MTFC8GLWDQ-3L AAT Z TR
| Part Description |
IC FLASH 64GBIT MMC 100LBGA |
|---|---|
| Quantity | 841 Available (as of May 26, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Micron Technology Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
Specifications & Environmental
| Device Package | 100-LBGA (14x18) | Memory Format | FLASH | Technology | FLASH - NAND | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 64 Gbit | Access Time | N/A | Grade | Automotive | ||
| Clock Frequency | N/A | Voltage | 2.7V ~ 3.6V | Memory Type | Non-Volatile | ||
| Operating Temperature | -40°C ~ 105°C (TA) | Write Cycle Time Word Page | N/A | Packaging | 100-LBGA | ||
| Mounting Method | Non-Volatile | Memory Interface | MMC | Memory Organization | 8G x 8 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unknown | ||
| Qualification | N/A | ECCN | 3A991B1A | HTS Code | 8542.32.0071 |
Overview of MTFC8GLWDQ-3L AAT Z TR – IC FLASH 64GBIT MMC 100LBGA
The MTFC8GLWDQ-3L AAT Z TR is a 64 Gbit non-volatile NAND flash memory device in Micron's e•MMC™ series. It provides MMC-interface storage in a 100‑pin LBGA package designed for compact embedded applications.
Key attributes include NAND flash technology, an 8G × 8 memory organization, a 2.7 V to 3.6 V supply range, and an operating temperature window from −40 °C to 105 °C, enabling deployment across a range of temperature environments.
Key Features
- Memory Core 64 Gbit capacity implemented as 8G × 8 organization using NAND flash technology.
- Interface MMC memory interface for standard embedded storage connectivity.
- Technology & Type Non-volatile FLASH - NAND memory for persistent data storage.
- Power Wide supply voltage range: 2.7 V to 3.6 V to support common embedded power rails.
- Operating Temperature Specified ambient operating range from −40 °C to 105 °C.
- Package 100‑LBGA package; supplier device package specified as 100‑LBGA (14 × 18 mm) for compact board-level integration.
Unique Advantages
- High storage density: 64 Gbit capacity provides substantial on-board storage for firmware, logs, and application data.
- Standard MMC interface: MMC connectivity simplifies integration with controllers and SoCs that support MMC.
- Flexible power compatibility: 2.7 V to 3.6 V supply range matches common embedded system power rails.
- Extended temperature range: −40 °C to 105 °C operating range supports deployment in thermally demanding environments.
- Compact LBGA package: 100‑LBGA (14 × 18 mm) package enables high-density board layouts and efficient PCB footprint usage.
Why Choose MTFC8GLWDQ-3L AAT Z TR?
The MTFC8GLWDQ-3L AAT Z TR combines a high-density 64 Gbit NAND flash architecture with a standard MMC interface and a compact 100‑LBGA package, offering a straightforward storage option for embedded designs that require persistent, board-mounted memory. Its voltage range and extended operating temperature specification make it suitable for a variety of temperature-sensitive applications.
This device is well-suited for engineers and procurement teams seeking a verified e•MMC™ series part with defined electrical and thermal parameters. Its combination of capacity, interface standardization, and package form factor supports scalable, space-conscious storage integration.
Request a quote or contact sales to obtain pricing, availability, and delivery information for the MTFC8GLWDQ-3L AAT Z TR.
