MPC8572EVJAVNE

IC MPU MPC85XX 1.5GHZ 1023FCPBGA
Part Description

PowerPC e500 Microprocessor IC MPC85xx 2 Core, 32-Bit 1.5GHz 1023-FCPBGA (33x33)

Quantity 232 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesMPC8572
ManufacturerNXP USA Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Co-Processors/DSPSignal Processing; SPE, Security; SECCore ProcessorPowerPC e500Device Package1023-FCPBGA (33x33)
ECCN5A002A1Ethernet10/100/1000Mbps (4)Graphics AccelerationNo
HTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface Mount
Mounting TypeSurface MountNumber of Cores/Bus Width2 Core, 32-BitOperating Temperature0°C ~ 105°C (TA)
Package / Case1023-BBGA, FCBGARAM ControllersDDR2, DDR3REACH ComplianceREACH Unaffected
RoHS ComplianceROHS3 CompliantSecurity FeaturesCryptography, Random Number GeneratorSpeed1.5GHz
Supplier Device Package1023-FCPBGA (33×33)Voltage – I/O1.5V, 1.8V, 2.5V, 3.3V

Overview of MPC8572EVJAVNE – IC MPU MPC85XX 1.5GHz 1023-FCPBGA

The MPC8572EVJAVNE is a dual-core PowerPC e500 microprocessor from NXP Semiconductors, delivering 1.5 GHz performance in a 1023‑FCPBGA (33×33) surface-mount package. Designed for embedded applications, the device integrates processing, memory controllers, multi‑port Ethernet and security engines to address compute‑ and network‑centric designs.

With dual 32‑bit cores, on‑chip MMU and a suite of I/O and acceleration blocks, the MPC8572EVJAVNE targets systems that require balanced general‑purpose processing, signal and floating‑point acceleration, and robust connectivity while operating across a 0 °C to 105 °C range.

Key Features

  • Dual PowerPC e500 Cores — Two 32‑bit Book E‑enhanced cores running at 1.5 GHz for deterministic embedded processing.
  • L1 Caches — Each core includes a 32 KB instruction cache and 32 KB data cache with parity protection and cache locking options.
  • Signal and Floating‑Point Acceleration — Built‑in Signal Processing Engine (SPE) plus embedded vector/scalar single‑precision and double‑precision floating‑point APUs for DSP and FP workloads.
  • Memory Subsystem — Integrated DDR2 and DDR3 SDRAM controllers for flexible system memory choices.
  • Multi‑port Ethernet — Four 10/100/1000 Mbps Ethernet ports (eTSEC) for high‑density networking and communication interfaces.
  • Security and Cryptography — On‑chip security features including cryptography engines and a random number generator (SEC) to support secure operations.
  • Peripheral Interfaces — Includes DUART and a broad set of system interfaces described in the hardware specification (PCI Express and Serial RapidIO blocks are part of the device architecture).
  • Package and Mounting — 1023‑FCPBGA (33×33) package, surface mount, RoHS compliant.
  • Operating Temperature — Designed to operate between 0 °C and 105 °C.

Typical Applications

  • Embedded Networking Equipment — Multi‑port Gigabit Ethernet and integrated interfaces support routers, switches and communication appliances requiring on‑chip networking.
  • Embedded Control Systems — Dual cores with SPE and floating‑point units for real‑time control, signal processing and compute‑intensive embedded tasks.
  • Memory‑intensive Systems — DDR2/DDR3 controller integration suits systems that require high bandwidth local memory for buffering and data processing.
  • Secure Embedded Devices — On‑chip cryptography and random number generation provide foundational security for embedded applications.

Unique Advantages

  • High Integration: Dual e500 cores, memory controllers and multi‑port Ethernet are combined on a single device, reducing board level integration effort.
  • Built‑in Acceleration: SPE and floating‑point APUs provide signal and numeric acceleration without requiring external DSPs or accelerators.
  • Comprehensive Connectivity: Four 10/100/1000 Mbps Ethernet ports and on‑chip high‑speed interfaces support complex networking and I/O topologies.
  • Security Primitives Included: Integrated cryptography engines and a random number generator enable secure functions directly on‑chip.
  • Design Flexibility: Support for DDR2 and DDR3 memory gives designers options for cost and performance tradeoffs.
  • Qualified for Embedded Use: Hardware specification and feature set are targeted at embedded applications with an operating range up to 105 °C.

Why Choose MPC8572EVJAVNE?

The MPC8572EVJAVNE positions itself as a highly integrated embedded processor solution combining dual PowerPC e500 cores, on‑chip memory controllers, extensive networking interfaces and hardware security. This combination supports designs that require concurrent general‑purpose processing, signal and floating‑point acceleration, and multi‑port Ethernet connectivity.

It is suitable for engineers and system designers building embedded communication, control and secure processing systems who need a compact, RoHS‑compliant BGA package with a defined operating temperature range and a broad set of on‑chip peripherals documented in the hardware specification.

Request a quote or submit a procurement inquiry today to evaluate the MPC8572EVJAVNE for your next embedded design.

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