MTFC8GLWDM-AIT Z
| Part Description |
IC FLASH 64GBIT MMC 153TFBGA |
|---|---|
| Quantity | 497 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Micron Technology Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 153-TFBGA (11.5x13) | Memory Format | FLASH | Technology | FLASH - NAND | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 64 Gbit | Access Time | N/A | Grade | Automotive | ||
| Clock Frequency | N/A | Voltage | 2.7V ~ 3.6V | Memory Type | Non-Volatile | ||
| Operating Temperature | -40°C ~ 85°C (TA) | Write Cycle Time Word Page | N/A | Packaging | 153-TFBGA | ||
| Mounting Method | Non-Volatile | Memory Interface | MMC | Memory Organization | 8G x 8 | ||
| Moisture Sensitivity Level | N/A | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Qualification | N/A | ECCN | 3A991B1A | HTS Code | 8542.32.0071 |
Overview of MTFC8GLWDM-AIT Z – 64 Gbit e•MMC Flash, 153-TFBGA
The MTFC8GLWDM-AIT Z is a non-volatile FLASH memory device in Micron's e•MMC™ series, organized as 8G x 8 to deliver 64 Gbit of onboard storage. It implements NAND FLASH technology with an MMC memory interface for integrated storage use.
Designed for systems that require compact, board-mounted FLASH storage, the device combines a widely supported MMC interface, a compact 153-TFBGA (11.5 × 13 mm) package, and broad voltage and temperature operating ranges for straightforward hardware integration.
Key Features
- Memory Core / Technology NAND FLASH, non-volatile memory implemented in an 8G × 8 organization providing a total capacity of 64 Gbit.
- Interface MMC memory interface for standard e•MMC integration.
- Power Operating supply voltage range from 2.7 V to 3.6 V to match common system power rails.
- Package 153-TFBGA package (11.5 × 13 mm) offering a compact board footprint for high-density applications.
- Operating Temperature Specified ambient operating range of −40 °C to 85 °C (TA).
- Memory Format & Mounting FLASH memory format with board-mounted TFBGA supplier device package.
- Product Family e•MMC™ series device for embedded MMC storage implementations.
Typical Applications
- MMC-based Storage Systems Use as onboard e•MMC storage where an MMC interface and NAND FLASH capacity are required.
- Compact Embedded Devices Integration into space-constrained boards leveraging the 153-TFBGA package and 64 Gbit capacity.
- Systems Requiring Wide Voltage/Temperature Support Suitable for designs operating from 2.7 V to 3.6 V and across an ambient range of −40 °C to 85 °C.
Unique Advantages
- 64 Gbit Integrated Capacity: Provides substantial onboard storage in a single-device solution.
- Standard MMC Interface: Simplifies integration into systems that support e•MMC/MMC protocols.
- Compact TFBGA Package: 153-TFBGA (11.5 × 13 mm) minimizes board area for dense designs.
- Wide Supply Voltage Compatibility: Operates from 2.7 V to 3.6 V to align with common system rails.
- Extended Ambient Temperature Range: Specified operation from −40 °C to 85 °C for thermally diverse environments.
Why Choose MTFC8GLWDM-AIT Z?
The MTFC8GLWDM-AIT Z combines 64 Gbit of NAND FLASH storage with an MMC interface and a compact 153-TFBGA package, offering a straightforward solution for embedded storage needs. Its defined supply voltage range and ambient temperature specification support integration into designs that require reliable board-mounted FLASH memory without additional external components.
Choose this e•MMC™ family device when you need verified NAND FLASH capacity in a compact footprint, standard MMC connectivity, and clear electrical and environmental operating limits for system design and procurement planning.
Request a quote or submit an inquiry for MTFC8GLWDM-AIT Z to obtain pricing, availability, and ordering information.
