MTFC8GLWDM-AIT Z TR
| Part Description |
IC FLASH 64GBIT MMC 153TFBGA |
|---|---|
| Quantity | 1,474 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Micron Technology Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 153-TFBGA (11.5x13) | Memory Format | FLASH | Technology | FLASH - NAND | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 64 Gbit | Access Time | N/A | Grade | Automotive | ||
| Clock Frequency | N/A | Voltage | 2.7V ~ 3.6V | Memory Type | Non-Volatile | ||
| Operating Temperature | -40°C ~ 85°C (TA) | Write Cycle Time Word Page | N/A | Packaging | 153-TFBGA | ||
| Mounting Method | Non-Volatile | Memory Interface | MMC | Memory Organization | 8G x 8 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS Compliant | REACH Compliance | REACH Unaffected | ||
| Qualification | N/A | ECCN | 3A991B1A | HTS Code | 8542.32.0071 |
Overview of MTFC8GLWDM-AIT Z TR – IC FLASH 64Gbit MMC, 153-TFBGA
The MTFC8GLWDM-AIT Z TR is a 64 Gbit non-volatile NAND flash memory device in the Micron e•MMC™ series. It implements an MMC interface and a memory organization of 8G × 8 to provide high-density embedded flash storage.
Designed for systems requiring solid-state, non-volatile storage, this device offers a wide supply voltage range and a compact 153-TFBGA package with defined operating temperature bounds to support integration into space-constrained designs.
Key Features
- Memory Type & Technology Non-volatile storage based on NAND flash technology; formatted as FLASH for embedded data retention.
- Capacity & Organization 64 Gbit total capacity with a memory organization of 8G × 8, providing byte-wide data storage.
- Interface MMC memory interface for standard embedded memory connectivity.
- Voltage Supply Operates from 2.7 V to 3.6 V, compatible with common 3 V system rails.
- Operating Temperature Specified operating range of −40 °C to 85 °C (TA).
- Package 153-TFBGA package; supplier device package dimension listed as 153-TFBGA (11.5 × 13 mm).
- Series Part of the Micron e•MMC™ series and provided in an MMC memory format.
- Grade Grade value in product data is listed as "Automotive".
Typical Applications
- Embedded storage systems Use where 64 Gbit of non-volatile NAND flash with an MMC interface is required for onboard data storage.
- Space-constrained designs Compact 153-TFBGA (11.5 × 13 mm) package enables integration into applications with limited board area.
- Systems operating across temperature Applications that require operation across −40 °C to 85 °C can leverage the device’s specified temperature range.
Unique Advantages
- High density storage: 64 Gbit capacity with 8G × 8 organization supports substantial on-board data storage in a single device.
- Standard MMC interface: MMC interface simplifies integration with controllers and existing MMC-compatible designs.
- Wide supply range: 2.7 V to 3.6 V operation allows compatibility with typical 3 V system rails.
- Compact BGA package: 153-TFBGA (11.5 × 13 mm) package reduces PCB footprint for tightly packed assemblies.
- Extended temperature window: Rated for −40 °C to 85 °C to address applications with broad ambient temperature requirements.
- Part of Micron e•MMC™ series: Identified as an e•MMC series device for consistency within that product family.
Why Choose MTFC8GLWDM-AIT Z TR?
The MTFC8GLWDM-AIT Z TR provides a compact, high-capacity NAND flash option with an MMC interface and a broad operating voltage and temperature range. Its 64 Gbit capacity and 8G × 8 organization make it suitable for embedded designs that require non-volatile storage in a small footprint.
As a member of the Micron e•MMC™ series, this device is positioned for designers seeking a standardized MMC-format flash memory solution with defined mechanical and electrical characteristics for integration into a variety of systems.
Request a quote or contact sales to discuss availability, pricing, and lead times for the MTFC8GLWDM-AIT Z TR.
