LS101MASN7DFA

The LS101MASN7DFA is a single‑core ARM1136JF‑S microprocessor from the NXP Semiconductors LS101M series, delivering 32‑bit processing at 650 MHz in a compact 448‑PBGA package with heat spreader. It is offered as a surface‑mount microprocessor targeted for embedded applications.

Designed with integrated system interfaces including DDR2 memory controller, dual Gigabit Ethernet ports, USB 2.0 with PHY and I2C, the device provides a balanced combination of processing capability and on‑chip connectivity for embedded designs operating within a 0 °C to 70 °C range. The device is RoHS compliant.

Key Features

• Core and Performance — ARM1136JF‑S single 32‑bit core running at 650 MHz for deterministic embedded processing.
• Memory Subsystem — Integrated DDR2 RAM controller to support external memory interfacing.
• Wired Networking — Two Gigabit Ethernet (GbE) interfaces for high‑speed network connectivity.
• USB Connectivity — USB 2.0 with integrated PHY (1) for host/device interfacing.
• Peripheral Interfaces — I2C interface for sensor, peripheral or control bus integration.
• Package and Thermal — 448‑PBGA with heat spreader (23 × 23 mm) and exposed pad FBGA package for board‑level thermal management; surface mount mounting.
• Operating Range and Compliance — Rated for 0 °C to 70 °C operating temperature and RoHS compliant.

Typical Applications

• Embedded control systems — Single‑core 32‑bit processing and DDR2 support suit compact embedded controllers and application processors.
• Networked embedded devices — Dual GbE interfaces provide native wired networking for devices that require multiple Ethernet links.
• Connectivity gateways — USB 2.0 with PHY plus I2C and Ethernet interfaces enable protocol bridging and peripheral integration in gateway designs.
• Industrial and commercial equipment — Surface‑mount 448‑PBGA package with heat spreader and 0 °C to 70 °C rating fits thermally managed, space‑constrained assemblies.

Unique Advantages

• Integrated connectivity — Built‑in dual GbE, USB 2.0 + PHY and I2C reduce external interface components and simplify BOM.
• Compact thermal package — 448‑PBGA with heat spreader provides a board‑level solution for improved heat dissipation in small form factors.
• Memory interface support — DDR2 controller enables straightforward connection to external DRAM for application memory requirements.
• Clear operating specifications — Defined 0 °C to 70 °C operating range supports designs targeting commercial temperature environments.
• Regulatory compliance — RoHS compliance aligns with common environmental requirements for electronic assemblies.

Why Choose LS101MASN7DFA?

The LS101MASN7DFA positions as a single‑core, 32‑bit microprocessor offering 650 MHz performance with integrated memory and multiple high‑speed interfaces suitable for embedded and networked designs. Its combination of DDR2 support, dual Gigabit Ethernet ports, USB 2.0 + PHY and I2C provides a compact, connectivity‑focused solution for developers building space‑constrained systems.

This device is appropriate for designers seeking a RoHS‑compliant, surface‑mount microprocessor in a thermally managed PBGA package with clear operating temperature specifications. It is well suited to projects that require integrated Ethernet and USB connectivity alongside external DRAM support.

Request a quote or submit an inquiry to receive pricing and availability for LS101MASN7DFA and discuss how it fits your embedded design requirements.