LS102MASE7EHA

The LS102MASE7EHA from NXP Semiconductors is an ARM1136JF-S based microprocessor featuring two 32‑bit cores running at 650 MHz. Packaged in a 448‑PBGA with heat spreader, this device targets embedded applications that require integrated networking and peripheral interfaces alongside compact board-level integration.

With on‑chip DDR2 memory controller support and multiple wired interfaces, the LS102MASE7EHA is suited to embedded designs where dual‑core processing and Ethernet connectivity are primary requirements.

Key Features

• Core Dual ARM1136JF-S cores, 32‑bit architecture operating at 650 MHz for parallel processing in embedded workloads.
• Memory Integrated DDR2 RAM controller to interface with external DDR2 memory devices.
• Interfaces Two Gigabit Ethernet (GbE) ports and one USB 2.0 with PHY provide wired networking and host/peripheral connectivity; additional I2C interface for low‑speed peripheral control.
• Package & Mounting 448‑PBGA supplier package with heat spreader (23x23) and 448‑FBGA exposed pad package case; surface mount device for board‑level assembly.
• Graphics No graphics acceleration included, focusing device resources on compute and I/O tasks.
• Operating Range & Compliance Commercial operating temperature range of 0 °C to 70 °C and RoHS compliance for environmental conformity.

Typical Applications

• Embedded Systems — Dual 32‑bit cores and DDR2 support make the device suitable for general embedded control and processing tasks in compact systems.
• Networked Embedded Appliances — Two GbE interfaces enable deployment in networked devices that require multiple wired Ethernet connections.
• USB‑Enabled Devices — Onboard USB 2.0 with PHY supports designs that need USB connectivity for peripherals or host functions.

Unique Advantages

• Dual‑core 32‑bit processing: Enables concurrent task execution for responsive embedded applications.
• 650 MHz operating frequency: Provides a defined performance point for compute‑centric embedded workloads.
• Dual Gigabit Ethernet: Built‑in GbE interfaces reduce external PHY/BOM requirements for networked designs.
• Integrated DDR2 controller: Simplifies memory subsystem design with direct DDR2 support.
• Robust package with heat spreader: 448‑PBGA supplier package with heat spreader (23x23) supports thermal management on densely populated boards.
• RoHS compliant: Aligns with environmental and manufacturing requirements for lead‑free assembly.

Why Choose LS102MASE7EHA?

The LS102MASE7EHA combines dual ARM1136JF‑S cores, integrated DDR2 memory control, and multiple wired interfaces in a compact 448‑PBGA package with heat spreader, delivering a balanced mix of processing and connectivity for embedded designs. Its feature set is tailored for customers building networked or USB‑enabled embedded systems that require straightforward integration and defined commercial temperature operation.

As an NXP Semiconductors product in the LS102M series, this microprocessor provides a clear platform choice for developers and procurement teams seeking a manufacturer‑supported MPU with on‑chip interfaces and a compact package for surface‑mount assembly.

Request a quote or submit an inquiry to receive pricing and availability information for the LS102MASE7EHA and to discuss how it fits your embedded design requirements.