HPIXP2350ACT

The HPIXP2350ACT is an Intel IXP2350 network microprocessor designed for embedded networking applications. It integrates an XScale core running at 1.2 GHz with dedicated microengine co-processors to support packet processing workloads.

Targeted at industrial deployments, the device combines on-chip memory controllers, multiple Gigabit Ethernet interfaces, and hardware security support to deliver a compact, integrated solution for network and communications equipment.

Key Features

• Core — XScale single-core 32-bit processor operating at 1.2 GHz, providing processing headroom for embedded networking tasks.
• Co-Processors (DSP) — Microengine co-processors for offloading specialized packet processing or compute tasks from the main core.
• Memory — Integrated RAM controllers supporting DDR and SDRAM to accommodate system and packet buffering requirements.
• Network Interfaces — Two Gigabit Ethernet ports for high-throughput connectivity and link-level interface integration.
• Security — Hardware support for 3DES to enable encrypted communication and secure data handling.
• Additional I/O — General-purpose I/O (GPIO) for control, status, and peripheral interfacing.
• Graphics — No graphics acceleration, focusing silicon resources on networking and processing.
• Package & Mounting — 1752-FCBGA package (42.5 × 42.5 mm) designed for surface-mount PCB assembly.
• Industrial Grade & Temperature — Industrial-grade device rated for operation from 0 °C to 105 °C.
• Environmental Compliance — RoHS compliant.

Typical Applications

• Network Appliances — Suitable for embedded routers and switches that require integrated Gigabit Ethernet and packet processing capability.
• Edge Communications — Designed for edge devices that need on-board processing plus secure links via 3DES.
• Industrial Networking — Industrial deployments that benefit from the device's extended temperature range and surface-mount 1752-FCBGA package.
• Security Appliances — Appliances requiring hardware cryptographic support for encrypted data paths.

Unique Advantages

• Integrated Processing and Offload: XScale core combined with microengine co-processors enables distribution of tasks between main CPU and specialized engines to optimize throughput.
• Built-in Memory Support: On-chip DDR and SDRAM controllers simplify memory subsystem design and reduce external component count.
• Dual Gigabit Connectivity: Two integrated Gigabit Ethernet interfaces provide high-bandwidth links without additional MAC/PHY components.
• Hardware Security: 3DES support allows encrypted communications to be handled on-chip, reducing software overhead.
• Industrial Robustness: Rated for 0 °C to 105 °C and supplied in a high-pin-count FCBGA package suitable for industrial embedded systems.
• Compliance Ready: RoHS compliance supports environmental and regulatory considerations in product design.

Why Choose HPIXP2350ACT?

The HPIXP2350ACT positions itself as an integrated, industrial-grade network processor that pairs a 1.2 GHz XScale core with microengine co-processors, dual Gigabit Ethernet, memory controllers, and hardware 3DES security. This combination addresses the needs of embedded networking and communications designs that require on-chip processing, connectivity, and encryption.

Engineered for industrial environments and supplied by Intel, the HPIXP2350ACT is suited for designers seeking a compact, RoHS-compliant solution that balances processing performance, interface integration, and operational robustness.

Request a quote or contact sales to discuss availability, pricing, and design-in support for the HPIXP2350ACT.