MCIMX6Y2CVK08AB

IC MPU I.MX6 792MHZ 272MAPBGA
Part Description

ARM® Cortex®-A7 Microprocessor IC i.MX6 1 Core, 32-Bit 792MHz 272-MAPBGA (9x9)

Quantity 831 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part Seriesi.MX 6Y
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON™ MPECore ProcessorARM® Cortex®-A7Device Package272-MAPBGA (9x9)
Display & Interface ControllersElectrophoretic, LCDECCN5A992CEthernet10/100Mbps (2)
Graphics AccelerationNoHTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width1 Core, 32-Bit
Operating Temperature-40°C ~ 105°C (TJ)Package / Case272-LFBGARAM ControllersLPDDR2, DDR3, DDR3L
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSecurity FeaturesA-HAB, ARM TZ, CSU, SJC, SNVS
Speed792MHzSupplier Device Package272-MAPBGA (9×9)USBUSB 2.0 OTG + PHY (2)
Voltage – I/O1.8V, 2.8V, 3.3V

Overview of MCIMX6Y2CVK08AB – IC MPU I.MX6 792MHZ 272MAPBGA

The MCIMX6Y2CVK08AB is an i.MX 6ULL family microprocessor from NXP Semiconductors featuring a single ARM® Cortex®-A7 core running up to 792 MHz. Designed for industrial and connected embedded products, this device delivers a balance of processing efficiency, integrated system functionality, and flexible peripheral support.

Built with an integrated power management module and a broad set of memory and peripheral interfaces, the part targets compact, power-conscious designs that require secure operation across a wide temperature range.

Key Features

  • Processor Core Single ARM® Cortex®-A7 core, 32-bit, operating up to 792 MHz for embedded control and application tasks.
  • Multimedia Co-Processing Multimedia co-processor with NEON™ MPE to accelerate media-oriented workloads.
  • Memory Interfaces Supports LPDDR2, DDR3, DDR3L, and multiple flash options (Raw/Managed NAND, NOR, eMMC, Quad SPI) for flexible memory subsystem design.
  • Connectivity Dual 10/100 Mbps Ethernet ports, dual USB 2.0 OTG with PHY, and CANbus for wired networking and peripheral connectivity.
  • Display & Sensor Support Display interface controllers suitable for electrophoretic and LCD panels and interfaces for camera sensors and wireless peripherals as detailed in product documentation.
  • Security Features Integrated hardware security elements including A-HAB, ARM TrustZone, CSU, SJC, and SNVS to support secure boot and runtime protections.
  • Integration & Power Management On-chip integrated power management module to reduce external power-supply complexity and simplify sequencing (per i.MX 6ULL documentation).
  • Package & Industrial Rating 272-MAPBGA (9 × 9 mm) package with industrial qualification and operating temperature range of −40 °C to 105 °C.

Typical Applications

  • Industrial Products Embedded controllers and instrumentation where industrial qualification and wide temperature range are required.
  • Connected Devices & IoT Gateways Networked endpoints and gateways leveraging dual Ethernet, USB OTG, and CANbus connectivity for device aggregation and edge processing.
  • Human-Machine Interfaces (HMI) Display-driven interfaces using the built-in display controllers for LCD and electrophoretic panels in compact form factors.
  • Embedded Multimedia Devices Low-power multimedia and sensor processing applications that benefit from NEON™ MPE acceleration and flexible memory choices.

Unique Advantages

  • Integrated Power Management: On-chip power management reduces external component count and simplifies power sequencing in system designs.
  • Flexible Memory Options: Support for LPDDR2, DDR3 and DDR3L plus multiple flash interfaces enables designers to optimize cost, performance, and capacity.
  • Comprehensive Connectivity: Dual Ethernet, dual USB OTG with PHY and CANbus provide versatile wired connectivity for industrial and gateway applications.
  • Security Ready: Hardware security features such as A-HAB and ARM TrustZone help implement secure boot and runtime protection strategies.
  • Industrial Qualification and Temperature Range: Specified for −40 °C to 105 °C, supporting deployment in harsh and temperature-sensitive environments.
  • Compact Package: 272-MAPBGA (9×9 mm) enables space-constrained board designs while maintaining a rich feature set.

Why Choose MCIMX6Y2CVK08AB?

The MCIMX6Y2CVK08AB positions itself as a compact, industrially qualified application processor that combines a single ARM Cortex‑A7 core with a high degree of system integration. Its integrated power management, extensive memory and peripheral interface support, and hardened security features make it suitable for embedded designs that require reliable operation and secure connectivity.

Ideal for engineers developing industrial automation controllers, connected edge devices, HMI panels, and lightweight multimedia systems, this NXP i.MX 6ULL family device offers a documented platform with the interfaces and environmental specs needed for long-lived embedded applications.

Request a quote or submit a procurement inquiry to obtain pricing, availability, and sample information for the MCIMX6Y2CVK08AB.

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