DRA746BPH2ABCRQ1

IC MPU DRA74X CORTEX-A15 760BGA
Part Description

ARM® Cortex®-A15 Microprocessor IC DRA74x 2 Core, 32-Bit 1.5GHz 760-FCBGA (23x23)

Quantity 1,123 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesJacinto DRA74x
ManufacturerTexas Instruments
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPARM® Cortex®-M4, BB2D, C66x, GPU, IVACore ProcessorARM® Cortex®-A15Device Package760-FCBGA (23x23)
Display & Interface ControllersHDMI, LCDECCNN/AEthernet10/100Mbps (1), 10/100/1000Mbps (1)
GradeAutomotiveGraphics AccelerationYesHTS CodeN/A
Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface MountMounting TypeSurface Mount
Number of Cores/Bus Width2 Core, 32-BitOperating Temperature-40°C ~ 125°C (TJ)Package / Case760-BFBGA, FCBGA
QualificationAEC-Q100RAM ControllersDDR2, DDR3, DDR3LREACH ComplianceREACH Unknown
RoHS ComplianceROHS3 CompliantSATASATASecurity FeaturesCryptography, Debug Security, Device Identity, Isolation Firewalls, Secure Boot, Secure Storage, Software IP Protection
Speed1.5GHzSupplier Device Package760-FCBGA (23×23)USBUSB 2.0 (3), USB 3.0 (1)
Voltage – I/O1.35V, 1.8V, 3.3V

Overview of DRA746BPH2ABCRQ1 – IC MPU DRA74X CORTEX-A15 760BGA

The DRA746BPH2ABCRQ1 is an ARM® Cortex®-A15 based microprocessor IC from the Jacinto DRA74x series by Texas Instruments. It integrates a dual-core, 32-bit Cortex‑A15 CPU running at 1.5 GHz in a 760-FCBGA (23×23) package.

Designed for embedded and automotive systems, this device combines high-performance compute, multiple co‑processor engines, a broad set of I/O interfaces and hardware security features, delivering an integrated platform for compute‑intensive and connected designs operating across a wide temperature range.

Key Features

  • Core & Performance – Dual ARM® Cortex®-A15 cores, 32‑bit, up to 1.5 GHz for compute-intensive embedded tasks.
  • Co‑processors & Acceleration – Integrated ARM® Cortex®-M4, BB2D, C66x, GPU and IVA coprocessors to offload signal processing and multimedia workloads.
  • Memory & Display – Memory controller support for DDR2, DDR3 and DDR3L; display interface controllers for HDMI and LCD.
  • Connectivity & Storage – On-chip interfaces include one 10/100 Mbps Ethernet port and one 10/100/1000 Mbps Ethernet port, SATA, three USB 2.0 ports and one USB 3.0 port; additional CANbus interface for vehicle and industrial networks.
  • Security & Device Protection – Hardware security features including cryptography, debug security, device identity, isolation firewalls, secure boot, secure storage and software IP protection.
  • Package & Mounting – 760‑FCBGA supplier device package (23×23); surface mount package case options indicated as 760‑BFBGA/FCBGA.
  • Reliability & Automotive Grade – Grade: Automotive with AEC‑Q100 qualification and an operating temperature range from −40 °C to 125 °C.
  • Standards Compliance – RoHS compliant.

Typical Applications

  • Automotive Infotainment and Cockpit Systems – Drives HDMI/LCD displays and multimedia workloads using integrated GPU and IVA offload engines while meeting automotive qualification requirements.
  • Vehicle Networking and Telematics – Multiple Ethernet ports, CANbus, USB and SATA enable connected gateway, telematics and data‑logging applications.
  • Industrial Control and HMI – Dual high‑performance cores, broad temperature range and robust I/O suit human‑machine interfaces and embedded control systems.

Unique Advantages

  • Highly Integrated Compute Subsystem: Dual Cortex‑A15 cores plus multiple co‑processors provide a versatile platform for mixed compute and signal processing tasks.
  • Comprehensive I/O Set: Gigabit and Fast Ethernet, USB 3.0/2.0, SATA and CANbus reduce external bridging and simplify system design.
  • Automotive Qualification: AEC‑Q100 qualification and automotive grade designation support deployment in vehicle environments requiring validated components.
  • Built‑in Security Primitives: On‑chip cryptography, secure boot and secure storage enable hardware‑anchored protection for firmware and data.
  • Wide Operating Range: −40 °C to 125 °C operating temperature and surface‑mount FCBGA packaging for robust board-level integration.
  • Memory Flexibility: Support for DDR2, DDR3 and DDR3L memory interfaces allows designers to select memory options that match power and performance targets.

Why Choose DRA746BPH2ABCRQ1?

The DRA746BPH2ABCRQ1 positions itself as a high‑performance, automotive‑qualified microprocessor solution combining dual Cortex‑A15 compute, multiple acceleration engines and a wide array of connectivity. Its integrated security features, flexible memory support and broad peripheral set make it suitable for embedded designs that require both compute throughput and system-level integration.

This device is ideal for designers building automotive infotainment, vehicle networking, telematics and industrial HMI applications that demand long‑term robustness, a wide operating temperature range and vendor‑backed qualification status.

Request a quote or submit an inquiry to evaluate the DRA746BPH2ABCRQ1 for your next embedded or automotive design project.

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