional level translation.
  • Compact package: 153-TFBGA (11.5 × 13 mm) minimizes board area while delivering high capacity.
  • Extended operating temperature: −40°C to 105°C rating supports deployment in environments with broad temperature requirements.
  • Recognized vendor: Manufactured by Micron Technology Inc., listed in the e•MMC™ series.

Why Choose IC FLASH 64GBIT MMC 153TFBGA?

The MTFC8GLWDM-3L AAT Z TR combines a 64 Gbit NAND FLASH core with an MMC interface in a compact 153-TFBGA package, offering a straightforward solution for designs that need high-density onboard storage with a standard memory interface. Its wide supply voltage range and extended operating temperature make it suitable for systems that require reliable flash behavior across common 3.3 V designs and broad ambient conditions.

This device is appropriate for engineers specifying board-level flash where capacity, form factor, and interface compatibility are primary concerns. As a Micron Technology Inc. e•MMC™ product, it provides a clear specification set for procurement and system integration.

Request a quote or submit an inquiry to obtain pricing and availability for the MTFC8GLWDM-3L AAT Z TR.

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