DRA746APGABCQ1

IC MPU DRA74X CORTEX-A15 760BGA
Part Description

ARM® Cortex®-A15 Microprocessor IC DRA74x 2 Core, 32-Bit 1.5GHz 760-FCBGA (23x23)

Quantity 473 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesJacinto DRA74x
ManufacturerTexas Instruments
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPARM® Cortex®-M4, BB2D, GPU, IVACore ProcessorARM® Cortex®-A15Device Package760-FCBGA (23x23)
Display & Interface ControllersHDMI, LCDECCNN/AEthernet10/100/1000Mbps (1), 1Gbps (2)
GradeAutomotiveGraphics AccelerationYesHTS CodeN/A
Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface MountMounting TypeSurface Mount
Number of Cores/Bus Width2 Core, 32-BitOperating Temperature-40°C ~ 125°C (TJ)Package / Case760-BFBGA, FCBGA
QualificationAEC-Q100RAM ControllersDDR2, DDR3, DDR3LREACH ComplianceREACH Unknown
RoHS ComplianceROHS3 CompliantSATASATASecurity FeaturesCryptography, Debug Security, Device Identity, Isolation Firewalls, Secure Boot, Secure Storage, Software IP Protection
Speed1.5GHzSupplier Device Package760-FCBGA (23×23)USBUSB 2.0 (3), USB 3.0 (1)
Voltage – I/O1.35V, 1.8V, 3.3V

Overview of DRA746APGABCQ1 – IC MPU DRA74X CORTEX-A15 760BGA

The DRA746APGABCQ1 is an ARM® Cortex®-A15 microprocessor IC featuring two 32-bit cores at up to 1.5 GHz. It integrates multiple compute and accelerator blocks alongside a broad set of I/O to address embedded and automotive system requirements.

Designed for applications that demand high compute throughput, broad connectivity and hardware security, the device combines dual Cortex‑A15 processing, co-processors and GPU/IVA acceleration with automotive-grade qualification and an extended operating temperature range for robust deployment.

Key Features

  • Core and Performance — Dual ARM® Cortex®-A15 32‑bit cores running up to 1.5 GHz, providing multi-threaded application processing.
  • Co-processors and Acceleration — Integrated ARM® Cortex®-M4, BB2D, GPU and IVA blocks for offloading DSP, graphics and vision workloads.
  • Memory Support — Built-in controllers for DDR2, DDR3 and DDR3L memories to match performance and power targets.
  • Display and Graphics — HDMI and LCD display controllers with graphics acceleration for rich user interfaces and video output.
  • High-speed Connectivity — Multiple USB ports (three USB 2.0 and one USB 3.0) plus SATA for peripheral and storage connectivity.
  • Ethernet and Field Interfaces — Ethernet capability listed as 10/100/1000 Mbps (1) and 1 Gbps (2) ports, along with DCANbus for vehicle networks.
  • Security Features — On-chip cryptography, debug security, device identity, isolation firewalls, secure boot, secure storage and software IP protection.
  • Automotive Qualification and Reliability — Automotive grade device with AEC‑Q100 qualification and operating temperature range of -40 °C to 125 °C.
  • Package and Mounting — 760‑FCBGA supplier device package (23 × 23 mm) in a 760‑BFBGA/FCBGA form factor; surface-mount mounting type.

Typical Applications

  • Automotive Infotainment — HDMI/LCD display controllers, GPU acceleration and multimedia coprocessors support rich vehicle infotainment interfaces.
  • In-vehicle Networking and Gateway — Multiple Ethernet ports and DCANbus enable high-throughput networking and vehicle communication aggregation.
  • Storage and Peripheral Controllers — Integrated SATA and USB 3.0 plus multiple USB 2.0 ports support high-speed storage and peripheral connectivity.
  • Embedded and Industrial Systems — Extended temperature range and AEC‑Q100 qualification make the device suitable for rugged embedded and automotive electronics.

Unique Advantages

  • Highly integrated compute and accelerators: Dual Cortex‑A15 cores plus Cortex‑M4, GPU and IVA consolidate application, control and media processing on a single device.
  • Comprehensive connectivity set: Ethernet, SATA, USB 3.0/2.0 and DCANbus reduce external components and simplify system design.
  • Built-in security stack: Cryptography, secure boot and isolation firewalls provide hardware-backed protection for device identity and IP storage.
  • Automotive‑grade reliability: AEC‑Q100 qualification and -40 °C to 125 °C operating range support deployment in demanding automotive environments.
  • Flexible memory interfaces: Support for DDR2, DDR3 and DDR3L enables designers to balance cost, performance and power for their system needs.
  • Board-level convenience: Surface-mount 760‑FCBGA (23×23) package provides a standardized footprint for high-density PCB designs.

Why Choose DRA746APGABCQ1?

The DRA746APGABCQ1 positions itself as a performance-focused, highly integrated microprocessor IC ideal for embedded and automotive systems that require multi-domain processing, secure operation and broad I/O. With dual Cortex‑A15 cores, dedicated co-processors and graphical/vision accelerators, the device consolidates application, media and control functions into a single automotive‑qualified package.

Its combination of connectivity (Ethernet, USB, SATA, DCAN), on-chip security features and extended temperature range makes it suitable for designs that need long-term robustness and deterministic behavior in harsh environments, while the 760‑FCBGA surface-mount package supports high-density board implementations.

Request a quote or submit an inquiry to receive pricing and availability for the DRA746APGABCQ1. Our team can provide part-specific information and support to help integrate this device into your design.

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