MPC8377ECVRAGDA

IC MPU MPC83XX 400MHZ PBGA689
Part Description

PowerPC e300c4s Microprocessor IC MPC83xx 1 Core, 32-Bit 400MHz 689-TEPBGA II (31x31)

Quantity 1,639 Available (as of October 7, 2026)
Product CategoryMicroprocessors
Part SeriesMPC8377
ManufacturerNXP USA Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Co-Processors/DSPSecurity; SEC 3.0Core ProcessorPowerPC e300c4sDevice Package689-TEPBGA II (31x31)
ECCN5A002A1Ethernet10/100/1000Mbps (2)Graphics AccelerationNo
HTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface Mount
Mounting TypeSurface MountNumber of Cores/Bus Width1 Core, 32-BitOperating Temperature-40°C ~ 125°C (TA)
Package / Case689-BBGA Exposed PadRAM ControllersDDR, DDR2REACH ComplianceREACH Unaffected
RoHS ComplianceROHS3 CompliantSATASATA 3Gbps (2)Security FeaturesCryptography, Random Number Generator
Speed400MHzSupplier Device Package689-TEPBGA II (31×31)USBUSB 2.0 + PHY (1)
Voltage – I/O1.8V, 2.5V, 3.3V

Overview of MPC8377ECVRAGDA – PowerPC e300c4s 400 MHz 1‑Core Microprocessor

The MPC8377ECVRAGDA is a single‑core, 32‑bit PowerPC e300c4s microprocessor running at 400 MHz in a 689‑TEPBGA II (31×31) package. Designed as a cost‑effective, low‑power, highly integrated host processor, it targets embedded and industrial applications that require balanced CPU performance and extensive on‑chip connectivity.

Typical use cases include printing and imaging systems, networking and storage appliances, wireless LAN equipment and industrial controllers. The device combines processor core features, memory controller flexibility and multiple high‑speed interfaces to simplify system design and accelerate time‑to‑market.

Key Features

  • Core and On‑Chip Memory PowerPC e300c4s core with on‑chip MMU and 32 KB L1 instruction and 32 KB L1 data caches for predictable single‑core performance at 400 MHz.
  • Memory Controllers Integrated DDR / DDR2 SDRAM memory controller to support common system memory configurations.
  • High‑Speed Ethernet Dual enhanced three‑speed Ethernet interfaces (10/100/1000 Mbps) for robust network connectivity and high throughput.
  • Storage Interfaces Two Serial ATA (SATA) 3 Gbps ports for direct attachment of storage devices and RAID/array controllers.
  • USB Connectivity USB 2.0 controller with PHY (dual‑role capability noted in series documentation) for host/device peripheral support.
  • Security Engine and RNG Optional SEC 3.0 security engine with cryptography and hardware random number generator to accelerate secure communications and data protection.
  • Expansion and I/O 32‑bit local bus and 32‑bit PCI controller plus DUART and other serial interfaces for flexible I/O and expansion options.
  • Package and Temperature 689‑BBGA exposed pad package (689‑TEPBGA II, 31×31) with industrial operating temperature range of −40 °C to 125 °C for deployment in harsh environments.
  • Integration and Power Described in product documentation as a cost‑effective, low‑power, highly integrated processor suitable for space‑ and power‑constrained designs.

Typical Applications

  • Networking & Communications — Switches, line cards, VPN routers and intelligent NICs leveraging dual Gigabit Ethernet interfaces and integrated PCI/local bus for packet processing and I/O aggregation.
  • Storage & NAS — Networked storage appliances and NAS devices using dual SATA 3 Gbps ports and integrated processing for data handling and protocol offload.
  • Printing & Imaging — Main CPU or I/O processor roles in printers and imaging systems where integrated I/O and deterministic processing are required.
  • Wireless LAN & Access Equipment — WLAN controllers and network access servers benefiting from combined Ethernet, USB and peripheral interfaces.
  • Industrial Control — Embedded industrial controllers that require industrial temperature operation, secure communications and flexible memory connectivity.

Unique Advantages

  • Highly integrated solution: Combines CPU core, MMU, caches, memory controllers and multiple high‑speed interfaces to reduce BOM and simplify board design.
  • Robust connectivity: Dual 10/100/1000 Mbps Ethernet ports plus two SATA 3 Gbps ports and USB 2.0 provide a broad set of native interfaces for networking and storage applications.
  • Security‑ready platform: Optional SEC 3.0 engine with cryptography and hardware RNG enables hardware‑accelerated security features for secure networking and storage.
  • Industrial grade operation: −40 °C to 125 °C operating range and exposed‑pad BGA package support deployment in demanding environmental conditions.
  • Memory flexibility: On‑chip DDR/DDR2 controllers allow designers to select common SDRAM options that match performance and cost targets.
  • Compact package for dense designs: 689‑TEPBGA II (31×31) package offers a small footprint while exposing a wide feature set for embedded systems.

Why Choose MPC8377ECVRAGDA?

The MPC8377ECVRAGDA positions itself as a balanced embedded processor combining a PowerPC e300c4s core at 400 MHz with extensive on‑chip peripherals and controllers. Its mix of dual Gigabit Ethernet, dual SATA, USB 2.0, DDR/DDR2 memory support and optional security engine makes it well suited for designs that require integrated connectivity, data handling and secure communications without excessive external components.

Engineers building networking appliances, storage systems, printing and imaging equipment or industrial controllers will find the MPC8377ECVRAGDA delivers a compact, industrial‑temperature capable platform backed by NXP Semiconductors product documentation and a feature set aimed at reducing system complexity and accelerating development.

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