LS1020ASE8KQB

IC MPU QORIQ 1.0GHZ 525FCPBGA
Part Description

ARM® Cortex®-A7 Microprocessor IC QorIQ® Layerscape 2 Core, 32-Bit 1.0GHz 525-FCPBGA (19x19)

Quantity 1,353 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesLS1020A
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time18 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON™ SIMDCore ProcessorARM® Cortex®-A7Device Package525-FCPBGA (19x19)
ECCNPENDING ECCNEthernetGbE (3)HTS Code0000.00.0000
Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface MountMounting TypeSurface Mount
Number of Cores/Bus Width2 Core, 32-BitOperating Temperature0°C ~ 105°CPackage / Case525-FBGA, FCBGA
RAM ControllersDDR3L, DDR4REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 Compliant
SATASATA 3Gbps (1)Security FeaturesSecure Boot, TrustZone®Speed1.0GHz
Supplier Device Package525-FCPBGA (19×19)USBUSB 2.0 (1), USB 3.0 + PHY

Overview of LS1020ASE8KQB – ARM Cortex-A7 1.0 GHz Dual‑Core QorIQ Layerscape MPU

The LS1020ASE8KQB is an NXP QorIQ Layerscape microprocessor featuring dual ARM® Cortex®-A7 cores running at 1.0 GHz in a 525‑FCPBGA (19×19) package. It combines multicore compute, advanced security primitives and a broad set of high-speed interfaces for embedded and networking-class designs.

Targeted for power‑sensitive communications and industrial applications, the device delivers integrated connectivity (multiple Gigabit Ethernet ports, USB 3.0 with PHY, SATA) alongside memory flexibility and system reliability features to simplify platform design.

Key Features

  • Core  Dual ARM® Cortex®-A7 cores at 1.0 GHz with NEON™ SIMD and floating-point support for multimedia and packet-processing workloads.
  • Memory  DDR3L and DDR4 memory controller support to match system performance and power targets.
  • Interfaces  Integrated high-speed I/O including up to three Gigabit Ethernet ports, SATA 3 Gbps, USB 2.0 and USB 3.0 with integrated PHY, and multichannel SerDes for additional peripheral connectivity.
  • System Reliability  ECC protection on L1 and L2 caches and cache coherency features for robust operation in deployed systems.
  • Security  Secure Boot and ARM TrustZone® support to enable platform root of trust and trusted execution environments.
  • Package & Mounting  525‑FCPBGA (19×19) surface-mount package; operating temperature range 0 °C to 105 °C.
  • Standards & Compliance  RoHS compliant.

Typical Applications

  • Enterprise Access Points and Routers  Enables packet processing, QoS and connectivity for 802.11ac/n APs and routing platforms with multiple GbE ports and low-power cores.
  • Security Appliances  Provides processing and hardware-assisted security (Secure Boot, TrustZone®) for firewall, VPN and inspection appliances.
  • IoT Gateways  Acts as a gateway controller with consolidated USB, SATA and serial interfaces for device aggregation and local data handling.
  • Industrial Controllers  Dual-core compute and DDR memory support accommodate control and data-logging tasks in compact embedded controllers.
  • Building Automation & Smart Energy  Connectivity and security features support distributed control, monitoring and secure communications in automation and energy systems.

Unique Advantages

  • Highly integrated connectivity: On-chip support for multiple Gigabit Ethernet ports, USB 3.0 with integrated PHY and SATA reduces external components and BOM complexity.
  • Balanced multicore performance: Dual ARM Cortex‑A7 cores with NEON SIMD and FPU deliver efficient compute for networking and multimedia tasks while minimizing power.
  • Built-in platform security: Secure Boot and ARM TrustZone® enable hardware-rooted security models required by modern networking and IoT applications.
  • Memory flexibility: Support for DDR3L and DDR4 gives designers options to optimize for cost, performance or power.
  • Robust system reliability: ECC protection on caches and coherent cache architecture improve data integrity in long‑running embedded systems.
  • Compact, manufacturable package: 525‑FCPBGA (19×19) surface-mount package and 0 °C to 105 °C operating range suit a variety of production and deployment environments.

Why Choose LS1020ASE8KQB?

The LS1020ASE8KQB positions itself as a practical, integrated microprocessor for networking and embedded designs that require multicore processing, secure boot capability and extensive I/O in a compact package. Its combination of dual ARM Cortex‑A7 cores, NEON SIMD, and multiple high-speed interfaces makes it appropriate for systems that must balance compute performance with energy efficiency and integration.

This device is suited to engineers and procurement teams developing routers, gateways, security appliances, industrial controllers and building automation equipment who need a verified platform with onboard security features, ECC-protected caches and flexible memory and I/O options. RoHS compliance and a defined operating temperature range support manufacturability and deployment planning.

Request a quote or submit a procurement inquiry to receive pricing, availability and lead-time information for the LS1020ASE8KQB.

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