MPC8572EVTAVNE
| Part Description |
PowerPC e500 Microprocessor IC MPC85xx 2 Core, 32-Bit 1.5GHz 1023-FCBGA (33x33) |
|---|---|
| Quantity | 211 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | MPC8572 |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | Signal Processing; SPE, Security; SEC | Core Processor | PowerPC e500 | Device Package | 1023-FCBGA (33x33) | ||
|---|---|---|---|---|---|---|---|
| ECCN | 5A002A1 FRE | Ethernet | 10/100/1000Mbps (4) | Graphics Acceleration | No | ||
| HTS Code | 8542.31.0001 | Moisture Sensitivity Level | N/A | Mounting Method | Surface Mount | ||
| Mounting Type | Surface Mount | Number of Cores/Bus Width | 2 Core, 32-Bit | Operating Temperature | 0°C ~ 105°C (TA) | ||
| Package / Case | 1023-BFBGA, FCBGA | RAM Controllers | DDR2, DDR3 | REACH Compliance | REACH Unknown | ||
| RoHS Compliance | ROHS3 Compliant | Security Features | Cryptography, Random Number Generator | Speed | 1.5GHz | ||
| Supplier Device Package | 1023-FCBGA (33×33) | Voltage – I/O | 1.5V, 1.8V, 2.5V, 3.3V |
Overview of MPC8572EVTAVNE – PowerPC e500 Dual-Core 1.5 GHz Microprocessor
The MPC8572EVTAVNE is a PowerPC e500-based, dual-core 32-bit microprocessor clocked at 1.5 GHz, supplied in a 1023-FCBGA (33×33) package. Designed for embedded applications, it combines high-performance processor cores with on-chip memory management, signal-processing and floating-point acceleration, and a broad set of integrated I/O to address networking and compute-intensive embedded designs.
On-chip integration includes DDR2/DDR3 memory controllers, multi-port Gigabit Ethernet, hardware security primitives and serial interfaces, delivering a compact platform for embedded communications, industrial and infrastructure systems.
Key Features
- Core Architecture: Two 32-bit, Book E-enhanced PowerPC e500 cores running at 1.5 GHz, each with independent execution resources and on-core enhancements for embedded processing.
- L1 Caches & MMU: Each core includes a 32 KB instruction cache and a 32 KB data cache with parity protection; the device supports a memory management unit and 36-bit real addressing for large address spaces.
- Signal & Floating‑Point Acceleration: Integrated Signal Processing Engine (SPE) APU plus embedded vector and scalar single-precision and double-precision floating-point APUs for optimized integer, fractional and floating-point workloads.
- Memory Subsystem: On-chip controllers for DDR2 and DDR3 SDRAM to support high-bandwidth system memory configurations.
- Networking Interfaces: Four 10/100/1000 Mbps Ethernet ports and Enhanced Three‑Speed Ethernet (eTSEC) support for multi-port network applications.
- Security & RNG: Hardware cryptography features and a random number generator to support embedded security functions.
- Peripheral & Serial Interfaces: Integrated DUART and a broad set of serial and high-speed interfaces as described in the device hardware specifications.
- Package & Thermal: 1023-FCBGA (33×33) surface-mount package; operating temperature range 0 °C to 105 °C.
- Compliance: RoHS compliant.
Typical Applications
- Embedded Networking Equipment: Multi-port Gigabit Ethernet and integrated memory controllers make the device suitable for routers, switches and network appliances.
- Communications Infrastructure: Dual e500 cores with SPE and floating-point APUs support protocol processing and packet handling in communications systems.
- Industrial Control Systems: Deterministic processing, integrated interfaces and a wide operating temperature range support control and automation applications.
- Security‑Aware Embedded Systems: On-chip cryptography and random number generation enable secure boot, encryption and trusted subsystems.
Unique Advantages
- Balanced Performance and Integration: Dual 1.5 GHz e500 cores plus on-chip accelerators reduce the need for external compute or co-processor components.
- Rich Memory and I/O Subsystem: DDR2/DDR3 controllers and multiple Gigabit Ethernet ports simplify high-throughput system design.
- On‑Die Acceleration for DSP and Floating Point: SPE and floating-point APUs provide hardware acceleration for signal-processing and numeric workloads without adding external accelerators.
- Security Building Blocks: Integrated cryptographic functions and an RNG supply essential primitives for embedded security features.
- Design‑Friendly Package and Thermal Range: 1023-FCBGA surface-mount package and 0 °C to 105 °C operating range support compact board layouts and industrial temperature environments.
- Standards‑Oriented Connectivity: Multi-speed Ethernet and a broad set of serial/high-speed interfaces enable connectivity to common embedded subsystems and networks.
Why Choose MPC8572EVTAVNE?
The MPC8572EVTAVNE positions itself as a highly integrated embedded processor platform combining dual PowerPC e500 cores, on-chip memory controllers and rich I/O to address networking, communications and industrial applications. Its mix of signal-processing engines, floating-point capabilities and hardware security primitives makes it suitable for designs that require both compute throughput and integrated system functionality.
For engineers and procurement teams seeking a RoHS-compliant, surface-mount solution in a 1023-FCBGA footprint with a 0 °C to 105 °C operating range, the MPC8572EVTAVNE delivers a compact, verifiable foundation for medium- to high-performance embedded designs.
Request a quote or submit an inquiry to receive pricing and availability information for the MPC8572EVTAVNE.

Date Founded: 2006
Headquarters: Eindhoven, North Brabant, Netherlands
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