MPC8247ZQMIBA
| Part Description |
PowerPC G2_LE Microprocessor IC MPC82xx 1 Core, 32-Bit 266MHz 516-PBGA (27x27) |
|---|---|
| Quantity | 1,160 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | MPC8247 |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | Communications; RISC CPM | Core Processor | PowerPC G2_LE | Device Package | 516-PBGA (27x27) | ||
|---|---|---|---|---|---|---|---|
| ECCN | 3A991A2 | Ethernet | 10/100Mbps (2) | Graphics Acceleration | No | ||
| HTS Code | 8542.31.0001 | Moisture Sensitivity Level | 3 (168 Hours) | Mounting Method | Surface Mount | ||
| Mounting Type | Surface Mount | Number of Cores/Bus Width | 1 Core, 32-Bit | Operating Temperature | 0°C ~ 105°C (TA) | ||
| Package / Case | 516-BBGA | RAM Controllers | DRAM, SDRAM | REACH Compliance | REACH Unaffected | ||
| RoHS Compliance | RoHS non-compliant | Speed | 266MHz | Supplier Device Package | 516-PBGA (27×27) | ||
| USB | USB 2.0 (1) | Voltage – I/O | 3.3V |
Overview of MPC8247ZQMIBA – PowerPC G2_LE 266 MHz 516‑PBGA Microprocessor
The MPC8247ZQMIBA is a single‑core, 32‑bit PowerPC G2_LE microprocessor operating at 266 MHz, designed for embedded applications. It integrates a communications‑oriented architecture with on‑chip memory controllers and peripheral interfaces to support Ethernet, USB and serial control tasks in compact, surface‑mount designs.
Key Features
- Core & Architecture Dual‑issue PowerPC G2_LE integer core with 32‑bit data path running at 266 MHz, supporting on‑chip MMU and instruction/data caches (16 KB I‑cache and 16 KB D‑cache as defined for the family).
- Memory Integrated DRAM/SDRAM controllers to simplify system memory interfacing for typical embedded memory configurations.
- Communications & I/O Two 10/100 Mbps Ethernet interfaces and one USB 2.0 full/low‑rate port provide native connectivity for networked and USB‑enabled devices; additional I2C support enables standard peripheral control.
- Communications Processor Module (CPM) On‑chip RISC CPM and communications DSP support offloaded communications and protocol handling, helping reduce host CPU overhead for data‑plane tasks.
- Package & Mounting 516‑ball PBGA (27 × 27 mm) surface‑mount package for high‑density board designs and consistent thermal characteristics.
- Power & I/O 3.3 V I/O signaling for compatibility with common embedded peripherals and board ecosystems.
- Operating Range & Qualification Consumer‑qualified device rated for operation from 0 °C to 105 °C and RoHS compliant.
Typical Applications
- Embedded Communications Appliances Use the dual Ethernet interfaces and CPM to implement networked protocol handling and packet processing in compact embedded routers or gateways.
- Networking Equipment Suitable for 10/100 Mbps Ethernet‑based devices that require integrated USB and serial control for management and diagnostics.
- Consumer Embedded Systems Provides a compact, single‑chip solution for embedded consumer products requiring DRAM/SDRAM support, USB connectivity, and general I/O control.
- Control and Data‑Acquisition Systems On‑chip memory controllers and peripheral interfaces enable responsive control and data buffering for embedded measurement and automation modules.
Unique Advantages
- Integrated Communications Peripherals: Two 10/100 Ethernet ports, USB 2.0 and I2C reduce external component count for networking‑centric designs.
- Offload Capable CPM: The on‑chip RISC CPM handles communications tasks to lower CPU load and simplify protocol implementation.
- On‑Chip Memory Support: Built‑in DRAM/SDRAM controllers streamline memory subsystem design and board layout.
- Compact PBGA Package: 516‑ball PBGA (27 × 27 mm) enables dense PCB integration while maintaining solderable surface‑mount form factor.
- Consumer Qualification with Broad Temperature Range: Rated 0 °C to 105 °C and RoHS compliant for compliant consumer embedded product designs.
- 3.3 V I/O Compatibility: Standard I/O voltage simplifies interfacing with common peripherals and legacy interfaces.
Why Choose MPC8247ZQMIBA?
The MPC8247ZQMIBA combines a PowerPC G2_LE single‑core processor with integrated communications peripherals and memory controllers to deliver a focused solution for embedded networking and control applications. Its combination of Ethernet, USB, on‑chip CPM and standard 3.3 V I/O reduces BOM complexity and shortens development time for compact, surface‑mount designs.
This device is well suited to customers developing consumer‑grade embedded products that require network connectivity, DRAM/SDRAM support, and a compact PBGA package. With RoHS compliance and a specified operating range of 0 °C to 105 °C, it supports consistent manufacturability and deployment in a variety of embedded use cases.
Request a quote or submit an inquiry for availability and pricing on the MPC8247ZQMIBA. Provide your project requirements and procurement needs to receive a tailored response.

Date Founded: 2006
Headquarters: Eindhoven, North Brabant, Netherlands
Employees: 38,000+
Revenue: $10.53 Billion
Certifications and Memberships: ISO9001:2015, IATF16949:2016