MCIMX6Y1CVK05AB

IC MPU I.MX6 528MHZ 272MAPBGA
Part Description

ARM® Cortex®-A7 Microprocessor IC i.MX6 1 Core, 32-Bit 528MHz 272-MAPBGA (9x9)

Quantity 1,426 Available (as of October 9, 2026)
Product CategoryMicroprocessors
Part Seriesi.MX 6Y
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON™ MPECore ProcessorARM® Cortex®-A7Device Package272-MAPBGA (9x9)
Display & Interface ControllersElectrophoretic, LCDECCN5A992CEthernet10/100Mbps (1)
Graphics AccelerationNoHTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width1 Core, 32-Bit
Operating Temperature-40°C ~ 105°C (TJ)Package / Case272-LFBGARAM ControllersLPDDR2, DDR3, DDR3L
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSecurity FeaturesA-HAB, ARM TZ, CSU, SJC, SNVS
Speed528MHzSupplier Device Package272-MAPBGA (9×9)USBUSB 2.0 OTG + PHY (2)
Voltage – I/O1.8V, 2.8V, 3.3V

Overview of MCIMX6Y1CVK05AB – IC MPU I.MX6 528MHZ 272MAPBGA

The MCIMX6Y1CVK05AB from NXP Semiconductors is a single-core ARM® Cortex®-A7 microprocessor IC running at 528 MHz, optimized for embedded and industrial applications. It combines a compact 272-MAPBGA (9×9 mm) package with integrated system features—such as on-chip security and power management—to simplify board design for connected and industrial devices.

Designed as part of the i.MX 6Y series, this device targets resource-efficient multimedia and control applications that require industrial qualification and extended temperature operation.

Key Features

  • Core Single ARM® Cortex®-A7 32-bit core operating at 528 MHz, delivering application processing for embedded control and lightweight multimedia workloads.
  • Memory Support Integrated controllers for LPDDR2, DDR3 and DDR3L memory types, enabling flexible memory subsystem choices for performance and cost trade-offs.
  • Co-processors Multimedia capabilities with NEON™ MPE support for accelerated media and signal-processing tasks.
  • Connectivity 10/100 Mbps Ethernet interface and USB 2.0 OTG with integrated PHY provide primary wired connectivity options; additional CAN interface support is included for industrial networks.
  • Display Support Display interface controllers for electrophoretic and LCD panels to support a range of human‑machine interface designs.
  • Security On-chip security features including A-HAB, ARM TZ, CSU, SJC and SNVS to support secure boot, trusted execution and system-level security controls.
  • Power & Integration Integrated power management module (as described in the i.MX 6ULL family datasheet) to reduce external power-supply complexity and simplify power sequencing.
  • Package & Mounting Compact 272-MAPBGA (9×9 mm) supplier device package; 272-LFBGA package case information available for design compatibility. Surface-mount mounting type.
  • Industrial Qualification & Temperature Range Industrial qualification with an operating temperature range of −40 °C to 105 °C for deployment in demanding environments.
  • Compliance RoHS status: Compliant.

Typical Applications

  • Industrial Control and Automation Leverage the industrial qualification, CAN interface and extended temperature range for control nodes, gateways and machine automation controllers.
  • Connected Devices and IoT Gateways Use Ethernet and USB 2.0 OTG connectivity alongside integrated power management to build compact connected appliances and edge devices.
  • Human‑Machine Interfaces (HMI) Drive electrophoretic and LCD displays for operator panels, simple UI systems and display-based sensing products.
  • Secure Embedded Systems Implement secure boot and trusted execution using on-chip security blocks (A-HAB, ARM TZ, CSU, SJC, SNVS) for devices that require system integrity and protection.

Unique Advantages

  • Compact, production-ready package: The 272-MAPBGA (9×9 mm) footprint supports dense board layouts while maintaining standard surface-mount assembly processes.
  • Integrated power management: On-chip power management reduces external regulator count and simplifies power sequencing for faster time-to-market.
  • Industrial-grade operation: Qualification for industrial use and an operating range of −40 °C to 105 °C support deployment in temperature-extreme and rugged environments.
  • Security building blocks: Multiple hardware security features provide a layered approach to secure boot, runtime protection and isolation.
  • Flexible memory options: Support for LPDDR2, DDR3 and DDR3L enables designers to optimize for cost, power or performance depending on application needs.

Why Choose MCIMX6Y1CVK05AB?

The MCIMX6Y1CVK05AB positions itself as a compact, industrially qualified microprocessor solution for embedded designs that require a single ARM® Cortex®-A7 core with integrated system-level features. Its combination of integrated power management, on-chip security, flexible memory controller support and common wired interfaces (Ethernet, USB, CAN) makes it suitable for connected devices, HMIs and industrial control applications.

Engineers seeking a streamlined BOM and a processor aligned with the i.MX processor family can rely on this device for designs that need predictable performance at 528 MHz and robust operation across extended temperature ranges.

Request a quote or submit a product inquiry to evaluate MCIMX6Y1CVK05AB for your next embedded or industrial design.

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