MPC8247ZQTIEA

IC MPU MPC82XX 400MHZ PBGA516
Part Description

PowerPC G2_LE Microprocessor IC MPC82xx 1 Core, 32-Bit 400MHz 516-PBGA (27x27)

Quantity 1,137 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesMPC8247
ManufacturerNXP USA Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Co-Processors/DSPCommunications; RISC CPMCore ProcessorPowerPC G2_LEDevice Package516-PBGA (27x27)
ECCN3A991A2Ethernet10/100Mbps (2)Graphics AccelerationNo
HTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface Mount
Mounting TypeSurface MountNumber of Cores/Bus Width1 Core, 32-BitOperating Temperature0°C ~ 105°C (TA)
Package / Case516-BBGARAM ControllersDRAM, SDRAMREACH ComplianceREACH Unaffected
RoHS ComplianceRoHS non-compliantSpeed400MHzSupplier Device Package516-PBGA (27×27)
USBUSB 2.0 (1)Voltage – I/O3.3V

Overview of MPC8247ZQTIEA – PowerPC G2_LE Microprocessor 400 MHz, 516-PBGA

The MPC8247ZQTIEA is a single-core, 32-bit PowerPC G2_LE microprocessor from NXP Semiconductors, running at 400 MHz and delivered in a 516-pin PBGA (27×27) surface-mount package. Designed for embedded systems, it combines a PowerArchitecture® core with integrated communications peripherals and memory controllers to address networking and control applications.

With 3.3 V I/O, dual 10/100 Mbps Ethernet interfaces, USB 2.0, and on-chip DRAM/SDRAM controllers, the MPC8247ZQTIEA provides a compact, RoHS-compliant solution for embedded designs operating across a 0 °C to 105 °C range.

Key Features

  • Processor Core  Dual-issue PowerPC G2_LE single core, 32-bit architecture operating at 400 MHz, implementing the Power Architecture instruction set.
  • Memory Management & Caches  On-chip memory management units (MMUs) with separate instruction and data caches (16 KB each as specified for the family), improving code execution and data throughput.
  • Communications & Interfaces  Integrated 10/100 Mbps Ethernet (2 ports), USB 2.0 (1 port), and I2C for peripheral control and system connectivity.
  • Co-Processors  Includes communications-oriented co-processors (RISC CPM) and DSP-style communications support to offload protocol and data-stream processing.
  • Memory Controllers  On-chip DRAM and SDRAM controllers for direct connection to external system memory, simplifying board-level memory design.
  • Power & I/O  3.3 V I/O signaling; designed for surface-mount implementation to fit compact embedded PCBs.
  • Package & Environmental  516-ball PBGA (27×27) package; RoHS-compliant and specified for operation from 0 °C to 105 °C.

Typical Applications

  • Embedded Networking Equipment  Dual 10/100 Ethernet ports and communications co-processors make the MPC8247ZQTIEA suitable for routers, switches, and network appliances requiring integrated packet processing.
  • Industrial Control Systems  On-chip DRAM/SDRAM controllers, I2C, and robust thermal range support system controllers, protocol gateways, and machine automation nodes.
  • Communication Gateways  USB 2.0 and CPM support for protocol handling and peripheral interfacing in embedded gateway and access-point designs.
  • General Embedded Processing  A compact single-chip solution for control, monitoring, and embedded application processors where deterministic processing and integrated interfaces reduce BOM count.

Unique Advantages

  • Integrated Communications Peripherals: Dual Ethernet ports, USB 2.0, and I2C reduce the need for external controllers and simplify system integration.
  • Communications Offload: RISC CPM and communications DSP capability relieve the main core from protocol processing, improving overall system efficiency.
  • On-Chip Memory Support: Built-in DRAM/SDRAM controllers streamline memory subsystem design and speed time-to-market.
  • Proven Power Architecture Core: The PowerPC G2_LE core with MMU and separate instruction/data caches provides deterministic embedded performance for control and networking tasks.
  • Compact, Assembly-Ready Package: 516-PBGA (27×27) surface-mount package supports dense board layouts while maintaining robust I/O capability.
  • Compliance and Temperature Range: RoHS-compliant construction and 0 °C to 105 °C operating range suit commercial and industrial embedded environments.

Why Choose MPC8247ZQTIEA?

The MPC8247ZQTIEA positions itself as a highly integrated embedded microprocessor that combines a PowerPC G2_LE execution core with a suite of communications interfaces and on-chip memory controllers. This integration reduces board complexity and component count while delivering the connectivity needed for networking and control applications.

It is an appropriate choice for designers seeking a compact, surface-mount processor solution with dual Ethernet, USB 2.0, and communications offload capabilities. The device’s thermal and RoHS attributes support reliable deployment in a range of embedded systems.

Request a quote or submit procurement details to initiate availability and pricing inquiries for the MPC8247ZQTIEA. Provide your required quantities and lead-time expectations to receive a tailored response.

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