HPIXP2350ADT

INTEL IXP2350 NETWORK PROCESSOR
Part Description

IXP2350 NETWORK PROCESSOR

Quantity 749 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesIXP2350
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time1 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMicroengineCore ProcessorXscaleDevice Package1752-FCBGA (42.5x42.5)
ECCNPendingGradeIndustrialGraphics AccelerationNo
HTS Code0000.00.0000Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface Mount
Number of Cores/Bus Width1 Core, 32-BitOperating Temperature0 °C – 105 °CPackage / Case1752-FCBGA
RAM ControllersDDR, SDRAMREACH ComplianceREACH UnaffectedRoHS ComplianceRoHS non-compliant
SATAGigabit Ethernet (2)Speed1.2 GHz

Overview of HPIXP2350ADT – INTEL IXP2350 NETWORK PROCESSOR

The HPIXP2350ADT is an Intel IXP2350 network microprocessor IC based on an XScale core running at 1.2 GHz. Designed for embedded applications, it combines a 32‑bit XScale core with dedicated microengine co‑processors and integrated memory controllers to address industrial networking and communications tasks.

Its feature set—dual Gigabit Ethernet interfaces, DDR/SDRAM controllers, hardware 3DES security support, and an industrial temperature grade—targets embedded and industrial network appliance applications that require sustained throughput and hardware offload capabilities.

Key Features

  • Core  Single 32‑bit XScale core operating at 1.2 GHz, providing deterministic processing for embedded workloads.
  • Co‑processors  Integrated microengine DSP co‑processors for offloading specialized packet processing or data‑plane tasks from the main core.
  • Memory  Onboard controllers for DDR and SDRAM to support system memory requirements for networking and buffering.
  • Network Interfaces  Dual Gigabit Ethernet ports (2) plus general‑purpose I/O (GPIO) for connectivity and control in communications designs.
  • Security  Hardware 3DES support for accelerated encryption/decryption operations.
  • Package & Mounting  1752‑FCBGA package (42.5 × 42.5 mm) in a surface‑mount form factor suitable for compact board designs.
  • Operating Range & Grade  Industrial grade device specified for operation from 0 °C to 105 °C.
  • RoHS Compliance  RoHS compliant for environmentally regulated applications.
  • Graphics  No graphics acceleration—focus is on network processing and embedded compute.

Typical Applications

  • Industrial Networking Equipment  Dual Gigabit Ethernet and industrial temperature rating make it suitable for switches, media gateways, and protocol converters in factory or plant environments.
  • Edge and Access Routers  XScale core plus microengines and hardware 3DES enable packet handling and encrypted traffic processing at the network edge.
  • Network Appliances  Ideal for appliances requiring integrated DDR/SDRAM support and multiple Ethernet ports for traffic aggregation and packet inspection.

Unique Advantages

  • Balanced processing and offload: The 1.2 GHz XScale core combined with microengine co‑processors lets designs partition control‑plane and data‑plane workloads efficiently.
  • Integrated memory controllers: DDR and SDRAM support simplifies system memory design and buffering for networking applications.
  • Dual Gigabit Ethernet: Two gigabit interfaces provide native high‑speed connectivity for networked embedded systems.
  • Hardware security support: On‑chip 3DES accelerates encryption tasks without relying solely on the main CPU.
  • Industrial robustness: Specified 0 °C to 105 °C operating range and industrial grade classification for deployment in challenging environments.
  • Compact board-level integration: 1752‑FCBGA (42.5 × 42.5 mm) surface‑mount package supports dense PCB layouts.

Why Choose HPIXP2350ADT?

The HPIXP2350ADT positions itself as an integrated network processor for embedded and industrial communication designs, combining a 1.2 GHz XScale core, microengine co‑processors, dual Gigabit Ethernet, and hardware 3DES. Its on‑chip DDR/SDRAM controllers and surface‑mount 1752‑FCBGA package support compact, high‑throughput board designs that require industrial temperature capability.

This device is suited to engineers building robust network appliances, edge routers, and industrial networking equipment who need a balance of processing performance, hardware offload, and thermal tolerance in a single, RoHS‑compliant component.

Request a quote or submit an inquiry to discuss availability, pricing, and lead times for HPIXP2350ADT. Our team can provide the details you need to evaluate this device for your design.

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