MTFC8GLWDM-3L AAT Z
| Part Description |
IC FLASH 64GBIT MMC 153TFBGA |
|---|---|
| Quantity | 1,332 Available (as of May 6, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Micron Technology Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 153-TFBGA (11.5x13) | Memory Format | FLASH | Technology | FLASH - NAND | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 64 Gbit | Access Time | N/A | Grade | Automotive | ||
| Clock Frequency | N/A | Voltage | 2.7V ~ 3.6V | Memory Type | Non-Volatile | ||
| Operating Temperature | -40°C ~ 105°C (TA) | Write Cycle Time Word Page | N/A | Packaging | 153-TFBGA | ||
| Mounting Method | Non-Volatile | Memory Interface | MMC | Memory Organization | 8G x 8 | ||
| Moisture Sensitivity Level | 1 (Unlimited) | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Qualification | N/A | ECCN | 3A991B1A | HTS Code | 8542.32.0071 |
Overview of MTFC8GLWDM-3L AAT Z – 64 Gbit e•MMC Flash, 153-TFBGA
The MTFC8GLWDM-3L AAT Z is a 64 Gbit non-volatile flash memory device in an e•MMC series form factor. It implements NAND flash technology with an MMC memory interface for embedded storage applications.
Designed for compact integration, the device offers a wide supply range and extended operating temperature for use in systems that require onboard flash storage in a small BGA package.
Key Features
- Memory Type & Technology Non-volatile NAND flash memory—FLASH - NAND technology provides persistent storage.
- Capacity & Organization 64 Gbit total capacity, organized as 8G × 8.
- Memory Interface MMC interface for standard e•MMC connectivity and integration.
- Voltage Supply Operates from 2.7 V to 3.6 V to support common embedded system power rails.
- Operating Temperature Specified for −40°C to 105°C (TA), suitable for applications requiring extended temperature range.
- Package 153-TFBGA package (11.5 × 13 mm) for compact board-level footprint.
- Series e•MMC™ series device tailored for MMC-based storage implementations.
Unique Advantages
- High-density storage: 64 Gbit NAND flash provides substantial onboard capacity for firmware, data logging, or file storage within a single device.
- Standard MMC interface: MMC connectivity simplifies integration into designs that use e•MMC memory architectures.
- Wide supply compatibility: 2.7 V–3.6 V operation enables use with common 3 V system rails without additional power conversion.
- Extended temperature range: Rated from −40°C to 105°C for deployment in environments that require broader thermal tolerance.
- Compact BGA package: 153-TFBGA (11.5 × 13 mm) minimizes PCB footprint while providing a solderable surface-mount form factor.
Why Choose IC FLASH 64GBIT MMC 153TFBGA?
This MTFC8GLWDM-3L AAT Z device combines 64 Gbit NAND flash capacity with an MMC interface and a compact 153-TFBGA package, making it suitable for embedded designs that require on-board non-volatile storage with a small footprint. Its wide operating voltage and extended temperature range align with applications that demand stable memory operation across varying conditions.
Engineers and procurement teams seeking a high-density e•MMC flash component will find this device straightforward to specify where MMC interface compatibility, compact packaging, and defined electrical and thermal ranges are required.
Request a quote or submit an inquiry for MTFC8GLWDM-3L AAT Z to receive pricing and availability information.
