MTFC8GLWDQ-3L AAT A

The MTFC8GLWDQ-3L AAT A is a 64 Gbit non-volatile NAND flash memory device in Micron's e•MMC™ series. It provides MMC-interface embedded storage in a compact 100-LBGA (14×18) package.

Its architecture—FLASH NAND organized as 8G × 8 with a standard MMC interface—targets designs that require solid-state, removable-style memory in constrained board space. The device supports an input voltage range of 2.7 V to 3.6 V and an operating temperature range of −40 °C to 105 °C (TA).

Key Features

• Memory Type & Technology  Non-volatile FLASH using NAND technology for persistent data storage.
• Capacity & Organization  64 Gbit capacity organized as 8G × 8 to support block-oriented storage needs.
• Interface  MMC memory interface for integration with MMC-compatible host controllers.
• Voltage Supply  Operates from 2.7 V to 3.6 V to match common system power rails.
• Package  100-LBGA package (14×18 mm) optimized for board-level density and solder mounting.
• Operating Temperature  Specified for −40 °C to 105 °C (TA) to support a wide ambient temperature range.
• Series & Manufacturer  Part of the e•MMC™ series from Micron Technology Inc.

Typical Applications

• Embedded Storage  MMC-interface non-volatile storage for embedded systems requiring solid-state memory.
• Consumer Electronics  On-board FLASH memory for devices that use MMC protocol for data and firmware storage.
• Industrial Equipment  Persistent storage in systems operating across a wide temperature range where board-level LBGA packaging is required.
• Portable Devices  Compact 100-LBGA package suited to space-constrained portable and handheld products using MMC connectivity.

Unique Advantages

• High-density storage: 64 Gbit capacity provides substantial non-volatile storage in a single-package solution.
• Standard MMC interface: Simplifies integration with MMC-compatible hosts and existing controller ecosystems.
• Wide voltage compatibility: 2.7 V–3.6 V supply range aligns with common system power rails for flexible deployment.
• Compact BGA package: 100-LBGA (14×18) reduces PCB footprint while enabling reliable solder mounting.
• Extended temperature range: −40 °C to 105 °C (TA) supports designs that operate across broad ambient conditions.

Why Choose MTFC8GLWDQ-3L AAT A?

The MTFC8GLWDQ-3L AAT A positions itself as a high-density e•MMC™ NAND flash option for designs requiring MMC-interface embedded storage in a compact LBGA form factor. Its combination of 64 Gbit capacity, 8G × 8 organization, and wide operating temperature and voltage ranges supports a range of system-level tradeoffs between capacity, board space, and environmental tolerance.

Manufactured by Micron Technology Inc., this device fits applications that need verified NAND FLASH memory with MMC connectivity and a small 100-LBGA (14×18) package. It is suited to engineers and procurement teams specifying MMC-based non-volatile storage where clear electrical and mechanical specifications are required.

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