LS1046ASE8Q1A

IC MPU QORIQ 1.6GHZ 780FCPBGA
Part Description

ARM® Cortex®-A72 Microprocessor IC QorIQ® Layerscape 4 Core, 64-Bit 1.6GHz 780-FCPBGA (23x23)

Quantity 270 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesLS1046A
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time18 Weeks
Datasheet

Specifications & Environmental

Core ProcessorARM® Cortex®-A72Device Package780-FCPBGA (23x23)ECCN5A002A1 NXP
Ethernet10GbE (2), 2.5GbE (1), 1GbE (4)HTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width4 Core, 64-Bit
Operating Temperature0°C ~ 105°CPackage / Case780-FBGA, FCBGARAM ControllersDDR4
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSATASATA 6Gbps (1)
Security FeaturesSecure Boot, TrustZone®Speed1.6GHzSupplier Device Package780-FCPBGA (23×23)
USBUSB 3.0 (3) + PHY

Overview of LS1046ASE8Q1A – IC MPU QORIQ 1.6GHZ 780FCPBGA

The LS1046ASE8Q1A is an NXP QorIQ Layerscape microprocessor featuring four ARM® Cortex®‑A72 64‑bit cores at 1.6 GHz in a 780‑FCPBGA (23 mm × 23 mm) package. It integrates high‑speed I/O, memory controllers and hardware acceleration to support embedded networking and communications applications.

Designed for embedded systems requiring multicore performance, extensive networking interfaces and on‑chip security, this device delivers a compact, surface‑mount solution with DDR4 support, multiple Ethernet options and hardware data‑path acceleration.

Key Features

  • Core & cache — Four ARM® Cortex®‑A72 64‑bit cores with single‑threaded cores and a shared 2 MB L2 cache; per‑core L1 instruction and data caches as specified in the device datasheet.
  • Performance — 1.6 GHz core frequency for multi‑threaded embedded workloads and system control tasks.
  • Memory — DDR4 SDRAM controller with ECC and interleaving support; DDR4 interface details per datasheet (up to 2.1 GT/s listed in technical data).
  • Network interfaces & acceleration — Multiple Ethernet options including two 10GbE, one 2.5GbE and four 1GbE ports; Data Path Acceleration Architecture (DPAA) for packet parsing/classification (FMan), queue management (QMan), buffer management (BMan), cryptography acceleration (SEC) and IEEE 1588 support.
  • High‑speed I/O — Three PCIe 3.0 controllers, SATA 6 Gbps controller, three USB 3.0 controllers with integrated PHY and up to eight SerDes lanes supporting high‑speed peripheral connectivity (per datasheet).
  • Storage & peripheral controllers — Integrated flash controller (IFC) for NAND/NOR, QSPI, SPI, enhanced SD host (SD 3.0 / eMMC 4.4/4.5) and multiple UARTs and I2C controllers for system integration.
  • Security — Secure Boot and ARM TrustZone® support for platform integrity and trusted execution.
  • Package & reliability — 780‑FBGA (780‑FCPBGA) 23 mm × 23 mm surface‑mount package; consumer qualification and RoHS compliance; operating temperature range 0 °C to 105 °C.

Typical Applications

  • Network appliances — Routing, switching and edge compute devices that require multiple 10GbE/1GbE interfaces and packet processing acceleration.
  • Security and firewall appliances — On‑chip cryptographic acceleration and Secure Boot/TrustZone® enable secure packet processing and trusted platform deployment.
  • Industrial and edge gateways — DDR4 memory with ECC, diverse I/O (PCIe, SATA, USB, SD) and hardened thermal monitoring for embedded gateway functions.
  • Storage and media controllers — SATA 6 Gbps plus integrated flash controllers and USB 3.0 ports for local storage and media handling.

Unique Advantages

  • Highly integrated multicore processing: Four Cortex‑A72 cores and a shared 2 MB L2 cache provide a compact compute foundation for embedded workloads.
  • Comprehensive networking and acceleration: Multiple 10GbE/2.5GbE/1GbE interfaces combined with DPAA offloads packet parsing, queuing and buffer management to improve data‑plane efficiency.
  • Extensive high‑speed I/O: PCIe 3.0, SATA 6 Gbps and USB 3.0 with integrated PHY minimize external glue logic for peripheral expansion and storage connectivity.
  • Built‑in platform security: Secure Boot and TrustZone® provide foundational mechanisms for device integrity and secure execution environments.
  • Compact, standardized packaging: 780‑FCPBGA (23×23 mm) surface‑mount package simplifies board layout for space‑constrained embedded designs.
  • Manufacturing and compliance: RoHS‑compliant construction and consumer qualification support typical embedded production requirements.

Why Choose LS1046ASE8Q1A?

The LS1046ASE8Q1A positions itself as a performance‑oriented, highly integrated Layerscape solution for embedded networking, security and gateway applications. The combination of four 64‑bit Cortex‑A72 cores at 1.6 GHz, DDR4 with ECC, extensive high‑speed I/O and DPAA hardware acceleration provides a balanced platform for data‑plane and control‑plane tasks.

Backed by NXP Semiconductors engineering and documented technical data, this device is suited to designers who need multicore processing, robust I/O options and built‑in security in a compact surface‑mount package for production‑grade embedded systems.

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