MPC8572EVTAVNE

IC MPU MPC85XX 1.5GHZ 1023FCBGA
Part Description

PowerPC e500 Microprocessor IC MPC85xx 2 Core, 32-Bit 1.5GHz 1023-FCBGA (33x33)

Quantity 211 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesMPC8572
ManufacturerNXP USA Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Co-Processors/DSPSignal Processing; SPE, Security; SECCore ProcessorPowerPC e500Device Package1023-FCBGA (33x33)
ECCN5A002A1 FREEthernet10/100/1000Mbps (4)Graphics AccelerationNo
HTS Code8542.31.0001Moisture Sensitivity LevelN/AMounting MethodSurface Mount
Mounting TypeSurface MountNumber of Cores/Bus Width2 Core, 32-BitOperating Temperature0°C ~ 105°C (TA)
Package / Case1023-BFBGA, FCBGARAM ControllersDDR2, DDR3REACH ComplianceREACH Unknown
RoHS ComplianceROHS3 CompliantSecurity FeaturesCryptography, Random Number GeneratorSpeed1.5GHz
Supplier Device Package1023-FCBGA (33×33)Voltage – I/O1.5V, 1.8V, 2.5V, 3.3V

Overview of MPC8572EVTAVNE – PowerPC e500 Dual-Core 1.5 GHz Microprocessor

The MPC8572EVTAVNE is a PowerPC e500-based, dual-core 32-bit microprocessor clocked at 1.5 GHz, supplied in a 1023-FCBGA (33×33) package. Designed for embedded applications, it combines high-performance processor cores with on-chip memory management, signal-processing and floating-point acceleration, and a broad set of integrated I/O to address networking and compute-intensive embedded designs.

On-chip integration includes DDR2/DDR3 memory controllers, multi-port Gigabit Ethernet, hardware security primitives and serial interfaces, delivering a compact platform for embedded communications, industrial and infrastructure systems.

Key Features

  • Core Architecture: Two 32-bit, Book E-enhanced PowerPC e500 cores running at 1.5 GHz, each with independent execution resources and on-core enhancements for embedded processing.
  • L1 Caches & MMU: Each core includes a 32 KB instruction cache and a 32 KB data cache with parity protection; the device supports a memory management unit and 36-bit real addressing for large address spaces.
  • Signal & Floating‑Point Acceleration: Integrated Signal Processing Engine (SPE) APU plus embedded vector and scalar single-precision and double-precision floating-point APUs for optimized integer, fractional and floating-point workloads.
  • Memory Subsystem: On-chip controllers for DDR2 and DDR3 SDRAM to support high-bandwidth system memory configurations.
  • Networking Interfaces: Four 10/100/1000 Mbps Ethernet ports and Enhanced Three‑Speed Ethernet (eTSEC) support for multi-port network applications.
  • Security & RNG: Hardware cryptography features and a random number generator to support embedded security functions.
  • Peripheral & Serial Interfaces: Integrated DUART and a broad set of serial and high-speed interfaces as described in the device hardware specifications.
  • Package & Thermal: 1023-FCBGA (33×33) surface-mount package; operating temperature range 0 °C to 105 °C.
  • Compliance: RoHS compliant.

Typical Applications

  • Embedded Networking Equipment: Multi-port Gigabit Ethernet and integrated memory controllers make the device suitable for routers, switches and network appliances.
  • Communications Infrastructure: Dual e500 cores with SPE and floating-point APUs support protocol processing and packet handling in communications systems.
  • Industrial Control Systems: Deterministic processing, integrated interfaces and a wide operating temperature range support control and automation applications.
  • Security‑Aware Embedded Systems: On-chip cryptography and random number generation enable secure boot, encryption and trusted subsystems.

Unique Advantages

  • Balanced Performance and Integration: Dual 1.5 GHz e500 cores plus on-chip accelerators reduce the need for external compute or co-processor components.
  • Rich Memory and I/O Subsystem: DDR2/DDR3 controllers and multiple Gigabit Ethernet ports simplify high-throughput system design.
  • On‑Die Acceleration for DSP and Floating Point: SPE and floating-point APUs provide hardware acceleration for signal-processing and numeric workloads without adding external accelerators.
  • Security Building Blocks: Integrated cryptographic functions and an RNG supply essential primitives for embedded security features.
  • Design‑Friendly Package and Thermal Range: 1023-FCBGA surface-mount package and 0 °C to 105 °C operating range support compact board layouts and industrial temperature environments.
  • Standards‑Oriented Connectivity: Multi-speed Ethernet and a broad set of serial/high-speed interfaces enable connectivity to common embedded subsystems and networks.

Why Choose MPC8572EVTAVNE?

The MPC8572EVTAVNE positions itself as a highly integrated embedded processor platform combining dual PowerPC e500 cores, on-chip memory controllers and rich I/O to address networking, communications and industrial applications. Its mix of signal-processing engines, floating-point capabilities and hardware security primitives makes it suitable for designs that require both compute throughput and integrated system functionality.

For engineers and procurement teams seeking a RoHS-compliant, surface-mount solution in a 1023-FCBGA footprint with a 0 °C to 105 °C operating range, the MPC8572EVTAVNE delivers a compact, verifiable foundation for medium- to high-performance embedded designs.

Request a quote or submit an inquiry to receive pricing and availability information for the MPC8572EVTAVNE.

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