LS1088ASE7Q1A

IC MPU QORIQ 1.6GHZ 780FBGA
Part Description

ARM® Cortex®-A53 Microprocessor IC QorIQ® Layerscape 8 Core, 64-Bit 1.6GHz 780-FBGA (23x23)

Quantity 185 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesLS1088A
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time18 Weeks
Datasheet

Specifications & Environmental

Core ProcessorARM® Cortex®-A53Device Package780-FBGA (23x23)ECCN5A002A1 FRE
Ethernet10GbE (2), 1GbE (8)HTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width8 Core, 64-Bit
Operating Temperature0°C ~ 105°CPackage / Case780-BFBGA, FCBGARAM ControllersDDR4
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSATASATA 6Gbps (1)
Security FeaturesSecure Boot, TrustZone®Speed1.6GHzSupplier Device Package780-FBGA (23×23)
USBUSB 3.0 (2) + PHY

Overview of LS1088ASE7Q1A – IC MPU QORIQ 1.6GHZ 780FBGA

The LS1088ASE7Q1A is an NXP QorIQ Layerscape microprocessor featuring up to eight ARM® Cortex®-A53 64-bit cores running at 1.6 GHz in a 780-FBGA (23×23) package. It integrates high-performance datapath acceleration and a broad set of networking and peripheral interfaces targeted at intelligent edge, networking and industrial use cases.

Designed for applications such as intelligent edge access, NFV, wireless access point control, virtual CPE (vCPE) and industrial networking, the device combines multi-core CPU performance with DPAA2 acceleration and a comprehensive I/O set to simplify high-throughput packet processing and system integration.

Key Features

  • Core  Eight ARM® Cortex®-A53 64-bit cores operating up to 1.6 GHz for multi-threaded application and network processing.
  • Memory  Integrated DDR4 memory controller to support modern high-bandwidth system memory configurations.
  • Networking  Dual 10GbE and eight 1GbE interfaces for flexible high-speed connectivity and aggregation.
  • High-speed SerDes and PCIe  4‑lane 10 GHz SerDes lanes and multiple PCIe 3.0 interfaces for high-bandwidth external PHYs and accelerators.
  • Storage and USB  One SATA 6 Gbps port and two USB 3.0 ports with PHY for storage and host/device USB connectivity.
  • Security and Boot  Hardware support for Secure Boot and ARM TrustZone® to enable trusted boot and secure execution domains.
  • Datapath Acceleration (DPAA2)  NXP’s second-generation DPAA2 architecture and accelerators to offload networking tasks from general-purpose cores.
  • Software Toolkit and OS  Supported by NXP’s software toolkit and a Linux® environment to simplify development and hardware abstraction.
  • Package and Mounting  780-FBGA (23×23) FCBGA package, surface mountable for compact system designs.
  • Operating Range & Qualification  Operating temperature range 0 °C to 105 °C; device qualification listed as Consumer.

Typical Applications

  • Intelligent Edge Access  Offload and accelerate edge packet processing and control functions using the DPAA2 datapath architecture.
  • NFV and Virtualized CPE  Multi-core CPU cluster and accelerators enable virtualization and software-defined network functions for vCPE and NFV solutions.
  • Wireless Access Point Control  High-performance cores and integrated high-speed Ethernet interfaces for control-plane and data-plane tasks in wireless infrastructure.
  • Industrial Networking  Deterministic networking assist and robust I/O options for industrial communications and control applications.

Unique Advantages

  • High multi-core throughput: Eight Cortex‑A53 cores at up to 1.6 GHz provide parallel processing headroom for packet and application workloads.
  • Integrated datapath acceleration (DPAA2): Hardware accelerators reduce CPU load for networking tasks, improving overall system efficiency.
  • Broad high-speed I/O: Dual 10GbE, multiple 1GbE, PCIe 3.0, SerDes and SATA simplify connectivity and minimize external components.
  • Security primitives: Secure Boot and TrustZone® support enable implementation of trusted boot and secure execution environments.
  • Developer-focused software support: NXP’s SDK and Linux environment provide software abstraction and accelerate time-to-deployment.
  • Compact, surface-mount package: 780-FBGA (23×23) package supports high-density system designs and production assembly.

Why Choose LS1088ASE7Q1A?

The LS1088ASE7Q1A positions a balanced combination of multi-core ARM® processing and dedicated datapath acceleration in a single, highly integrated device. Its mix of high-speed Ethernet, SerDes, PCIe and storage interfaces makes it well suited for designers building intelligent edge, NFV, wireless infrastructure and industrial networking systems that require both performance and integration.

Backed by NXP’s software toolkit and a Linux®-based development environment, the LS1088ASE7Q1A offers a practical platform for developers seeking scalable compute, hardware accelerators and security features in consumer-qualified designs.

Request a quote or submit a pricing request for LS1088ASE7Q1A to begin your procurement or design evaluation.

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