LS2088ASN711B

IC MPU QORIQ 2.1GHZ 1292FCPBGA
Part Description

ARM® Cortex®-A72 Microprocessor IC QorIQ® Layerscape 8 Core, 64-Bit 2.1GHz 1292-FCPBGA (37.5x37.5)

Quantity 752 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesLS2088A
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time18 Weeks
Datasheet

Specifications & Environmental

Core ProcessorARM® Cortex®-A72Device Package1292-FCPBGA (37.5x37.5)ECCNN/A
Ethernet10GbE (8), 2.5GbE (16)HTS CodeN/AMoisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width8 Core, 64-Bit
Operating Temperature0°C ~ 105°C (TA)Package / Case1292-BBGA, FCBGARAM ControllersDDR4
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSATASATA 6Gbps (2)
Speed2.1GHzSupplier Device Package1292-FCPBGA (37.5×37.5)USBUSB 3.0 + PHY (2)

Overview of LS2088ASN711B – IC MPU QORIQ 2.1GHZ 1292FCPBGA

The LS2088ASN711B is an NXP QorIQ Layerscape microprocessor IC based on ARM® Cortex®-A72 cores. It delivers eight 64‑bit cores running at up to 2.1 GHz and is targeted at embedded designs that require multi‑core processing and extensive high‑speed I/O integration.

With DDR4 memory support, broad Ethernet connectivity, storage and PCIe interfaces, and on‑chip security features such as Secure Boot and TrustZone®, the LS2088ASN711B is positioned for embedded and communications applications that combine compute density with advanced I/O and datapath acceleration.

Key Features

  • Processing  ARM® Cortex®-A72 architecture with eight 64‑bit cores and a maximum frequency of 2.1 GHz, providing multi‑threaded compute capability for embedded workloads.
  • Memory subsystem  DDR4 memory controllers with ECC support; datasheet notes two 64‑bit DDR4 SDRAM controllers with ECC and interleaving support.
  • Datapath acceleration  Datapath acceleration architecture (DPAA2) including packet parsing/classification (WRIOP), queue and buffer management (QBMan), cryptography acceleration (SEC 5.2), pattern matching (PME 2.0) and compression/decompression (DCE 1.0) as described in the datasheet.
  • High‑speed networking  Up to eight 10 Gbps Ethernet MACs and up to sixteen 1 / 2.5 Gbps Ethernet MACs to support dense networking ports and multi‑lane connectivity.
  • PCI Express and SerDes  Four PCIe 3.0 controllers with flexible lane widths and support details in the datasheet; 16 SerDes lanes supporting high serial rates.
  • Storage and USB  Two SATA 6 Gbps controllers (SATA 3.0) and two USB 3.0 controllers with integrated PHY for high‑speed storage and peripheral connections.
  • Security and boot  Secure Boot and Arm® TrustZone® support plus a service processor providing pre‑boot initialization and secure‑boot capabilities (as described in the datasheet).
  • Peripheral interfaces  Integrated SPI, QSPI, four I2C controllers, enhanced SD host controller, two DUARTs and an Integrated Flash Controller (IFC 2.0) for broad peripheral support.
  • Package, mounting and thermal  1292‑ball FCPBGA package (1292‑FCPBGA, 37.5 × 37.5 mm), surface mount, rated for operation from 0 °C to 105 °C.
  • Compliance  RoHS compliant and qualified with a consumer classification per the provided specifications.
  • Graphics  No graphics acceleration included, as specified.

Typical Applications

  • Embedded networking and edge routers  Multi‑core processing and multiple 10GbE/2.5GbE MACs plus DPAA2 acceleration make the device suitable for packet processing and edge networking platforms.
  • Network security and appliance platforms  On‑chip cryptography acceleration and Secure Boot/TrustZone support enable secure VPN, firewall and security gateway implementations.
  • Storage gateways and NAS controllers  Dual SATA 6 Gbps controllers, integrated flash controller and USB 3.0 support storage interface and gateway functions.
  • High‑performance embedded compute  Eight Cortex‑A72 cores and DDR4 memory support enable compute‑intensive embedded applications requiring high concurrency and I/O bandwidth.

Unique Advantages

  • High compute density: Eight 64‑bit Cortex‑A72 cores at up to 2.1 GHz provide substantial parallel processing for embedded workloads.
  • Integrated datapath acceleration: DPAA2 elements (packet parsing, queue management, crypto, pattern matching, compression) reduce software overhead for networking and data‑plane functions.
  • Extensive high‑speed I/O: Multiple 10GbE/2.5GbE MACs, PCIe 3.0 controllers, SATA and USB 3.0 simplify system design by consolidating I/O on a single device.
  • Security and secure boot features: Secure Boot, TrustZone® and a service processor for pre‑boot initialization help protect platform integrity from power‑on.
  • Robust memory and storage support: DDR4 with ECC, integrated flash controller and SATA support enable reliable data handling and storage subsystem integration.
  • Package and thermal suitability: 1292‑ball FCPBGA package and a 0 °C to 105 °C operating range accommodate dense, surface‑mount embedded board designs.

Why Choose LS2088ASN711B?

The LS2088ASN711B combines an eight‑core ARM® Cortex®‑A72 compute cluster with a comprehensive set of high‑speed interfaces and datapath acceleration features. Its integrated DDR4 memory controllers, multiple Ethernet MACs, PCIe lanes, SATA and USB controllers provide a consolidated platform for embedded and communications designs that require both compute and I/O density.

This device is suited to developers building embedded networking, security, storage gateway or other high‑bandwidth embedded platforms who need hardware acceleration for packet processing and cryptography, plus industry‑standard interfaces to simplify system integration and reduce BOM complexity.

Request a quote or submit an RFQ to get pricing and availability for the LS2088ASN711B and start integrating this Layerscape processor into your next embedded design.

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