MPC8247ZQMIBA

IC MPU MPC82XX 266MHZ PBGA516
Part Description

PowerPC G2_LE Microprocessor IC MPC82xx 1 Core, 32-Bit 266MHz 516-PBGA (27x27)

Quantity 1,160 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesMPC8247
ManufacturerNXP USA Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Co-Processors/DSPCommunications; RISC CPMCore ProcessorPowerPC G2_LEDevice Package516-PBGA (27x27)
ECCN3A991A2Ethernet10/100Mbps (2)Graphics AccelerationNo
HTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface Mount
Mounting TypeSurface MountNumber of Cores/Bus Width1 Core, 32-BitOperating Temperature0°C ~ 105°C (TA)
Package / Case516-BBGARAM ControllersDRAM, SDRAMREACH ComplianceREACH Unaffected
RoHS ComplianceRoHS non-compliantSpeed266MHzSupplier Device Package516-PBGA (27×27)
USBUSB 2.0 (1)Voltage – I/O3.3V

Overview of MPC8247ZQMIBA – PowerPC G2_LE 266 MHz 516‑PBGA Microprocessor

The MPC8247ZQMIBA is a single‑core, 32‑bit PowerPC G2_LE microprocessor operating at 266 MHz, designed for embedded applications. It integrates a communications‑oriented architecture with on‑chip memory controllers and peripheral interfaces to support Ethernet, USB and serial control tasks in compact, surface‑mount designs.

Key Features

  • Core & Architecture Dual‑issue PowerPC G2_LE integer core with 32‑bit data path running at 266 MHz, supporting on‑chip MMU and instruction/data caches (16 KB I‑cache and 16 KB D‑cache as defined for the family).
  • Memory Integrated DRAM/SDRAM controllers to simplify system memory interfacing for typical embedded memory configurations.
  • Communications & I/O Two 10/100 Mbps Ethernet interfaces and one USB 2.0 full/low‑rate port provide native connectivity for networked and USB‑enabled devices; additional I2C support enables standard peripheral control.
  • Communications Processor Module (CPM) On‑chip RISC CPM and communications DSP support offloaded communications and protocol handling, helping reduce host CPU overhead for data‑plane tasks.
  • Package & Mounting 516‑ball PBGA (27 × 27 mm) surface‑mount package for high‑density board designs and consistent thermal characteristics.
  • Power & I/O 3.3 V I/O signaling for compatibility with common embedded peripherals and board ecosystems.
  • Operating Range & Qualification Consumer‑qualified device rated for operation from 0 °C to 105 °C and RoHS compliant.

Typical Applications

  • Embedded Communications Appliances Use the dual Ethernet interfaces and CPM to implement networked protocol handling and packet processing in compact embedded routers or gateways.
  • Networking Equipment Suitable for 10/100 Mbps Ethernet‑based devices that require integrated USB and serial control for management and diagnostics.
  • Consumer Embedded Systems Provides a compact, single‑chip solution for embedded consumer products requiring DRAM/SDRAM support, USB connectivity, and general I/O control.
  • Control and Data‑Acquisition Systems On‑chip memory controllers and peripheral interfaces enable responsive control and data buffering for embedded measurement and automation modules.

Unique Advantages

  • Integrated Communications Peripherals: Two 10/100 Ethernet ports, USB 2.0 and I2C reduce external component count for networking‑centric designs.
  • Offload Capable CPM: The on‑chip RISC CPM handles communications tasks to lower CPU load and simplify protocol implementation.
  • On‑Chip Memory Support: Built‑in DRAM/SDRAM controllers streamline memory subsystem design and board layout.
  • Compact PBGA Package: 516‑ball PBGA (27 × 27 mm) enables dense PCB integration while maintaining solderable surface‑mount form factor.
  • Consumer Qualification with Broad Temperature Range: Rated 0 °C to 105 °C and RoHS compliant for compliant consumer embedded product designs.
  • 3.3 V I/O Compatibility: Standard I/O voltage simplifies interfacing with common peripherals and legacy interfaces.

Why Choose MPC8247ZQMIBA?

The MPC8247ZQMIBA combines a PowerPC G2_LE single‑core processor with integrated communications peripherals and memory controllers to deliver a focused solution for embedded networking and control applications. Its combination of Ethernet, USB, on‑chip CPM and standard 3.3 V I/O reduces BOM complexity and shortens development time for compact, surface‑mount designs.

This device is well suited to customers developing consumer‑grade embedded products that require network connectivity, DRAM/SDRAM support, and a compact PBGA package. With RoHS compliance and a specified operating range of 0 °C to 105 °C, it supports consistent manufacturability and deployment in a variety of embedded use cases.

Request a quote or submit an inquiry for availability and pricing on the MPC8247ZQMIBA. Provide your project requirements and procurement needs to receive a tailored response.

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