DRA744BJGABCQ1

IC MPU DRA74X CORTEX-A15 760BGA
Part Description

ARM® Cortex®-A15 Microprocessor IC DRA74x 2 Core, 32-Bit 1GHz 760-FCBGA (23x23)

Quantity 1,488 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesJacinto DRA74x
ManufacturerTexas Instruments
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPARM® Cortex®-M4, BB2D, GPU, IVACore ProcessorARM® Cortex®-A15Device Package760-FCBGA (23x23)
Display & Interface ControllersHDMI, LCDECCNN/AEthernet10/100/1000Mbps (1), 1Gbps (2)
GradeAutomotiveGraphics AccelerationYesHTS CodeN/A
Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface MountMounting TypeSurface Mount
Number of Cores/Bus Width2 Core, 32-BitOperating Temperature-40°C ~ 125°C (TJ)Package / Case760-BFBGA, FCBGA
QualificationAEC-Q100RAM ControllersDDR2, DDR3, DDR3LREACH ComplianceREACH Unknown
RoHS ComplianceROHS3 CompliantSATASATASecurity FeaturesCryptography, Debug Security, Device Identity, Isolation Firewalls, Secure Boot, Secure Storage, Software IP Protection
Speed1GHzSupplier Device Package760-FCBGA (23×23)USBUSB 2.0 (3), USB 3.0 (1)
Voltage – I/O1.35V, 1.8V, 3.3V

Overview of DRA744BJGABCQ1 – IC MPU DRA74X CORTEX-A15 760BGA

The DRA744BJGABCQ1 is an ARM® Cortex®-A15 microprocessor in the Jacinto DRA74x series, featuring a dual-core 32-bit architecture running at 1 GHz. Designed for embedded systems where integration, interface density, and wide operating temperature are required, it consolidates application and real-time processing with multiple co-processors and extensive I/O.

With automotive-grade qualification (AEC-Q100) and a −40°C to 125°C operating range, this device targets demanding embedded and automotive applications that require robust thermal performance and a broad set of peripherals for display, networking, storage and secure operation.

Key Features

  • Core and Performance Dual ARM® Cortex®-A15 32-bit cores at 1 GHz delivering application processing capacity for embedded workloads.
  • Real-time and Acceleration Co-processors Integrated co-processors including ARM® Cortex®-M4, BB2D, GPU and IVA for real-time tasks and graphics/video acceleration.
  • Memory Interfaces Supports DDR2, DDR3 and DDR3L memory controllers to match system memory requirements.
  • Display and Graphics HDMI and LCD display controllers plus graphics acceleration for rich user interfaces and display-driven systems.
  • Connectivity Multiple high-speed interfaces including Ethernet (10/100/1000 Mbps (1), 1 Gbps (2)), SATA, USB 2.0 (3 ports) and USB 3.0 (1 port) for networking and storage integration.
  • Vehicle and Field Interfaces Includes DCANbus for vehicle network integration and other embedded communications.
  • Security Features On-chip cryptography, debug security, device identity, isolation firewalls, secure boot, secure storage and software IP protection to support secure system designs.
  • Package and Mounting 760-ball FCBGA package (760-FCBGA, 23×23) in a surface-mount form factor for dense board designs.
  • Automotive Qualification and Temperature Range AEC-Q100 qualification and an operating temperature range of −40°C to 125°C for automotive and harsh-environment deployment.
  • Regulatory RoHS compliant.

Typical Applications

  • Automotive Systems Engineered for automotive use with AEC-Q100 qualification and DCANbus support, suitable for in-vehicle processing and networked vehicle subsystems.
  • Infotainment and Display Platforms HDMI/LCD controllers and graphics acceleration make it suitable for vehicle or industrial display and infotainment applications.
  • Embedded Networking and Storage Multiple Ethernet ports, SATA and USB interfaces enable networked embedded controllers and local storage solutions.

Unique Advantages

  • Integrated heterogeneous processing: Combines ARM® Cortex®-A15 application cores with an M4 and dedicated accelerators to separate application and real-time workloads on a single device.
  • Broad interface set: On-chip Ethernet, SATA and multiple USB ports reduce external bridge components and simplify system-level integration.
  • Automotive-grade robustness: AEC-Q100 qualification and −40°C to 125°C operating range support deployment in temperature-challenging environments.
  • Security-ready platform: Comprehensive security features such as secure boot and isolation firewalls aid in protecting device identity and software IP.
  • Flexible memory support: DDR2/DDR3/DDR3L memory controller support allows selection of memory technology to meet cost and performance targets.
  • Surface-mount FCBGA package: High-density 760-ball FCBGA (23×23) enables compact PCB layouts for space-constrained designs.

Why Choose DRA744BJGABCQ1?

The DRA744BJGABCQ1 positions itself as a highly integrated embedded microprocessor for designs that require a balance of application processing, real-time handling, multimedia capability and robust I/O. Its dual ARM® Cortex®-A15 cores alongside dedicated co-processors and accelerators let you partition tasks effectively while minimizing external components.

With automotive qualification (AEC-Q100), a wide operating temperature range and a comprehensive set of security and connectivity features, this device is suited to engineers developing automotive-grade and industrial embedded systems that demand long-term reliability and a compact hardware footprint.

Request a quote or submit an inquiry to receive pricing and availability information for the DRA744BJGABCQ1. Our team can provide lead-time details and assist with volume and sourcing needs.

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