MCIMX6Y1CVM05AB

The MCIMX6Y1CVM05AB is an NXP Semiconductors i.MX 6Y series microprocessor IC featuring a single ARM® Cortex®‑A7 32‑bit core running at 528 MHz. Designed for embedded and industrial applications, this industrial‑qualified device combines processing, security, memory interface flexibility and a compact 289‑MAPBGA (14×14 mm) package.

As part of the i.MX 6ULL family, the device targets connected and multimedia‑focused embedded systems where integration, industrial temperature capability and peripheral versatility are priorities.

Key Features

• Core Single ARM® Cortex®‑A7 32‑bit core operating at 528 MHz for deterministic embedded processing.
• Co‑processor Support Multimedia co‑processors and NEON™ MPE for media and signal processing acceleration.
• Memory Interfaces Integrated controllers supporting LPDDR2, DDR3 and DDR3L memory types for flexible system memory design.
• Display Support Display interface controllers for electrophoretic and LCD displays to drive user interfaces and e‑paper modules.
• Connectivity 10/100 Mbps Ethernet (1), CAN interface and USB 2.0 OTG with PHYs (2) for wired networking and peripheral connectivity.
• Security Features Hardware security primitives including A‑HAB, ARM TrustZone (ARM TZ), CSU, SJC and SNVS to support secure boot and runtime security domains.
• Power Integration Series datasheet documents an integrated power management module that simplifies external power sequencing and reduces design complexity.
• Package & Mounting 289‑ball MAPBGA (14×14 mm) surface‑mount package suitable for compact embedded boards.
• Operating Temperature Industrial temperature range from ‑40 °C to 105 °C for deployment in demanding environments.
• Compliance RoHS‑compliant manufacturing.
• Graphics No dedicated graphics acceleration.

Typical Applications

• Industrial Control & Automation — Single‑core processing, industrial temperature rating and CAN/Ethernet connectivity for machine control and monitoring nodes.
• Embedded HMI and Display Systems — LCD and electrophoretic display controller support for small human‑machine interfaces and e‑paper panels.
• Connected Devices — USB OTG, Ethernet and integrated power management make it suitable for networked sensors, gateways and other connected embedded equipment.
• Secure Embedded Systems — On‑chip security features support secure boot and runtime protection in industrial or connected applications.

Unique Advantages

• Industrial Qualification: Built and specified for an operating range of ‑40 °C to 105 °C to meet industrial environment demands.
• Flexible Memory Support: LPDDR2, DDR3 and DDR3L controller support allows designers to choose memory technology that matches cost and performance targets.
• Integrated Power Management: Series documentation indicates integrated power management that reduces external power sequencing complexity and simplifies BOM.
• Compact, Board‑Level Friendly Package: 289‑MAPBGA (14×14 mm) surface‑mount package enables space‑constrained embedded designs.
• Security‑Focused Feature Set: A‑HAB, ARM TrustZone, CSU, SJC and SNVS provide a layered security approach suitable for secure boot and trusted execution use cases.
• Broad Peripheral Connectivity: Ethernet, CAN and multiple USB OTG PHYs support diverse I/O and network interfaces from a single device.

Why Choose MCIMX6Y1CVM05AB?

MCIMX6Y1CVM05AB positions itself as a compact, industrially qualified microprocessor for embedded designs that require a capable 32‑bit ARM Cortex‑A7 core paired with flexible memory and peripheral options. Its security features and integrated power management simplify design while addressing industrial reliability requirements.

This part is well suited to engineers building connected devices, industrial controllers, display‑based HMIs and other embedded systems that benefit from a small package footprint, industrial temperature range and a feature set focused on connectivity and security.

Request a quote or submit a purchase inquiry for MCIMX6Y1CVM05AB through your preferred procurement channel to evaluate it for your next embedded design.