M82172G23

The M82172G23 from NXP Semiconductors is an ARM® Cortex®-A9 microprocessor IC featuring dual 32-bit cores running at 1.2 GHz. Designed for embedded system applications, the device integrates a range of connectivity and storage interfaces to support networking, storage, and peripheral-rich designs.

As part of the M82172 series, this MPU combines performance with on-chip integration—offering multiple Gigabit Ethernet ports, SATA channels, USB interfaces, and security features to streamline system architecture.

Key Features

• Core  ARM® Cortex®-A9 dual-core, 32-bit architecture running at 1.2 GHz for multi-threaded embedded processing.
• Memory  Integrated DDR3 RAM controller to support common system memory configurations.
• Networking  Three Gigabit Ethernet (GbE) ports for multi-port networking and communication tasks.
• Storage  Two SATA 3 Gbps interfaces for direct connection to storage devices and array designs.
• USB  USB 3.0 with PHY plus a USB 2.0 port with PHY to support high-speed and legacy peripheral connectivity.
• Security  Secure Boot and TrustZone® technologies to enable trusted boot sequences and secure execution domains.
• Package & Mounting  672-TEPBGA (27×27) package, 672-BGA supplier device package, surface-mount mounting type for compact PCB integration.
• Additional Interfaces  I2C available for low-speed control and sensor interfaces.
• Operating Range  Rated for operation from 0 °C to 70 °C.
• Environmental  RoHS compliant.

Typical Applications

• Networking and gateway appliances  Triple Gigabit Ethernet ports allow the M82172G23 to serve as the processing core for routers, switches, and industrial gateways requiring multiple wired interfaces.
• Storage and NAS systems  Dual SATA 3 Gbps channels provide direct connectivity for small-scale storage appliances and network-attached storage designs.
• Embedded controllers and appliances  DDR3 memory support, I/O options, and integrated USB interfaces make the device suitable for complex embedded control and appliance applications.
• Peripheral-rich devices  On-chip USB 3.0 and USB 2.0 with PHY support high-speed peripheral connectivity for multimedia or HMI subsystems.

Unique Advantages

• Integrated connectivity suite: Triple GbE, USB 3.0, USB 2.0 and dual SATA interfaces reduce the need for multiple external controllers.
• Dual-core processing at 1.2 GHz: Supports parallel task execution for embedded workloads within a compact footprint.
• Hardware security features: Secure Boot and TrustZone® provide mechanisms for trusted boot and secure application domains.
• Standard memory support: On-chip DDR3 controller simplifies memory subsystem design using widely available DRAM modules.
• Compact BGA package: 672-TEPBGA (27×27) package enables high-density PCB layouts while maintaining a robust ball-grid array footprint.
• Regulatory compliance: RoHS compliance supports environmentally conscious manufacturing requirements.

Why Choose M82172G23?

The M82172G23 balances performance and integration for embedded system designers who need onboard networking, storage, and peripheral interfaces alongside dual-core ARM® Cortex®-A9 processing at 1.2 GHz. Its combination of DDR3 memory support, multiple GbE ports, SATA channels, and USB connectivity helps reduce external component count and simplifies system architecture.

This MPU is appropriate for developers building compact, interface-rich embedded devices that operate within a 0 °C to 70 °C range and require RoHS-compliant components. The M82172G23's feature set supports scalable designs where integrated connectivity and security are priorities.

Request a quote or submit an inquiry for pricing and availability of the M82172G23 to begin integrating this MPU into your embedded design.