MCIMX6Y1DVK05AB
| Part Description |
ARM® Cortex®-A7 Microprocessor IC i.MX6 1 Core, 32-Bit 528MHz 272-MAPBGA (9x9) |
|---|---|
| Quantity | 936 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | i.MX 6Y |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | Multimedia; NEON™ MPE | Core Processor | ARM® Cortex®-A7 | Device Package | 272-MAPBGA (9x9) | ||
|---|---|---|---|---|---|---|---|
| Display & Interface Controllers | Electrophoretic, LCD | ECCN | 5A992C | Ethernet | 10/100Mbps (1) | ||
| Graphics Acceleration | No | HTS Code | 8542.31.0001 | Moisture Sensitivity Level | 3 (168 Hours) | ||
| Mounting Method | Surface Mount | Mounting Type | Surface Mount | Number of Cores/Bus Width | 1 Core, 32-Bit | ||
| Operating Temperature | 0°C ~ 95°C (TJ) | Package / Case | 272-LFBGA | RAM Controllers | LPDDR2, DDR3, DDR3L | ||
| REACH Compliance | REACH Unaffected | RoHS Compliance | ROHS3 Compliant | Security Features | A-HAB, ARM TZ, CSU, SJC, SNVS | ||
| Speed | 528MHz | Supplier Device Package | 272-MAPBGA (9×9) | USB | USB 2.0 OTG + PHY (2) | ||
| Voltage – I/O | 1.8V, 2.8V, 3.3V |
Overview of MCIMX6Y1DVK05AB – IC MPU I.MX6 528MHz 272-MAPBGA
The MCIMX6Y1DVK05AB is an NXP i.MX 6Y series microprocessor featuring a single ARM® Cortex®‑A7 core running at 528 MHz in a 272‑MAPBGA (9×9) package. Designed for embedded and consumer applications, it delivers a balance of processing capability, peripheral integration, and power management to support connected devices and compact system designs.
Built with integrated memory controllers and a suite of connectivity and security features, this device targets consumer and embedded product designs that require a compact, surface‑mount MPU with broad interface support and RoHS compliance.
Key Features
- Core Single ARM® Cortex®‑A7 32‑bit core operating at 528 MHz, offering efficient general‑purpose processing for embedded workloads.
- Multimedia Acceleration Includes Multimedia co‑processor support and NEON™ MPE to accelerate media and signal processing tasks.
- Memory Interfaces Integrated controllers for LPDDR2, DDR3 and DDR3L provide flexible memory options for a range of performance and power targets.
- Connectivity On‑chip 10/100 Mbps Ethernet (1), dual USB 2.0 OTG with PHY, and additional CAN interface support common embedded and IoT networking needs.
- Display Support Display interface controllers suitable for electrophoretic and LCD panels enable simple UI and low‑power display applications.
- Security Hardware security features include A‑HAB, ARM TrustZone, CSU, SJC and SNVS to support secure boot, isolation and low‑power secure services.
- Power Integration Family documentation describes integrated power management features that simplify external power supply requirements and sequencing.
- Package & Mounting Supplied in a compact 272‑MAPBGA (9×9) surface‑mount package (272‑LFBGA package case noted) suitable for space‑constrained boards.
- Operating Range & Compliance Consumer‑grade qualification with an operating temperature range of 0 °C to 95 °C and RoHS compliance.
Typical Applications
- Connected Devices Compact controllers and gateways that require processor performance with integrated connectivity and memory interface flexibility.
- Consumer Products Embedded consumer electronics where a single‑core ARM® Cortex®‑A7 processor, secure boot and peripheral integration are required.
- Human‑Machine Interfaces Low‑power display and UI controllers using electrophoretic or LCD panels for status displays or simple user interfaces.
- Industrial Control & Instrumentation Systems that leverage CAN, Ethernet and USB for monitoring, control and data exchange in compact embedded designs.
Unique Advantages
- Single‑Core Efficiency: Optimized for embedded workloads with a 528 MHz ARM® Cortex®‑A7 core that balances performance and power consumption.
- Flexible Memory Support: Built‑in controllers for LPDDR2, DDR3 and DDR3L enable designers to choose memory configurations to meet performance or power goals.
- Comprehensive Connectivity: Integrated 10/100 Ethernet, dual USB 2.0 OTG with PHY and CAN provide broad I/O options without extensive external controllers.
- Hardware Security Suite: A‑HAB, ARM TrustZone, CSU, SJC and SNVS support secure boot and system isolation to help protect device integrity.
- Integrated Power Management (Family Feature): Documentation for the i.MX6ULL family indicates integrated power management capabilities that reduce external BOM and simplify sequencing.
- Compact, RoHS‑Compliant Package: 272‑MAPBGA (9×9) surface‑mount package enables dense board layouts while meeting RoHS requirements.
Why Choose MCIMX6Y1DVK05AB?
MCIMX6Y1DVK05AB positions itself as a compact, integrated microprocessor solution for consumer and embedded applications that need a focused balance of processing, connectivity and system‑level security. With flexible memory interfaces, multiple on‑chip connectivity options and a suite of hardware security features, it is suited for designs where board space, integration and secure operation matter.
This MPU is appropriate for developers building connected devices, consumer products and HMI solutions that benefit from NXP’s i.MX 6Y series integration and RoHS compliance, offering a clear upgrade path within the family for similar design approaches.
Request a quote or submit an inquiry to receive pricing and availability for the MCIMX6Y1DVK05AB. Our team can provide lead‑time and ordering details to support your design timeline.

Date Founded: 2006
Headquarters: Eindhoven, North Brabant, Netherlands
Employees: 38,000+
Revenue: $10.53 Billion
Certifications and Memberships: ISO9001:2015, IATF16949:2016