MCIMX6Y1CVK05AA

IC MPU I.MX6 528MHZ 272MAPBGA
Part Description

ARM® Cortex®-A7 Microprocessor IC i.MX6 1 Core, 32-Bit 528MHz 272-MAPBGA (9x9)

Quantity 512 Available (as of October 9, 2026)
Product CategoryMicroprocessors
Part Seriesi.MX 6Y
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON™ MPECore ProcessorARM® Cortex®-A7Device Package272-MAPBGA (9x9)
Display & Interface ControllersElectrophoretic, LCDECCN5A992CEthernet10/100Mbps (1)
Graphics AccelerationNoHTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width1 Core, 32-Bit
Operating Temperature-40°C ~ 105°C (TJ)Package / Case272-LFBGARAM ControllersLPDDR2, DDR3, DDR3L
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSecurity FeaturesA-HAB, ARM TZ, CSU, SJC, SNVS
Speed528MHzSupplier Device Package272-MAPBGA (9×9)USBUSB 2.0 OTG + PHY (2)
Voltage – I/O1.8V, 2.8V, 3.3V

Overview of MCIMX6Y1CVK05AA – IC MPU I.MX6 528MHz 1‑Core 272‑MAPBGA

The MCIMX6Y1CVK05AA is an NXP Semiconductors i.MX 6Y series microprocessor featuring a single ARM® Cortex®‑A7 core running at 528 MHz in a compact 272‑MAPBGA (9×9 mm) package. It targets embedded and connected device designs that require efficient single‑core processing, industrial qualification, and a broad set of integrated peripherals.

Built for applications that combine control, connectivity and display/sensor interfaces, this device emphasizes integration and system‑level simplicity with on‑chip memory controller support and onboard security features for industrial environments.

Key Features

  • Core – Single ARM® Cortex®‑A7 32‑bit core clocked at 528 MHz, providing efficient application processing for embedded workloads.
  • Multimedia and DSP – Multimedia co‑processors and NEON™ MPE support for optimized media and signal processing tasks.
  • Memory – Integrated controllers for LPDDR2, DDR3 and DDR3L memory types; datasheet series notes support for additional managed and raw flash interfaces (NAND, NOR, eMMC, Quad SPI).
  • Connectivity – Single 10/100 Mbps Ethernet interface and two USB 2.0 OTG ports with PHYs; additional CAN interface for industrial field networks.
  • Display and Sensor Interfaces – Support for electrophoretic and LCD display controllers and a range of peripheral interfaces suitable for cameras and sensors (as indicated in series documentation).
  • Security – On‑chip security features including A‑HAB, ARM TrustZone (ARM TZ), CSU, SJC and SNVS for secure boot and runtime protection.
  • Power and System Integration – Series documentation describes an integrated power management module to simplify external power supply design and power sequencing.
  • Industrial Qualification & Temperature Range – Industrial qualification with operating temperature from −40 °C to 105 °C for robust deployment in demanding environments.
  • Package & Mounting – 272‑MAPBGA (9×9 mm) surface‑mount package; RoHS compliant.

Typical Applications

  • Embedded Control & Automation – Single‑core processing and industrial temperature qualification make the device suitable for control nodes and industrial IoT gateways.
  • Connected Consumer & Industrial Devices – Integrated Ethernet, USB OTG and CAN support connectivity for smart instruments, HMIs and sensor hubs.
  • Display‑Driven Interfaces – Built‑in display controller support enables compact user interfaces such as panels, e‑readers or simple LCD displays.
  • Secure Boot & Trusted Applications – On‑chip security blocks support secure boot and protected runtime for devices requiring authenticated firmware and data protection.

Unique Advantages

  • Integrated connectivity suite – Ethernet, USB OTG with PHYs and CAN are provided on‑chip, reducing external component count and simplifying board design.
  • Memory flexibility – Support for multiple memory types (LPDDR2, DDR3, DDR3L) plus series‑level flash interface options allows designers to choose memory configurations to match performance and cost targets.
  • Industrial readiness – Industrial qualification and a −40 °C to 105 °C rating support deployment in harsh and temperature‑sensitive applications.
  • Security building blocks – A‑HAB, ARM TrustZone and related subsystems enable implementation of secure boot and runtime protection with fewer external security components.
  • System power simplification – Series documentation describes an integrated power management module to reduce external power sequencing complexity and streamline power supply design.
  • Compact, surface‑mount package – The 272‑MAPBGA (9×9 mm) package offers a small footprint for space‑constrained embedded designs.

Why Choose MCIMX6Y1CVK05AA?

The MCIMX6Y1CVK05AA positions itself as a compact, industrially qualified single‑core microprocessor that balances efficient Cortex‑A7 processing with a broad set of integrated peripherals and security features. It is well suited for embedded designs that require reliable operation across temperature extremes, flexible memory options, and onboard connectivity for Ethernet, USB and field networks like CAN.

Design teams seeking a highly integrated MPU in a small BGA footprint will find this part appropriate for connected devices, display and sensor interfaces, and industrial control applications where system integration and simplified power management are priorities.

Request a quote or contact sales to discuss availability, pricing and how MCIMX6Y1CVK05AA can fit into your next embedded design.

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