DRA745ALGABCRQ1

The DRA745ALGABCRQ1 is an ARM® Cortex®-A15 microprocessor IC from the Jacinto DRA74x series, featuring a dual-core, 32-bit Cortex-A15 implementation running at 1.176 GHz in a 760-FCBGA (23×23) package. It integrates multiple co-processors and a broad set of I/O and multimedia interfaces to address embedded and automotive-grade applications.

Designed for systems requiring combined compute, media and connectivity capabilities, the device delivers a balance of performance, integration and device-level security suitable for embedded and automotive environments where extended temperature range and AEC-Q100 qualification are required.

Key Features

• Core and Performance  Dual ARM® Cortex®-A15 cores at 1.176 GHz providing 32-bit application processing for compute-intensive embedded tasks.
• Integrated Co-processors  On-chip co-processors including ARM® Cortex®-M4, BB2D, C66x, GPU and IVA to offload DSP, graphics and multimedia workloads.
• Memory Support  Built-in RAM controllers supporting DDR2, DDR3 and DDR3L memory interfaces for flexible system memory configurations.
• Display and Graphics  Display interface controllers for HDMI and LCD combined with graphics acceleration support for multimedia and HMI applications.
• Connectivity  Multiple high-speed interfaces including one 10/100 Mbps Ethernet port, one 10/100/1000 Mbps Ethernet port, SATA, three USB 2.0 ports and one USB 3.0 port, plus CANbus for vehicle networks.
• Security Features  On-device security capabilities such as cryptography, debug security, device identity, isolation firewalls, secure boot, secure storage and software IP protection.
• Package and Mounting  760-FCBGA (23×23) package, surface-mount construction suitable for compact system designs.
• Automotive Qualification and Temperature Range  Automotive grade with AEC-Q100 qualification and an operating temperature range of −40 °C to 125 °C.
• Compliance  RoHS compliant.

Typical Applications

• Automotive Embedded Systems  Suitable for automotive-grade control and infotainment modules benefiting from AEC-Q100 qualification and wide operating temperature range.
• Multimedia and Display Controllers  HDMI and LCD display interfaces plus graphics acceleration and IVA/co-processor support make it suited for advanced HMI and multimedia processing.
• Networked and Storage Devices  Integrated Gigabit Ethernet, 10/100 Ethernet and SATA interfaces enable networked storage and high-throughput connectivity functions.
• Vehicle Networks and Control  CANbus support and embedded security features enable integration into vehicle network subsystems and secure control applications.

Unique Advantages

• Highly integrated multimedia and compute: Dual Cortex-A15 cores plus dedicated co-processors (Cortex-M4, BB2D, C66x, GPU, IVA) consolidate application, DSP and graphics processing on a single device.
• Broad connectivity set: Multiple Ethernet options, SATA, USB 3.0/2.0 and CANbus reduce external interface components and simplify system design.
• Automotive-grade reliability: AEC-Q100 qualification and −40 °C to 125 °C operating range support deployment in temperature-demanding automotive environments.
• Comprehensive device security: Built-in cryptography, secure boot, secure storage and isolation firewalls help protect software IP and device identity at the platform level.
• Flexible memory options: Support for DDR2, DDR3 and DDR3L memory controllers enables designers to match memory choices to performance and power targets.
• Compact packaging: 760-FCBGA (23×23) surface-mount package enables high-density board designs while retaining extensive interface capability.

Why Choose DRA745ALGABCRQ1?

The DRA745ALGABCRQ1 positions a capable mix of CPU performance, dedicated co-processors and extensive I/O in an automotive-grade microprocessor package. Its combination of dual Cortex-A15 cores, multimedia acceleration, broad connectivity and on-chip security makes it well suited for embedded and automotive designs that require integrated compute, media and secure connectivity within demanding temperature ranges.

This device is a fit for design teams targeting robust, scalable embedded platforms where integration reduces BOM count and system complexity while AEC-Q100 qualification and an extended operating temperature range support deployment in automotive and other harsh-environment applications.

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