MCIMX6Y1CVK05AB
| Part Description |
ARM® Cortex®-A7 Microprocessor IC i.MX6 1 Core, 32-Bit 528MHz 272-MAPBGA (9x9) |
|---|---|
| Quantity | 1,426 Available (as of October 9, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | i.MX 6Y |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | Multimedia; NEON™ MPE | Core Processor | ARM® Cortex®-A7 | Device Package | 272-MAPBGA (9x9) | ||
|---|---|---|---|---|---|---|---|
| Display & Interface Controllers | Electrophoretic, LCD | ECCN | 5A992C | Ethernet | 10/100Mbps (1) | ||
| Graphics Acceleration | No | HTS Code | 8542.31.0001 | Moisture Sensitivity Level | 3 (168 Hours) | ||
| Mounting Method | Surface Mount | Mounting Type | Surface Mount | Number of Cores/Bus Width | 1 Core, 32-Bit | ||
| Operating Temperature | -40°C ~ 105°C (TJ) | Package / Case | 272-LFBGA | RAM Controllers | LPDDR2, DDR3, DDR3L | ||
| REACH Compliance | REACH Unaffected | RoHS Compliance | ROHS3 Compliant | Security Features | A-HAB, ARM TZ, CSU, SJC, SNVS | ||
| Speed | 528MHz | Supplier Device Package | 272-MAPBGA (9×9) | USB | USB 2.0 OTG + PHY (2) | ||
| Voltage – I/O | 1.8V, 2.8V, 3.3V |
Overview of MCIMX6Y1CVK05AB – IC MPU I.MX6 528MHZ 272MAPBGA
The MCIMX6Y1CVK05AB from NXP Semiconductors is a single-core ARM® Cortex®-A7 microprocessor IC running at 528 MHz, optimized for embedded and industrial applications. It combines a compact 272-MAPBGA (9×9 mm) package with integrated system features—such as on-chip security and power management—to simplify board design for connected and industrial devices.
Designed as part of the i.MX 6Y series, this device targets resource-efficient multimedia and control applications that require industrial qualification and extended temperature operation.
Key Features
- Core Single ARM® Cortex®-A7 32-bit core operating at 528 MHz, delivering application processing for embedded control and lightweight multimedia workloads.
- Memory Support Integrated controllers for LPDDR2, DDR3 and DDR3L memory types, enabling flexible memory subsystem choices for performance and cost trade-offs.
- Co-processors Multimedia capabilities with NEON™ MPE support for accelerated media and signal-processing tasks.
- Connectivity 10/100 Mbps Ethernet interface and USB 2.0 OTG with integrated PHY provide primary wired connectivity options; additional CAN interface support is included for industrial networks.
- Display Support Display interface controllers for electrophoretic and LCD panels to support a range of human‑machine interface designs.
- Security On-chip security features including A-HAB, ARM TZ, CSU, SJC and SNVS to support secure boot, trusted execution and system-level security controls.
- Power & Integration Integrated power management module (as described in the i.MX 6ULL family datasheet) to reduce external power-supply complexity and simplify power sequencing.
- Package & Mounting Compact 272-MAPBGA (9×9 mm) supplier device package; 272-LFBGA package case information available for design compatibility. Surface-mount mounting type.
- Industrial Qualification & Temperature Range Industrial qualification with an operating temperature range of −40 °C to 105 °C for deployment in demanding environments.
- Compliance RoHS status: Compliant.
Typical Applications
- Industrial Control and Automation Leverage the industrial qualification, CAN interface and extended temperature range for control nodes, gateways and machine automation controllers.
- Connected Devices and IoT Gateways Use Ethernet and USB 2.0 OTG connectivity alongside integrated power management to build compact connected appliances and edge devices.
- Human‑Machine Interfaces (HMI) Drive electrophoretic and LCD displays for operator panels, simple UI systems and display-based sensing products.
- Secure Embedded Systems Implement secure boot and trusted execution using on-chip security blocks (A-HAB, ARM TZ, CSU, SJC, SNVS) for devices that require system integrity and protection.
Unique Advantages
- Compact, production-ready package: The 272-MAPBGA (9×9 mm) footprint supports dense board layouts while maintaining standard surface-mount assembly processes.
- Integrated power management: On-chip power management reduces external regulator count and simplifies power sequencing for faster time-to-market.
- Industrial-grade operation: Qualification for industrial use and an operating range of −40 °C to 105 °C support deployment in temperature-extreme and rugged environments.
- Security building blocks: Multiple hardware security features provide a layered approach to secure boot, runtime protection and isolation.
- Flexible memory options: Support for LPDDR2, DDR3 and DDR3L enables designers to optimize for cost, power or performance depending on application needs.
Why Choose MCIMX6Y1CVK05AB?
The MCIMX6Y1CVK05AB positions itself as a compact, industrially qualified microprocessor solution for embedded designs that require a single ARM® Cortex®-A7 core with integrated system-level features. Its combination of integrated power management, on-chip security, flexible memory controller support and common wired interfaces (Ethernet, USB, CAN) makes it suitable for connected devices, HMIs and industrial control applications.
Engineers seeking a streamlined BOM and a processor aligned with the i.MX processor family can rely on this device for designs that need predictable performance at 528 MHz and robust operation across extended temperature ranges.
Request a quote or submit a product inquiry to evaluate MCIMX6Y1CVK05AB for your next embedded or industrial design.

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