MPC8377CVRANGA

IC MPU MPC83XX 800MHZ PBGA689
Part Description

PowerPC e300c4s Microprocessor IC MPC83xx 1 Core, 32-Bit 800MHz 689-TEPBGA II (31x31)

Quantity 527 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesMPC8377
ManufacturerNXP USA Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Core ProcessorPowerPC e300c4sDevice Package689-TEPBGA II (31x31)ECCN3A991A2
Ethernet10/100/1000Mbps (2)Graphics AccelerationNoHTS Code8542.31.0001
Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface MountMounting TypeSurface Mount
Number of Cores/Bus Width1 Core, 32-BitOperating Temperature-40°C ~ 125°C (TA)Package / Case689-BBGA Exposed Pad
RAM ControllersDDR, DDR2REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 Compliant
SATASATA 3Gbps (2)Speed800MHzSupplier Device Package689-TEPBGA II (31×31)
USBUSB 2.0 + PHY (1)Voltage – I/O1.8V, 2.5V, 3.3V

Overview of MPC8377CVRANGA – PowerPC e300c4s 1-Core 800 MHz Microprocessor

The MPC8377CVRANGA is a PowerPC e300c4s-based microprocessor delivering a single 32-bit core at 800 MHz. It targets embedded and industrial applications that require a cost-effective, low-power, highly integrated host processor.

Designed for use in printing and imaging, networking, storage and industrial control systems, the device combines on-chip cache and MMU, flexible memory controllers and a broad set of high-speed interfaces to simplify system design and accelerate time-to-market.

Key Features

  • Core  PowerPC e300c4s core running at 800 MHz with on-chip memory management and 32 KB L1 instruction and 32 KB L1 data caches (as described in the series documentation).
  • Memory  Integrated DDR/DDR2 SDRAM memory controller supports modern volatile memory configurations for system and application code.
  • Networking and Storage Interfaces  Two enhanced three-speed Ethernet interfaces supporting 10/100/1000 Mbps and two Serial ATA ports supporting 3 Gbps for high-throughput networking and storage connectivity.
  • USB and Peripheral I/O  USB 2.0 controller with integrated PHY plus DUART and other serial interfaces provide flexible peripheral connectivity.
  • Security  Optional SEC 3.0 security engine with cryptography and a random number generator to support secure communications and data protection.
  • System Integration  On-chip features described in the product series include a 32-bit PCI controller, 32-bit local bus controller and a programmable interrupt controller to streamline system architectures.
  • Package and Temperature  689-BBGA exposed pad package (689-TEPBGA II, 31 × 31 mm) in a surface-mount form factor; industrial qualification with operating temperature range from −40 °C to 125 °C.
  • Compliance  RoHS compliant.

Typical Applications

  • Printing and Imaging: Host CPU and I/O processor roles in printers and multifunction devices where integrated I/O and memory interfaces reduce system complexity.
  • Networking Equipment: Switches, line cards and VPN routers leveraging dual Gigabit Ethernet and PCI/local bus connectivity for packet processing and I/O aggregation.
  • Storage and NAS: Network-attached storage and intelligent NIC designs using dual SATA ports and Ethernet for high-throughput data access and transfer.
  • Industrial Controllers: Embedded control systems and industrial automation platforms benefiting from industrial temperature operation and broad peripheral support.

Unique Advantages

  • Highly integrated solution: On-chip memory management, Ethernet, SATA and USB reduce external component count and simplify BOM.
  • Industrial-grade operation: −40 °C to 125 °C operating range and industrial qualification support deployment in demanding environments.
  • Flexible memory and I/O: DDR/DDR2 memory controller plus PCI and local bus options enable a range of system architectures and performance points.
  • Security-enabled platform: Built-in SEC 3.0 cryptography and hardware random number generation facilitate secure communication and storage functions.
  • Package suited for dense boards: 689-ball TEPBGA exposed-pad package (31 × 31 mm) provides a compact, surface-mount footprint for high-density PCB layouts.
  • Documented platform: Series documentation details caches, MMU, peripheral controllers and timing/thermal data to support design and validation.

Why Choose MPC8377CVRANGA?

The MPC8377CVRANGA positions itself as a single-core, PowerPC-based embedded processor that balances performance with integration and industrial reliability. Its combination of a PowerPC e300c4s core, integrated memory controllers, dual Gigabit Ethernet, SATA and security engine make it well suited for networked, storage and industrial applications that require a compact, system-ready processor.

Engineers and system designers benefit from the on-chip peripherals and documented series-level technical details to accelerate development, reduce component count and deploy robust systems across industrial temperature ranges backed by NXP Semiconductors' product documentation.

Request a quote or submit an inquiry for pricing and availability of the MPC8377CVRANGA to begin specifying this processor into your embedded design.

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