MPC8572EVTATLE

IC MPU MPC85XX 1.2GHZ 1023FCBGA
Part Description

PowerPC e500 Microprocessor IC MPC85xx 2 Core, 32-Bit 1.2GHz 1023-FCBGA (33x33)

Quantity 1,097 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesMPC8572
ManufacturerNXP USA Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Co-Processors/DSPSignal Processing; SPE, Security; SECCore ProcessorPowerPC e500Device Package1023-FCBGA (33x33)
ECCN5A002A1 FREEthernet10/100/1000Mbps (4)Graphics AccelerationNo
HTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface Mount
Mounting TypeSurface MountNumber of Cores/Bus Width2 Core, 32-BitOperating Temperature0°C ~ 105°C (TA)
Package / Case1023-BFBGA, FCBGARAM ControllersDDR2, DDR3REACH ComplianceREACH Unaffected
RoHS ComplianceROHS3 CompliantSecurity FeaturesCryptography, Random Number GeneratorSpeed1.2GHz
Supplier Device Package1023-FCBGA (33×33)Voltage – I/O1.5V, 1.8V, 2.5V, 3.3V

Overview of MPC8572EVTATLE – IC MPU MPC85XX 1.2GHZ 1023FCBGA

The MPC8572EVTATLE is a dual-core PowerPC e500 microprocessor from NXP Semiconductors, featuring two 32-bit cores running at 1.2 GHz in a 1023-FCBGA (33×33) surface-mount package. It is a member of the MPC8572 series and is qualified for consumer applications.

Designed for embedded applications that require integrated connectivity, memory support and on-chip security, the device targets embedded and consumer markets where compute density, hardware security and multi-port Ethernet connectivity are important design drivers.

Key Features

  • Dual PowerPC e500 cores — Two high-performance 32-bit cores operating at 1.2 GHz, enabling parallel processing for multitasking embedded workloads.
  • On-chip caches and MMU — Each core includes a 32 KB L1 instruction cache and 32 KB L1 data cache with parity protection; the processor includes an MMU for real-address and virtual-memory management (datasheet describes 36-bit real addressing and MMU support).
  • Signal and floating-point accelerators — Integrated Signal Processing Engine (SPE) and vector/auxiliary processing instructions, plus single-precision and double-precision floating-point APUs for compute-intensive algorithms.
  • Memory controllers — On-chip controllers for DDR2 and DDR3 SDRAM to support memory-intensive embedded applications.
  • High-speed networking — Four 10/100/1000 Mbps Ethernet interfaces for multi-port Gigabit connectivity in communications-focused designs.
  • High-speed serial interfaces — Device documentation includes support for interfaces such as PCI Express and Serial RapidIO for system I/O and fabric connectivity.
  • Security features — Built-in cryptography accelerators and a random number generator for secure boot, encryption and integrity functions.
  • Peripheral and system interfaces — Includes DUART and a broad set of peripheral and system controllers described in the product documentation.
  • Package and mounting — 1023-FCBGA (33×33) package in a surface-mount form factor suitable for compact, high-density board designs.
  • Operating range and compliance — Operating temperature 0 °C to 105 °C and RoHS compliant; product is consumer-qualified per supplied specifications.

Typical Applications

  • Embedded networking and communications: Multi-port Gigabit Ethernet and high-speed serial interfaces enable routing, switching and communications appliances with integrated connectivity.
  • Secure embedded devices: On-chip cryptography and a hardware random number generator support secure data handling and protected firmware operation.
  • Signal-processing and compute nodes: SPE and floating-point APUs accelerate vector, integer and floating-point workloads for embedded signal processing tasks.
  • Memory-intensive embedded systems: DDR2/DDR3 memory controllers provide the bandwidth and capacity needed for advanced OSs and large application stacks.

Unique Advantages

  • High compute density: Dual 32-bit PowerPC e500 cores at 1.2 GHz deliver parallel processing capability for concurrent embedded tasks.
  • Integrated memory and I/O: On-chip DDR2/DDR3 controllers and multiple high-speed interfaces reduce external components and simplify system design.
  • Multi-port Ethernet connectivity: Four independent 10/100/1000 Mbps Ethernet ports provide native Gigabit networking without external PHY aggregation.
  • Hardware security primitives: Cryptography accelerators plus a random number generator enable on-chip security functions and secure system designs.
  • Compact, production-ready package: 1023-FCBGA (33×33) surface-mount package supports compact, high-density PCB layouts.
  • Documented architecture: Detailed hardware specifications and feature descriptions are provided in the device documentation to assist design and integration.

Why Choose MPC8572EVTATLE?

The MPC8572EVTATLE balances multi-threaded processing, integrated memory support and robust connectivity in a single, consumer-qualified embedded processor. Its dual PowerPC e500 cores, on-chip DDR controllers, multi-port Gigabit Ethernet and hardware security features make it suitable for embedded designs that require consolidated compute, I/O and security capabilities.

Backed by NXP Semiconductors documentation, the MPC8572EVTATLE is appropriate for engineering teams building embedded and consumer applications that demand integrated networking, signal-processing acceleration and on-chip security, while enabling streamlined BOM and compact board layouts.

Request a quote or submit an RFQ to evaluate pricing and availability for the MPC8572EVTATLE.

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